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1. 发明申请

WO2009140403A2 SYSTEMS AND METHODS FOR DETECTING DEFECTS ON A WAFER AND GENERATING INSPECTION RESULTS FOR THE WAFER 审中-公开
标题翻译：用于检测波形缺陷和产生检测结果的系统和方法
公开(公告)号：WO2009140403A2
公开(公告)日：2009-11-19
申请号：PCT/US2009/043814
申请日：2009-05-13
申请人： KLA-TENCOR CORPORATION , KULKARNI, Ashok , BHATTACHARYYA, Santosh
发明人： KULKARNI, Ashok , BHATTACHARYYA, Santosh
IPC分类号： H01L21/66
CPC分类号： G05B19/41875 , G05B2219/37224 , G05B2219/45031 , H01L22/12 , H01L22/20 , H01L2924/0002 , Y02P90/22 , H01L2924/00
摘要： Systems and methods for detecting defects on a wafer and generating inspection results for the wafer are provided. One method includes detecting defects on a wafer by comparing output generated by scanning of the wafer performed by an inspection system to one or more defect detection thresholds. The method also includes sampling outliers in the output by selecting the output having the highest values from bins defined based on one or more predetermined criteria. In addition, the method includes selecting a portion of the sampled outliers based on wafer-level analysis of the sampled outliers. The method further includes generating inspection results for the wafer by combining information about the selected portion of the sampled outliers with information about the defects detected using the one or more defect detection thresholds.
摘要翻译：提供了用于检测晶片上的缺陷并产生晶片的检查结果的系统和方法。一种方法包括通过将由检查系统执行的晶片的扫描产生的输出与一个或多个缺陷检测阈值进行比较来检测晶片上的缺陷。该方法还包括通过从基于一个或多个预定标准定义的箱中选择具有最高值的输出来对输出中的异常值进行采样。此外，该方法包括基于采样异常值的晶片级分析来选择一部分采样异常值。该方法还包括通过将关于所选择的采样异常值的部分的信息与关于使用一个或多个缺陷检测阈值检测到的缺陷的信息组合来产生晶片的检查结果。

2. 发明申请

WO2009039486A2 SYSTEMS AND METHODS FOR CREATING PERSISTENT DATA FOR A WAFER AND FOR USING PERSISTENT DATA FOR INSPECTION-RELATED FUNCTIONS 审中-公开
标题翻译：用于创建WAFER的持续数据并使用用于检查相关功能的数据的系统和方法
公开(公告)号：WO2009039486A2
公开(公告)日：2009-03-26
申请号：PCT/US2008/077203
申请日：2008-09-22
申请人： KLA-TENCOR CORPORATION , BHASKAR, Kris , BHASKAR, Chetana , KULKARNI, Ashok , ROSENGAUS, Eliezer , CAMPOCHIARO, Cecelia , MAHER, Chris , DUFFY, Brian , KHULLAR, Aneesh , KOHLI, Alpa , BALASUBRAMANIAN, Lalita , BHATTACHARYYA, Santosh , MAHADEVAN, Mohan
发明人： BHASKAR, Kris , BHASKAR, Chetana , KULKARNI, Ashok , ROSENGAUS, Eliezer , CAMPOCHIARO, Cecelia , MAHER, Chris , DUFFY, Brian , KHULLAR, Aneesh , KOHLI, Alpa , BALASUBRAMANIAN, Lalita , BHATTACHARYYA, Santosh , MAHADEVAN, Mohan
IPC分类号： H01L21/66
CPC分类号： G06T7/001 , G06T1/20 , G06T2207/30148
摘要： Various systems and methods for creating persistent data for a wafer and using persistent data for inspection-related functions are provided. One system includes a set of processor nodes coupled to a detector of an inspection system. Each of the processor nodes is configured to receive a portion of image data generated by the detector during scanning of a wafer. The system also includes an array of storage media separately coupled to each of the processor nodes. The processor nodes are configured to send all of the image data or a selected portion of the image data received by the processor nodes to the arrays of storage media such that all of the image data or the selected portion of the image data generated by the detector during the scanning of the wafer is stored in the arrays of the storage media.
摘要翻译：提供了用于创建晶片的持久数据并使用持久数据进行检查相关功能的各种系统和方法。一个系统包括耦合到检查系统的检测器的一组处理器节点。每个处理器节点被配置为在扫描晶片期间接收由检测器产生的图像数据的一部分。该系统还包括分开耦合到每个处理器节点的存储介质阵列。处理器节点被配置为将由处理器节点接收的图像数据的所有图像数据或选定部分发送到存储介质阵列，使得由检测器生成的图像数据或图像数据的所选部分在扫描晶片期间存储在存储介质的阵列中。

