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1. 发明专利

DE69934833T8 未知
公开(公告)号：DE69934833T8
公开(公告)日：2008-01-17
申请号：DE69934833
申请日：1999-02-26
申请人： KYOCERA CORP
发明人： KORIYAMA SHINICHI , KITAZAWA KENJI , MINAMIUE HIDEHIRO
IPC分类号： H01Q13/10 , H01Q13/18

2. 发明专利

DE69938271T2 未知
公开(公告)号：DE69938271T2
公开(公告)日：2009-03-19
申请号：DE69938271
申请日：1999-05-28
申请人： KYOCERA CORP
发明人： NAGATA KOICHI , KITAZAWA KENJI , KORIYAMA SHINICHI , KUBO TAKANORI , MINAMIUE HIDEHIRO , ISHIDA MASANOBU , NAKAYAMA AKIRA , SHINO NAOYUKI , MORIOKA SHIGEKI
IPC分类号： H01L23/66 , H01P5/18 , H05K1/00 , H05K1/02 , H05K3/00 , H05K9/00
摘要： A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices in the cavities and are located in the cavities, the internal high-frequency signal transmission lines being electromagnetically coupled to an external high-frequency signal transmission line, and the high-frequency devices in the cavities are connected to each other relying on the electromagnetic coupling through the external line. The high-frequency module enables high-frequency signals to be transmitted among the high-frequency devices with a small loss. The module has a very simple structure, and is cheaply produced, and offers an advantage that it can be easily obtained in a small size.

3. 发明专利

DE69938271D1 未知
公开(公告)号：DE69938271D1
公开(公告)日：2008-04-17
申请号：DE69938271
申请日：1999-05-28
申请人： KYOCERA CORP
发明人： NAGATA KOICHI , KITAZAWA KENJI , KORIYAMA SHINICHI , KUBO TAKANORI , MINAMIUE HIDEHIRO , ISHIDA MASANOBU , NAKAYAMA AKIRA , SHINO NAOYUKI , MORIOKA SHIGEKI
IPC分类号： H01L23/66 , H01P5/18 , H05K1/00 , H05K1/02 , H05K3/00 , H05K9/00
摘要： A high-frequency module in which a plurality of cavities are formed on the surface of a dielectric board, internal high-frequency signal transmission lines are connected to high-frequency devices in the cavities and are located in the cavities, the internal high-frequency signal transmission lines being electromagnetically coupled to an external high-frequency signal transmission line, and the high-frequency devices in the cavities are connected to each other relying on the electromagnetic coupling through the external line. The high-frequency module enables high-frequency signals to be transmitted among the high-frequency devices with a small loss. The module has a very simple structure, and is cheaply produced, and offers an advantage that it can be easily obtained in a small size.

4. 发明专利

DE60035553D1 未知
公开(公告)号：DE60035553D1
公开(公告)日：2007-08-30
申请号：DE60035553
申请日：2000-08-10
申请人： KYOCERA CORP
发明人： KORIYAMA SHINICHI , KITAZAWA KENJI , MINAMIUE HIDEHIRO
IPC分类号： H05K1/02 , H01L23/66 , H05K3/34
摘要： A high frequency wiring board having a high frequency transmission line (X) having a signal conductor line (2, 14, 19, 26) formed on the surface of a dielectric board (1, 8, 18, 25) and a grounding layer (3, 12, 20, 28) formed inside or on the reverse surface of the dielectric board (1, 8, 18, 25) parallel to the signal conductor line (2, 14, 19, 26), and a connecting terminal portion (Y) provided at a terminal end of the high frequency transmission line (X) and including connecting grounding conductors (4, 15, 21, 27) formed with spacing on both sides of the signal conductor line (2. 14, 19, 26) and through conductors (5, 16, 22, 29) for connecting the connecting grounding conductors (4, 15, 21, 27) and the grounding layer (3, 12, 20, 28). The distance between the through conductors (5, 16, 22, 29) and an end side surface of the dielectric board (1, 8, 18, 25) is not more than 0.3 times the signal wavelength, in the dielectric board (1, 8, 18, 25), of a high frequency signal.

5. 发明专利

DE69934833D1 未知
公开(公告)号：DE69934833D1
公开(公告)日：2007-03-08
申请号：DE69934833
申请日：1999-02-26
申请人： KYOCERA CORP
发明人： KORIYAMA SHINICHI , KITAZAWA KENJI , MINAMIUE HIDEHIRO
IPC分类号： H01Q13/10 , H01Q13/18

6. 发明专利

DE60035553T2 未知
公开(公告)号：DE60035553T2
公开(公告)日：2008-04-17
申请号：DE60035553
申请日：2000-08-10
申请人： KYOCERA CORP
发明人： KORIYAMA SHINICHI , KITAZAWA KENJI , MINAMIUE HIDEHIRO
IPC分类号： H05K1/02 , H01L23/66 , H05K3/34
摘要： A high frequency wiring board having a high frequency transmission line (X) having a signal conductor line (2, 14, 19, 26) formed on the surface of a dielectric board (1, 8, 18, 25) and a grounding layer (3, 12, 20, 28) formed inside or on the reverse surface of the dielectric board (1, 8, 18, 25) parallel to the signal conductor line (2, 14, 19, 26), and a connecting terminal portion (Y) provided at a terminal end of the high frequency transmission line (X) and including connecting grounding conductors (4, 15, 21, 27) formed with spacing on both sides of the signal conductor line (2. 14, 19, 26) and through conductors (5, 16, 22, 29) for connecting the connecting grounding conductors (4, 15, 21, 27) and the grounding layer (3, 12, 20, 28). The distance between the through conductors (5, 16, 22, 29) and an end side surface of the dielectric board (1, 8, 18, 25) is not more than 0.3 times the signal wavelength, in the dielectric board (1, 8, 18, 25), of a high frequency signal.

