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    • 1. 发明专利
    • Electrostatic chuck and manufacture thereof
    • 静电卡及其制造
    • JPH11274281A
    • 1999-10-08
    • JP7978898
    • 1998-03-26
    • Kobe Steel LtdShinko Kobelco Tool Kk株式会社神戸製鋼所神鋼コベルコツール株式会社
    • KANAMARU MORIYOSHISUGIYAMA NARIMASA
    • B23Q3/15H01L21/68H01L21/683H02N13/00
    • PROBLEM TO BE SOLVED: To provide a method of manufacturing an electrostatic chuck which is superior in flatness of a chucking face, can stably and accurately vacuum- chuck a semiconductor wafer, etc., and not contaminating the semiconductor wafer with particles, etc. SOLUTION: In a method of manufacturing an electrostatic chuck whereby another surface of an electrostatic chuck part C1 having a plain electrode 3 at least one surface of which is covered with an insulator 3 having a vacuum chucking face 5 at the surface is pressed and bonded through a bond layer 7 to a base board 6 of an apparatus, the electrostatic chuck part C1 is made such that both surfaces are previously machined to a specified thickness, the bond face of the base board 6 is machined into a slightly concave recessed shape and pressed and bonded to the base board 6 of the apparatus.
    • 要解决的问题:为了提供一种制造具有优良的卡盘平面度的静电卡盘的方法,能够稳定且精确地真空夹持半导体晶片等,并且不会使颗粒等污染半导体晶片。解决方案 :在静电卡盘的制造方法中,将具有平面电极3的静电卡盘部C1的其表面的至少一面被表面上具有真空吸附面5的绝缘体3覆盖的另一表面压接并通过 接合层7到设备的基板6,静电吸盘部分C1被制成使得两个表面预先被加工到一定厚度,基板6的接合面被加工成稍凹的凹形并被压制 结合到设备的基板6上。