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1. 发明申请

WO2015175702A1 IMAGE ACQUISITION SYSTEM, IMAGE ACQUISITION METHOD, AND INSPECTION SYSTEM 审中-公开
标题翻译：图像采集系统，图像采集方法和检测系统
公开(公告)号：WO2015175702A1
公开(公告)日：2015-11-19
申请号：PCT/US2015/030634
申请日：2015-05-13
申请人： KLA-TENCOR CORPORATION
发明人： ZHAO, Guoheng , STOKOWSKI, Stanley E. , HILL, Andrew , DE GREEVE, Johan , VAN DER BURGT, Maarten , VAN GILS, Karel
IPC分类号： G01B11/25
CPC分类号： G06T7/586 , G01B11/0608 , G01B11/2513 , G01B11/2522 , G06T2207/10052 , G06T2207/20208 , H04N5/37206
摘要： The invention relates to an image acquisition system and an image acquisition method, as well as to an inspection system having at least one such image acquisition system. A projector projects a pattern on a surface of a sample, a camera records light intensity information from within at least two detection fields defined by the camera on the surface of the sample. A relative motion between the sample on the one hand and the camera and projector on the other hand is generated. From the acquired at least one image a height profile of the surface of the sample may be inferred. The pattern may comprise a number of sub-patterns related to each other by a phase shift. Alternatively, the pattern may be a fringe pattern.
摘要翻译：本发明涉及一种图像获取系统和图像获取方法，以及具有至少一个这样的图像采集系统的检查系统。投影仪在样品的表面上投影图案，照相机记录来自样品表面上由照相机限定的至少两个检测区域内的光强度信息。另一方面，生成样品与相机和投影仪之间的相对运动。从所获取的至少一个图像可以推断出样品表面的高度分布。该图案可以包括通过相移彼此相关的多个子图案。或者，图案可以是条纹图案。

2. 发明申请

WO2012014092A2 APPARATUS AND METHOD FOR THREE DIMENSIONAL INSPECTION OF WAFER SAW MARKS 审中-公开
标题翻译：用于晶片锯痕三维检测的装置和方法
公开(公告)号：WO2012014092A2
公开(公告)日：2012-02-02
申请号：PCT/IB2011/051572
申请日：2011-04-12
申请人： KLA-TENCOR CORPORATION , MAISON, Benoit , HILL, Andy , HERMANS, Laurent , NIJS, Frans , VAN GILS, Karel , WOUTERS, Christophe
发明人： MAISON, Benoit , HILL, Andy , HERMANS, Laurent , NIJS, Frans , VAN GILS, Karel , WOUTERS, Christophe
IPC分类号： G01B11/30 , G01N21/956 , H01L21/66
CPC分类号： G01B11/25 , G01B2210/44 , G01N21/9501 , H01L22/12
摘要： An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (a) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).
摘要翻译：公开了一种用于晶片（4）的至少一个表面（3）上的锯痕（2）的三维检查的装置（1）和方法。需要至少一个相机（6）来捕获晶片（4）的整个表面（3）的图像。至少一个线投影仪（8）提供以光束中心轴（9）为中心的光束（5）。线投影仪（8）布置成使得中心束轴（9）相对于晶片（4）的平面（P）成锐角（α）。线移位器（12）位于每个线投影仪（8）和晶片（4）的表面（3）之间的光束（5）中。使用帧抓取器（14）和图像处理器（16）来同步和协调图像捕获和在正面（3F）和/或背面（3F）上的线（22）的图案（20）的位置 3B）的晶片（4）。

3. 发明申请

WO2017136011A2 METHOD AND SYSTEM FOR OPTICAL THREE-DIMENSIONAL TOPOGRAPHY MEASUREMENT 审中-公开
标题翻译：用于光学三维地形测量的方法和系统
公开(公告)号：WO2017136011A2
公开(公告)日：2017-08-10
申请号：PCT/US2016/060599
申请日：2016-11-04
申请人： KLA-TENCOR CORPORATION
发明人： ZHAO, Guoheng , VAN DER BURGT, Maarten , LIU, Sheng , HILL, Andy , DE GREEVE, Johan , VAN GILS, Karel
IPC分类号： G01N21/956 , G01N21/39 , G02B27/22
CPC分类号： G01B11/2518 , G01B11/24 , G01B2210/56
摘要： For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.
摘要翻译：对于物体表面的三维形貌测量，将图案化照明通过物镜投影到表面上。进行物体与物镜之间的相对运动，并通过检测器通过物镜记录表面的多个图像。相对运动的方向包括与物镜的光轴倾斜的角度。表面上给定位置的高度信息是从相应位置记录的强度变化得出的。而且，图案化照明和均匀照明可以交替地投射在表面上，而在物体和物镜沿着物镜的光轴的相对运动期间记录表面的图像。均匀照明用于获取表面上镜面结构的高度信息，图案照明用于获取表面其他部分的高度信息。

4. 发明申请

WO2017136011A3 METHOD AND SYSTEM FOR OPTICAL THREE-DIMENSIONAL TOPOGRAPHY MEASUREMENT 审中-公开
公开(公告)号：WO2017136011A3
公开(公告)日：2017-08-10
申请号：PCT/US2016/060599
申请日：2016-11-04
申请人： KLA-TENCOR CORPORATION
发明人： ZHAO, Guoheng , VAN DER BURGT, Maarten , LIU, Sheng , HILL, Andy , DE GREEVE, Johan , VAN GILS, Karel
IPC分类号： G01N21/956 , G01N21/39 , G02B27/22
摘要： For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.