7. 发明专利

DE69934833T2 未知
公开(公告)号：DE69934833T2
公开(公告)日：2007-10-18
申请号：DE69934833
申请日：1999-02-26
申请人： KYOCERA CORP
发明人： KORIYAMA SHINICHI , KITAZAWA KENJI , MINAMIUE HIDEHIRO
IPC分类号： H01Q13/10 , H01Q13/18

8. 发明专利

DE69933619T2 未知
公开(公告)号：DE69933619T2
公开(公告)日：2007-08-23
申请号：DE69933619
申请日：1999-07-30
申请人： KYOCERA CORP
发明人： SAWA YOSHINOBU , KORIYAMA SHINICHI , KITAZAWA KENJI , MINAMIUE HIDEHIRO
IPC分类号： H01P1/04 , H01L23/66 , H05K1/02 , H05K1/14
摘要： There is described a high-frequency module comprising a high-frequency device-mounting package and an external circuit board characterized in that said high-frequency device-mounting package (A) includes a dielectric substrate (1) having a first grounding layer (4) contained therein, said dielectric substrate (1) mounting a high-frequency device (2) on one surface thereof and having, formed on one surface thereof, first high-frequency signal transmission lines (3) connected to said high-frequency device (2), and having, formed on the other surface thereof, second high-frequency signal transmission lines (7) coupled to said first high-frequency signal transmission lines (3), said external circuit board (B) is constituted by a dielectric board (20) having third high-frequency signal transmission lines (25) and a second grounding layer (26), said third high-frequency signal transmission lines (25) being formed on one surface of said dielectric board (20), and said second grounding layer (26) being formed on the other surface of said dielectric board (20) or inside thereof; and said high-frequency device-mounting package (A) and said external circuit board (B) are arranged side by side, and the second high-frequency signal transmission lines (7) of the high-frequency device-mounting package (A) are electrically connected to the third high-frequency signal transmission lines (25) of the external circuit board (B) through linear electrically conducting members (31). The patterns of the second high-frequency signal transmission lines on the side of the high-frequency device-mounting package can be easily aligned with the patterns of the third high-frequency signal transmission lines on the side of the external circuit board, effectively reducing the transmission loss at the junction portions of the lines.

9. 发明专利

DE69933619D1 未知
公开(公告)号：DE69933619D1
公开(公告)日：2006-11-30
申请号：DE69933619
申请日：1999-07-30
申请人： KYOCERA CORP
发明人： SAWA YOSHINOBU , KORIYAMA SHINICHI , KITAZAWA KENJI , MINAMIUE HIDEHIRO
IPC分类号： H01P1/04 , H01L23/66 , H05K1/02 , H05K1/14
摘要： There is described a high-frequency module comprising a high-frequency device-mounting package and an external circuit board characterized in that said high-frequency device-mounting package (A) includes a dielectric substrate (1) having a first grounding layer (4) contained therein, said dielectric substrate (1) mounting a high-frequency device (2) on one surface thereof and having, formed on one surface thereof, first high-frequency signal transmission lines (3) connected to said high-frequency device (2), and having, formed on the other surface thereof, second high-frequency signal transmission lines (7) coupled to said first high-frequency signal transmission lines (3), said external circuit board (B) is constituted by a dielectric board (20) having third high-frequency signal transmission lines (25) and a second grounding layer (26), said third high-frequency signal transmission lines (25) being formed on one surface of said dielectric board (20), and said second grounding layer (26) being formed on the other surface of said dielectric board (20) or inside thereof; and said high-frequency device-mounting package (A) and said external circuit board (B) are arranged side by side, and the second high-frequency signal transmission lines (7) of the high-frequency device-mounting package (A) are electrically connected to the third high-frequency signal transmission lines (25) of the external circuit board (B) through linear electrically conducting members (31). The patterns of the second high-frequency signal transmission lines on the side of the high-frequency device-mounting package can be easily aligned with the patterns of the third high-frequency signal transmission lines on the side of the external circuit board, effectively reducing the transmission loss at the junction portions of the lines.

10. 发明公开

EP2772473A4 CERAMIC SINTERED COMPACT, HIGH-TEMPERATURE MEMBER, AND ELECTROCHEMICAL ELEMENT 有权
标题翻译：陶瓷INTERPRESS凌，耐高温元件和电化学元件
公开(公告)号：EP2772473A4
公开(公告)日：2015-04-29
申请号：EP12844084
申请日：2012-10-24
申请人： KYOCERA CORP
发明人： FUJIMOTO TETSURO , HARA AKIHIRO , MINAMIUE HIDEHIRO
IPC分类号： C04B35/50 , C04B35/00 , C04B35/46 , H01B1/08 , H01M8/02 , H01M8/12
CPC分类号： C04B35/01 , C04B35/462 , C04B2235/3225 , C04B2235/3232 , C04B2235/3234 , C04B2235/3275 , C04B2235/5445 , C04B2235/6582 , C04B2235/6584 , C04B2235/664 , C04B2235/72 , C04B2235/80 , C04B2235/9607 , H01B1/08 , H01M8/1213 , H01M8/1246 , H01M2300/0074 , Y02E60/525 , Y02P70/56
摘要： [Object] To provide a ceramic sintered body, a high-temperature-use member, and an electrochemical device that contain a small amount of rare-earth element. [Solution] A ceramic sintered body includes 95% by mass or more of a component having a composition represented by Y x Ti y Ni z O 3±´ using molar ratios, in which 0

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