3. 发明申请

WO2013040063A2 DETERMINING DESIGN COORDINATES FOR WAFER DEFECTS 审中-公开
标题翻译：确定晶圆缺陷的设计坐标
公开(公告)号：WO2013040063A2
公开(公告)日：2013-03-21
申请号：PCT/US2012/054904
申请日：2012-09-12
申请人： KLA-TENCOR CORPORATION , CHANG, Ellis , VAN RIET, Michael , PARK, Allen , ZAFAR, Khurram , BHATTACHARYYA, Santosh
发明人： CHANG, Ellis , VAN RIET, Michael , PARK, Allen , ZAFAR, Khurram , BHATTACHARYYA, Santosh
IPC分类号： H01L21/66
CPC分类号： G06T7/001 , G06T7/74 , G06T2207/30148
摘要： Methods and systems for determining design coordinates for defects detected on a wafer are provided. One method includes aligning a design for a wafer to defect review tool images for defects detected in multiple swaths on the wafer by an inspection tool, determining a position of each of the defects in design coordinates based on results of the aligning, separately determining a defect position offset for each of the multiple swaths based on the swath in which each of the defects was detected (swath correction factor), the design coordinates for each of the defects, and a position for each of the defects determined by the inspection tool, and determining design coordinates for the other defects detected in the multiple swaths by the inspection tool by applying the appropriate swath correction factor to those defects.
摘要翻译：提供了用于确定在晶片上检测到的缺陷的设计坐标的方法和系统。一种方法包括：通过检查工具将晶片的设计与晶片上的多个条带中检测到的缺陷的缺陷评论工具图像对齐，基于对齐的结果确定设计坐标中每个缺陷的位置，分别确定缺陷基于检测到每个缺陷的条带（条带校正因子），每个缺陷的设计坐标以及由检查工具确定的每个缺陷的位置，确定多个条带中的每个条带的位置偏移;以及通过对这些缺陷应用合适的刈幅校正因子来确定检查工具在多个刈幅中检测到的其他缺陷的设计坐标。

4. 发明申请

WO2009015084A2 METHODS FOR GENERATING A STANDARD REFERENCE DIE FOR USE IN A DIE TO STANDARD REFERENCE DIE INSPECTION AND METHODS FOR INSPECTING A WAFER 审中-公开
标题翻译：用于生成标准参考模型的标准参考模型的方法和标准参考模型检查方法以及用于检查波形的方法
公开(公告)号：WO2009015084A2
公开(公告)日：2009-01-29
申请号：PCT/US2008/070647
申请日：2008-07-21
申请人： KLA-TENCOR CORPORATION , BHASKAR, Kris , MCCORD, Mark , BHATTACHARYYA, Santosh , LIANG, Ardis , WALLINGFORD, Richard , ALTENDORFER, Hubert , MAAYAH, Kais
发明人： BHASKAR, Kris , MCCORD, Mark , BHATTACHARYYA, Santosh , LIANG, Ardis , WALLINGFORD, Richard , ALTENDORFER, Hubert , MAAYAH, Kais
IPC分类号： G03F7/20
CPC分类号： G03F7/7065 , G01N21/93 , G01N21/95607 , G03F1/84 , G06T7/001 , G06T2207/30148
摘要： Methods for generating a standard reference die for use in a die to standard reference die inspection and methods for inspecting a wafer are provided. One computer-implemented method for generating a standard reference die for use in a die to standard reference die inspection includes acquiring output of an inspection system for a centrally located die on a wafer and one or more dies located on the wafer. The method also includes combining the output for the centrally located die and the one or more dies based on within die positions of the output. In addition, the method includes generating the standard reference die based on results of the combining step.
摘要翻译：提供了用于生产用于模具的标准参考模具用于标准参考模具检验的方法和用于检查晶片的方法。一种计算机实现的用于生产用于模具中的标准参考模具用于标准参考模具检查的方法包括获取用于晶片上的位于中心的管芯和位于晶片上的一个或多个管芯的检查系统的输出。该方法还包括基于输出的管芯位置组合用于位于中心的管芯和一个或多个管芯的输出。此外，该方法包括基于组合步骤的结果生成标准参考管芯。