5. 发明申请

WO2014143436A1 APPARATUS AND METHOD FOR AUTOMATIC PITCH CONVERSION OF PICK AND PLACE HEADS, PICK AND PLACE HEAD AND PICK AND PLACE DEVICE 审中-公开
标题翻译： PICK和PLACE HEADS，PICK和PLACE HEAD AND PICK AND PLACE DEVICE自动转换的装置和方法
公开(公告)号：WO2014143436A1
公开(公告)日：2014-09-18
申请号：PCT/US2014/014250
申请日：2014-01-31
申请人： KLA-TENCOR CORPORATION
发明人： VANGILBERGEN, Bert , DE BLOCK, Erik , VERMEULEN, Jimmy , CHEUNG, Kw , LEUNG, Kc , ACCOU, Bruno , TRUYENS, Carl , VAN GILS, Karel
IPC分类号： B65G47/90 , B25J9/02 , B25J5/02
CPC分类号： B25J15/0061 , B65G47/907
摘要： The invention relates to an apparatus for automatic pitch conversion for pick and place heads, comprising at least one auto pitch station for adjusting a pitch in a X coordinate direction and/or adjusting a pitch in a Y coordinate direction of pickers/grippers of a pick and place heads; a first actuator, operated by a motor gear assembly of the at least one auto pitch station, wherein the first actuator changes the pitch in the X coordinate direction distance between rows of pickers/grippers of the respective pick and place head; and a second actuator operated by the same motor gear assembly of the at least one auto pitch station, wherein the second actuator changes the pitch in the Y coordinate direction between the pickers/grippers within a row of the respective pick and place head. The invention also relates to a method for automatic pitch conversion of pick and place heads. The invention refers as well to a pick and place head and a pick and place device.
摘要翻译：本发明涉及一种用于拾放头自动俯仰变换的装置，包括至少一个用于调整X坐标方向间距的自动俯仰站和/或调整拾取器/拾取器的Y坐标方向上的间距并放置头由所述至少一个自动俯仰站的电动机齿轮组件操作的第一致动器，其中所述第一致动器改变所述拾取和放置头部的拾取器/抓取器行之间的X坐标方向距离处的间距; 以及由所述至少一个自动俯仰站的相同的电动机齿轮组件操作的第二致动器，其中所述第二致动器在所述拾取和放置头部的一排内的所述拾取器/夹具之间的Y坐标方向上改变所述俯仰。本发明还涉及一种拾放头自动间距转换的方法。本发明还涉及拾放头和拾放装置。

6. 发明公开

EP3998477A1 METHOD AND SYSTEM FOR OPTICAL THREE-DIMENSIONAL TOPOGRAPHY MEASUREMENT 审中-实审
公开(公告)号：EP3998477A1
公开(公告)日：2022-05-18
申请号：EP21216084.0
申请日：2016-11-04
申请人： KLA-Tencor Corporation
发明人： ZHAO, Guoheng , VAN DER BURGT, Maarten , LIU, Sheng , HILL, Andy , DE GREEVE, Johan , VAN GILS, Karel
IPC分类号： G01N21/956 , G01N21/39 , G01B11/25
摘要： For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.

7. 发明公开

EP2598838A2 APPARATUS AND METHOD FOR THREE DIMENSIONAL INSPECTION OF WAFER SAW MARKS 审中-公开
标题翻译：三维控制装置及方法锯痕晶片上
公开(公告)号：EP2598838A2
公开(公告)日：2013-06-05
申请号：EP11811899.1
申请日：2011-04-12
申请人： KLA-Tencor Corporation
发明人： MAISON, Benoit , HILL, Andy , HERMANS, Laurent , NIJS, Frans , VAN GILS, Karel , WOUTERS, Christophe
IPC分类号： G01B11/30 , G01N21/956 , H01L21/66
CPC分类号： G01B11/25 , G01B2210/44 , G01N21/9501 , H01L22/12
摘要： An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (a) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).

8. 发明公开

EP3411695A2 METHOD AND SYSTEM FOR OPTICAL THREE-DIMENSIONAL TOPOGRAPHY MEASUREMENT 有权
公开(公告)号：EP3411695A2
公开(公告)日：2018-12-12
申请号：EP16889639.7
申请日：2016-11-04
申请人： KLA-Tencor Corporation
发明人： ZHAO, Guoheng , VAN DER BURGT, Maarten , LIU, Sheng , HILL, Andy , DE GREEVE, Johan , VAN GILS, Karel
IPC分类号： G01N21/956 , G01N21/39 , G02B27/22
CPC分类号： G01B11/2518 , G01B11/0608 , G01B11/24 , G01B11/2513 , G01B2210/56
摘要： For three-dimensional topography measurement of a surface of an object patterned illumination is projected on the surface through an objective. A relative movement between the object and the objective is carried out, and plural images of the surface are recorded through the objective by a detector. The direction of the relative movement includes an oblique angle with an optical axis of the objective. Height information for a given position on the surface is derived from a variation of the intensity recorded from the respective position. Also, patterned illumination and uniform illumination may be projected alternatingly on the surface, while images of the surface are recorded during a relative movement of the object and the objective along an optical axis of the objective. Uniform illumination is used for obtaining height information for specular structures on the surface, patterned illumination is used for obtaining height information on other parts of the surface.

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