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    • 4. 发明申请
    • ACTIVE MATRIX ELECTROLUMINESCENT DISPLAY DEVICES, AND THEIR MANUFACTURE
    • 主动矩阵电致发光显示器件及其制造
    • WO2003079442A1
    • 2003-09-25
    • PCT/IB2003/000999
    • 2003-03-19
    • KONINKLIJKE PHILIPS ELECTRONICS N.V.HECTOR, Jason, R.YOUNG, Nigel, D.FISH, David, A.CHILDS, Mark, J.
    • HECTOR, Jason, R.YOUNG, Nigel, D.FISH, David, A.CHILDS, Mark, J.
    • H01L27/00
    • H01L27/3276H01L27/3246
    • Physical barriers (210) are present between neighbouring pixels (200) on a circuit substrate (100) of an active-matrix electroluminescent display device, particularly with LEDs (25) of organic semiconductor materials. The invention forms these barriers (210) with metal or other electrically-conductive material (240), that is insulated (40) from the LEDs but connected to the circuitry within the substrate (100). This conductive barrier material (240) backs-up or replaces at least a part of the drive supply line (140,240) to which the LEDs are connected by a drive element T1. This transfers the problem of line resistance and associated voltage drop from within the circuit substrate (100), where it is severely constrained, to the much freer environment of the pixel barriers (210) on the substrate (100) where the conductive barrier material (240) can provide much lower resistance. Very large displays can be made with low voltage drops along this composite drive supply line (140,240). Furthermore, the structure can be optimised to form a smoothing capacitor (Cs) between this drive supply line (140,240) with its conductive barrier material (240) and the further supply line (230) of the LED upper electrodes (23) extending on an insulating coating (40) over the top of the conductive barrier material (240).
    • 物理屏障(210)存在于有源矩阵电致发光显示装置的电路基板(100)上的相邻像素(200)之间,特别是有机半导体材料的LED(25)。 本发明用金属或其它导电材料(240)形成这些障碍物(210),其与LED绝缘(40),但是连接到衬底(100)内的电路。 该导电阻挡材料(240)备用或替代由驱动元件T1连接到LED的驱动电源线(140,240)的至少一部分。 这将电路基板(100)内的线电阻和相关电压降的问题转移到衬底(100)上的像素势垒(210)的更自由的环境,其中导电阻挡材料(100) 240)可以提供低得多的电阻。 这种复合驱动电源线(140,240)可以通过低压降制造非常大的显示器。 此外,该结构可以被优化以在该驱动电源线(140,240)与其导电阻挡材料(240)和LED上电极(23)的另一供电线(230)之间形成平滑电容器(Cs) 绝缘涂层(40)在导电阻挡材料(240)的顶部之上。