5. 发明申请

WO2018102596A3 DEFECT DISCOVERY AND RECIPE OPTIMIZATION FOR INSPECTION OF THREE-DIMENSIONAL SEMICONDUCTOR STRUCTURES 审中-公开
公开(公告)号：WO2018102596A3
公开(公告)日：2018-06-07
申请号：PCT/US2017/064040
申请日：2017-11-30
申请人： KLA-TENCOR CORPORATION
发明人： BHATTACHARYYA, Santosh , SHARMA, Devashish , MAHER, Christopher , HUA, Bo , MEASOR, Philip , DANEN, Robert
IPC分类号： G01N21/95 , G01N21/88 , G01N21/01
摘要： Methods and systems for discovery of defects of interest (DOI) buried within three dimensional semiconductor structures and recipe optimization are described herein. The volume of a semiconductor wafer subject to defect discovery and verification is reduced by storing images associated with a subset of the total depth of the semiconductor structures under measurement. Image patches associated with defect locations at one or more focus planes or focus ranges are recorded. The number of optical modes under consideration is reduced based on any of a comparison of one or more measured wafer level defect signatures and one or more expected wafer level defect signatures, measured defect signal to noise ratio, and defects verified without de-processing. Furthermore, verified defects and recorded images are employed to train a nuisance filter and optimize the measurement recipe. The trained nuisance filter is applied to defect images to select the optimal optical mode for production.

6. 发明申请

WO2018089459A1 HIGH SENSITIVITY REPEATER DEFECT DETECTION 审中-公开
标题翻译：高灵敏度重复性缺陷检测
公开(公告)号：WO2018089459A1
公开(公告)日：2018-05-17
申请号：PCT/US2017/060589
申请日：2017-11-08
申请人： KLA-TENCOR CORPORATION
发明人： BRAUER, Bjorn , BHATTACHARYYA, Santosh , SHIFRIN, Eugene , LEE, Hucheng , MURRAY, Benjamin , MATHEW, Ashok , BHASKAR, Chetana , GAO, Lisheng
IPC分类号： G01N21/95 , G01N21/88
摘要： Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.
摘要翻译：提供了用于检测掩模版上的缺陷的系统和方法。一个系统包括计算机子系统，该计算机子系统包括一个或多个图像处理部件，该图像处理部件采集由晶片的检查子系统产生的图像;主用户接口部件，向用户提供为晶片和标线器产生的信息，用户以及提供一个或多个图像处理组件与主用户界面之间的接口的接口组件。与当前使用的系统不同，一个或多个图像处理组件被配置用于通过将中继器缺陷检测算法应用于由一个或多个图像处理组件获取的图像来执行中继器缺陷检测，并且中继器缺陷检测算法被配置为检测缺陷在晶片上使用热门阈值，并找出中继器缺陷的缺陷。

7. 发明申请

WO2007111696A2 METHODS, DEFECT REVIEW TOOLS, AND SYSTEMS FOR LOCATING A DEFECT IN A DEFECT REVIEW PROCESS 审中-公开
标题翻译：方法，缺陷审查工具的缺陷评估工具和系统
公开(公告)号：WO2007111696A2
公开(公告)日：2007-10-04
申请号：PCT/US2006/060701
申请日：2006-11-09
申请人： KLA-TENCOR TECHNOLOGIES CORPORATION , CHEN, Da , FOUQUET, Christophe , BANERJEE, Saibal , BHATTACHARYYA, Santosh , WANG, Joseph , YAO, Lian , VAN RIET, Mike , GERMANENKO, Igor
发明人： CHEN, Da , FOUQUET, Christophe , BANERJEE, Saibal , BHATTACHARYYA, Santosh , WANG, Joseph , YAO, Lian , VAN RIET, Mike , GERMANENKO, Igor
IPC分类号： G06T7/40
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N21/95607 , G06T2207/30148
摘要： Methods, defect review tools, and systems for locating a defect in a defect review process are provided. One method includes acquiring one or more images and data from an inspection tool. The one or more images illustrate an area on a specimen in which a defect to be reviewed is located. The data indicates a position and features of the defect within the area. The method also includes acquiring one or more additional images of the specimen proximate the position of the defect indicated in the data using an imaging subsystem of a defect review tool. In addition, the method includes identifying a portion of the one or more additional images that corresponds to the one or more images. The method further includes determining a position of the defect within the portion of the one or more additional images using the data.
摘要翻译：提供了方法，缺陷评估工具和用于在缺陷评估过程中定位缺陷的系统。一种方法包括从检查工具获取一个或多个图像和数据。一个或多个图像示出了待检查缺陷所在的样本上的区域。数据表示该区域内缺陷的位置和特征。该方法还包括使用缺陷评估工具的成像子系统获取在数据中指示的缺陷的位置附近的样本的一个或多个附加图像。此外，该方法包括识别对应于一个或多个图像的一个或多个附加图像的一部分。所述方法还包括使用所述数据确定所述一个或多个附加图像的所述部分内的所述缺陷的位置。

