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1. 发明申请

WO2016153546A1 METHOD FOR SHAPE CLASSIFICATION OF AN OBJECT 审中-公开
标题翻译：对象形状分类方法
公开(公告)号：WO2016153546A1
公开(公告)日：2016-09-29
申请号：PCT/US2015/045961
申请日：2015-08-19
申请人： KLA-TENCOR CORPORATION
发明人： HERMANS, Laurent , DELFOSSE, Eric , NIJS, Frans , THISSEN, Francis , DE GREEVE, Johan
IPC分类号： G06K9/48 , G06K9/62
CPC分类号： G06K9/6211 , G06K9/00214
摘要： A method for shape classification of an object is provided. Shape categories are provided which specify a plane and points therein relative to the object, and also specify at least one limit coordinate for each such point, the limit coordinate defining a boundary in a direction normal to the plane for the shape of the object considered in order for the object to be classified into a respective shape category. The shape categories can be provided by a user, making the method very flexible. The shape categories can in particular be derived from a set of samples of objects representing a shape category to be defined. For classification, the position of a surface of the object is measured at each of the points defined in the shape category, and the result is compared with the corresponding limit coordinate.
摘要翻译：提供了一种对象的形状分类方法。提供了形状类别，其指定相对于对象的平面和点，并且还为每个这样的点指定至少一个极限坐标，极限坐标在垂直于平面的方向上定义所考虑的对象的形状的边界对象被分类为相应的形状类别的顺序。形状类别可以由用户提供，使得该方法非常灵活。形状类别可以特别地从表示待定义的形状类别的对象的一组样本导出。对于分类，在形状类别中定义的每个点处测量对象的表面的位置，并将结果与相应的极限坐标进行比较。

2. 发明申请

WO2012014092A2 APPARATUS AND METHOD FOR THREE DIMENSIONAL INSPECTION OF WAFER SAW MARKS 审中-公开
标题翻译：用于晶片锯痕三维检测的装置和方法
公开(公告)号：WO2012014092A2
公开(公告)日：2012-02-02
申请号：PCT/IB2011/051572
申请日：2011-04-12
申请人： KLA-TENCOR CORPORATION , MAISON, Benoit , HILL, Andy , HERMANS, Laurent , NIJS, Frans , VAN GILS, Karel , WOUTERS, Christophe
发明人： MAISON, Benoit , HILL, Andy , HERMANS, Laurent , NIJS, Frans , VAN GILS, Karel , WOUTERS, Christophe
IPC分类号： G01B11/30 , G01N21/956 , H01L21/66
CPC分类号： G01B11/25 , G01B2210/44 , G01N21/9501 , H01L22/12
摘要： An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (a) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).
摘要翻译：公开了一种用于晶片（4）的至少一个表面（3）上的锯痕（2）的三维检查的装置（1）和方法。需要至少一个相机（6）来捕获晶片（4）的整个表面（3）的图像。至少一个线投影仪（8）提供以光束中心轴（9）为中心的光束（5）。线投影仪（8）布置成使得中心束轴（9）相对于晶片（4）的平面（P）成锐角（α）。线移位器（12）位于每个线投影仪（8）和晶片（4）的表面（3）之间的光束（5）中。使用帧抓取器（14）和图像处理器（16）来同步和协调图像捕获和在正面（3F）和/或背面（3F）上的线（22）的图案（20）的位置 3B）的晶片（4）。

3. 发明公开

EP2598838A2 APPARATUS AND METHOD FOR THREE DIMENSIONAL INSPECTION OF WAFER SAW MARKS 审中-公开
标题翻译：三维控制装置及方法锯痕晶片上
公开(公告)号：EP2598838A2
公开(公告)日：2013-06-05
申请号：EP11811899.1
申请日：2011-04-12
申请人： KLA-Tencor Corporation
发明人： MAISON, Benoit , HILL, Andy , HERMANS, Laurent , NIJS, Frans , VAN GILS, Karel , WOUTERS, Christophe
IPC分类号： G01B11/30 , G01N21/956 , H01L21/66
CPC分类号： G01B11/25 , G01B2210/44 , G01N21/9501 , H01L22/12
摘要： An apparatus (1) and a method for the three dimensional inspection of saw marks (2) on at least one surface (3) of a wafer (4) are disclosed. At least one camera (6) is required to capture an image of the entire surface (3) of the wafer (4). At least one line projector (8) provides a light bundle (5), centered about a central beam axis (9). The line projector (8) is arranged such that the central beam axis (9) is at an acute angle (a) with regard to the plane (P) of the wafer (4). A line shifter (12) is positioned in the light bundle (5) between each line projector (8) and the surface (3) of the wafer (4). A frame grabber (14) and an image processor (16) are used to synchronize and coordinate the image capture and the position of the pattern (20) of lines (22) on the front side (3F) and/or the back side (3B) of the wafer (4).

4. 发明公开

EP3274923A1 METHOD FOR SHAPE CLASSIFICATION OF AN OBJECT 有权
标题翻译：一种物体形状分类的方法
公开(公告)号：EP3274923A1
公开(公告)日：2018-01-31
申请号：EP15886698.8
申请日：2015-08-19
申请人： KLA - Tencor Corporation
发明人： HERMANS, Laurent , DELFOSSE, Eric , NIJS, Frans , THISSEN, Francis , DE GREEVE, Johan
IPC分类号： G06K9/48 , G06K9/62
CPC分类号： G06K9/6211 , G06K9/00214 , G06K9/50
摘要： A method for shape classification of an object is provided. Shape categories are provided which specify a plane and points therein relative to the object, and also specify at least one limit coordinate for each such point, the limit coordinate defining a boundary in a direction normal to the plane for the shape of the object considered in order for the object to be classified into a respective shape category. The shape categories can be provided by a user, making the method very flexible. The shape categories can in particular be derived from a set of samples of objects representing a shape category to be defined. For classification, the position of a surface of the object is measured at each of the points defined in the shape category, and the result is compared with the corresponding limit coordinate.

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