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    • 7. 发明专利
    • AMORPHOUS SILICON/CDTE PHOTOELECTRIC CONVERSION CELL
    • JPS6320877A
    • 1988-01-28
    • JP16469786
    • 1986-07-15
    • KAWASAKI STEEL CO
    • TSUGAI NORIJITAKAHASHI MAKOTO
    • H01L31/04
    • PURPOSE:To get rid of the deterioration of the efficiency of photoelectric conversion in a long-wave length range, and to enable the high efficiency of photoelectric conversion in a wide wavelength range by forming a CdTe thin-film having p-n junction structure between an electrode and an a-Si:H thin-film layer having p-i-n junction structure. CONSTITUTION:An n-type CdTe layer 2 and a p-type CdTe layer 3 are deposited on a metallic substrate 1 consisting of stainless as an electrode in total thickness of 0.6mum or more, thus shaping a CdTe thin-film layer 8 having p-n junction structure. An n-type a-Si:H layer 4 in thickness of 0.3-0.9mum, an i-type a-Si : H layer 5 and a p-type a-Si:H layer 6 are evaporated onto the CdTe thin-film layer 8, thus forming an s-Si : R thin-film layer 9. A transparent conductive film layer (TCO) 7 is shaped onto the a-Si:H thin-film layer 9, thus constituting a photoelectric conversion cell. Accordingly, a photoelectric conversion cell, the efficiency of photoelectric conversion of which in a long-wave length range is not deteriorated and which has spectral sensitivity characteristics excellently coinciding with the spectral distribution of solar rays in a wide wavelength range, can be acquired.
    • 10. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR CRYSTAL
    • JPH04318940A
    • 1992-11-10
    • JP8503191
    • 1991-04-17
    • KAWASAKI STEEL CO
    • ISHIHARA KANJITAKAHASHI MAKOTOTAKAGI NOBORUUNNO HIROSHIKATO KIYONORI
    • H01L21/36H01L21/365H01L21/86
    • PURPOSE:To reduce the generation of through-defects in a film by interrupting the supply of at least one component in the formed film components of a semiconductor crystal film once or more and keeping a substrate temperature during interruption at a temperature higher than the substrate temperature during film formation. CONSTITUTION:A substrate: a sapphire (1111) face, a aw material gas: dimethyl cadmium, diethyl tellurium, a carrier gas: hydrogen are included as the conditions of film formation. A substrate temperature: 370-400 deg.C, a raw-material gas flow rate: dimethyl cadium, 40cc/min, diethyl tellurium, 110cc/min, a carrier- gas flow rate: 5-10l/min are included as the conditions of film formation beofre interruption. The substrate temperature: 450-600 deg.C, the raw-material gas flow rate: dimethyl cadmium, 0-40cc/min, the carrier-gas flow rate: 1-5l/min, a time: 10-30min are contained on interruption. The substrate temperature: 370-400 deg.C, the raw-material gas flow rate: dimethyl cadmium, 40cc/min, diethyl tellurium, 110cc/min, the carrier-gas flow rate: 5-10l/min and film thickness: 1mum are comprised as the conditions of film formation after interruption.