8. 发明申请

WO2016149690A1 SUB-PIXEL ALIGNMENT OF INSPECTION TO DESIGN 审中-公开
标题翻译：子像素对齐设计
公开(公告)号：WO2016149690A1
公开(公告)日：2016-09-22
申请号：PCT/US2016/023318
申请日：2016-03-19
申请人： KLA-TENCOR CORPORATION
发明人： BHATTACHARYYA, Santosh , KUMAR, Pavan , GAO, Lisheng
IPC分类号： H01L21/66
CPC分类号： G06T7/33 , G06T2207/10061 , G06T2207/30148
摘要： Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided, in general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output, in addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.
摘要翻译：提供了用于确定由检查子系统在设计数据空间中产生的输出位置的方法和系统，通常，这里所描述的一些实施例被配置用于将生成的样本的检查子系统输出基本上准确地对准样本的设计，在检查子系统输出中的设计，此外，一些实施例被配置用于生成和/或使用可以在同一层的多个样本上共享的对准目标和用于将检测子系统输出生成用于样本的设计规则与设计为标本。

9. 发明申请

WO2017210354A1 SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT FOR AUTOMATICALLY GENERATING A WAFER IMAGE TO DESIGN COORDINATE MAPPING 审中-公开
标题翻译：用于自动生成晶片图像以设计坐标映射的系统，方法和计算机程序产品
公开(公告)号：WO2017210354A1
公开(公告)日：2017-12-07
申请号：PCT/US2017/035300
申请日：2017-05-31
申请人： KLA-TENCOR CORPORATION
发明人： BHATTACHARYYA, Santosh
IPC分类号： G06F17/50
CPC分类号： G06T7/0006 , G06T7/001 , G06T7/33 , G06T2207/10004 , G06T2207/20101 , G06T2207/30148
摘要： A system, method, and computer program product are provided for automatically generating a wafer image to design coordinate mapping. In use, a design of a wafer is received by a computer processor. In addition, an image of a wafer fabricated from the design is received by the computer processor. Further, a coordinate mapping between the design and the image is automatically generated by the computer processor.
摘要翻译：提供了一种用于自动生成晶片图像以设计坐标映射的系统，方法和计算机程序产品。在使用中，晶片的设计由计算机处理器接收。另外，计算机处理器接收由该设计制造的晶片的图像。此外，设计和图像之间的坐标映射是由计算机处理器自动生成的。

10. 发明申请

WO2017123888A1 IMPROVING DEFECT SENSITIVITY OF SEMICONDUCTOR WAFER INSPECTORS USING DESIGN DATA WITH WAFER IMAGE DATA 审中-公开
标题翻译：用晶圆图像数据设计数据提高半导体晶圆检测器的缺陷灵敏度
公开(公告)号：WO2017123888A1
公开(公告)日：2017-07-20
申请号：PCT/US2017/013362
申请日：2017-01-13
申请人： KLA-TENCOR CORPORATION
发明人： BRAUER, Bjorn , BHATTACHARYYA, Santosh , BANERJEE, Saibal , KULKARNI, Ashok V.
IPC分类号： H01L21/66 , H01L21/67
CPC分类号： G06T7/0006 , G06T7/001 , G06T2207/10061 , G06T2207/30148
摘要： Criticality of a detected defect can be determined based on context codes. The context codes can be generated for a region, each of which may be part of a die. Noise levels can be used to group context codes. The context codes can be used to automatically classify a range of design contexts present on a die without needing certain information a priori .
摘要翻译：根据上下文代码可以确定检测到的缺陷的严重性。上下文代码可以为一个区域生成，每个区域都可以是一个die的一部分。可以使用噪声级别对上下文代码进行分组。上下文代码可用于自动分类出现在芯片上的一系列设计上下文，而不需要先验信息。

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