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1. 发明申请

WO2014164935A1 ENHANCED INSPECTION AND METROLOGY TECHNIQUES AND SYSTEMS USING BRIGHT-FIELD DIFFERENTIAL INTERFERENCE CONTRAST 审中-公开
标题翻译：使用亮度差分干扰对比的增强检测和方法技术和系统
公开(公告)号：WO2014164935A1
公开(公告)日：2014-10-09
申请号：PCT/US2014/023824
申请日：2014-03-11
申请人： KLA-TENCOR CORPORATION
发明人： SALEHPOUR, Ali , SINHA, Jaydeep K. , HALLER, Kurt , VUKKADALA, Pradeep , VAEZ-IRAVANI, Mehdi , KREN, George , ZHANG, Jiayao
IPC分类号： H01L21/66
CPC分类号： G01B11/303 , G01B11/306 , G01B2210/56
摘要： A method of providing high accuracy inspection or metrology in a bright-field differential interference contrast (BF-DIC) system is described. This method can include creating first and second beams from a first light beam. The first and second beams have round cross-sections, and form first partially overlapping scanning spots radially displaced on a substrate. Third and fourth beams are created from the first light beam or a second light beam. The third beam and the fourth beam have elliptical cross-sections, and form second partially overlapping scanning spots tangentially displaced on the substrate. At least one portion of the substrate can be scanned using the first and second partially overlapping scanning spots as the substrate is rotated. Radial and tangential slopes can be determined using measurements obtained from the scanning using the first and second partially overlapping scanning spots. The radial and tangential slopes can be used to determine wafer shape or any localized topography feature.
摘要翻译：描述了在亮场差分干涉对比（BF-DIC）系统中提供高精度检测或计量的方法。该方法可以包括从第一光束产生第一和第二光束。第一和第二光束具有圆形横截面，并形成在衬底上径向位移的第一部分重叠的扫描点。从第一光束或第二光束产生第三和第四光束。第三光束和第四光束具有椭圆形截面，并形成在衬底上切向位移的第二部分重叠的扫描点。当衬底旋转时，可以使用第一和第二部分重叠的扫描点来扫描衬底的至少一部分。可以使用从使用第一和第二部分重叠的扫描点的扫描获得的测量来确定径向和切向斜率。径向和切向斜率可用于确定晶片形状或任何局部地形特征。

2. 发明申请

WO2013025376A1 LARGE PARTICLE DETECTION FOR MULTI-SPOT SURFACE SCANNING INSPECTION SYSTEMS 审中-公开
标题翻译：用于多点表面扫描检测系统的大颗粒检测
公开(公告)号：WO2013025376A1
公开(公告)日：2013-02-21
申请号：PCT/US2012/049541
申请日：2012-08-03
申请人： KLA-TENCOR CORPORATION , REICH, Juergen , AMSDEN, Charles , ZHANG, Jiayao , WOLTERS, Christian
发明人： REICH, Juergen , AMSDEN, Charles , ZHANG, Jiayao , WOLTERS, Christian
IPC分类号： H01L21/66
CPC分类号： G01N21/9501 , G01N21/94 , G01N2021/555 , G01N2021/8835 , G01N2021/8845 , G01N2201/103 , H01L22/12
摘要： The illumination power density of a multi-spot inspection system is adjusted in response to detecting a large particle in the inspection path of an array of primary illumination spots. At least one low power, secondary illumination spot is located in the inspection path of an array of relatively high power primary illumination spots. Light scattered from the secondary illumination spot is collected and imaged onto one or more detectors without overheating the particle and damaging the wafer. Various embodiments and methods are presented to distinguish light scattered from secondary illumination spots. In response to determining the presence of a large particle in the inspection path of a primary illumination spot, a command is transmitted to an illumination power density attenuator to reduce the illumination power density of the primary illumination spot to a safe level before the primary illumination spot reaches the large particle.
摘要翻译：响应于检测主照明点阵列的检查路径中的大颗粒，调整多点检查系统的照明功率密度。至少一个低功率次级照明点位于相对较高功率的初级照明点的阵列的检查路径中。从二次照明点散射的光被收集并成像到一个或多个检测器上，而不会使颗粒过热并损坏晶片。呈现各种实施例和方法以区分从二次照明点散射的光。响应于确定主照明点的检查路径中的大颗粒的存在，将命令发送到照明功率密度衰减器，以将主照明点的照明功率密度降低到初级照明点之前的安全水平到达大颗粒。

3. 发明公开

EP2745312A1 LARGE PARTICLE DETECTION FOR MULTI-SPOT SURFACE SCANNING INSPECTION SYSTEMS 审中-公开
标题翻译：大颗粒的曲面多点抽样检验系统PROOF
公开(公告)号：EP2745312A1
公开(公告)日：2014-06-25
申请号：EP12823532.2
申请日：2012-08-03
申请人： Kla-Tencor Corporation
发明人： REICH, Juergen , AMSDEN, Charles , ZHANG, Jiayao , WOLTERS, Christian
IPC分类号： H01L21/66
CPC分类号： G01N21/9501 , G01N21/94 , G01N2021/555 , G01N2021/8835 , G01N2021/8845 , G01N2201/103 , H01L22/12
摘要： The illumination power density of a multi-spot inspection system is adjusted in response to detecting a large particle in the inspection path of an array of primary illumination spots. At least one low power, secondary illumination spot is located in the inspection path of an array of relatively high power primary illumination spots. Light scattered from the secondary illumination spot is collected and imaged onto one or more detectors without overheating the particle and damaging the wafer. Various embodiments and methods are presented to distinguish light scattered from secondary illumination spots. In response to determining the presence of a large particle in the inspection path of a primary illumination spot, a command is transmitted to an illumination power density attenuator to reduce the illumination power density of the primary illumination spot to a safe level before the primary illumination spot reaches the large particle.

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