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    • 2. 发明专利
    • LAMINATED PHOTOELECTRIC CONVERTER
    • JPH01158780A
    • 1989-06-21
    • JP31710487
    • 1987-12-15
    • KAWASAKI STEEL CO
    • TAKAGI NOBORUTSUGAI NORIJITAKAHASHI MAKOTOISHIHARA KANJI
    • H01L31/0248H01L31/08
    • PURPOSE:To improve dielectric strength between electrodes and obtain the higher degree of freedom of the wiring between cells by a method wherein the respective electrodes are extended to different parts of the same main surface of a substrate and isolated from each other by insulating films. CONSTITUTION:A metal layer 2 is formed on a substrate 1 as a lower electrode. A (CdTe)p-n junction cell is formed on the metal layer 2 as a lower element cell 5. Then the upper circumferential part and side surface of the cell 5, and the adjacent parts of the substrate 1 are covered with a insulating film 6. Then a transparent conductive film(TCO film) is formed on the cell 5 as an intermediate electrode 7 so as to be extended toward one side of the cell 5 and to the insulating film 6 on the substrate 1. Then an (a-Si)p-i-n junction cell is formed as an upper element cell 11 on the TCO film just above the ell 5. Then the upper circumferential part and side surface of the cell 11 opposite to the side surface of the cell 5 to which the electrode 7 is extended and the adjacent part on the substrate 1 are covered with an insulating film 12. Then a TCO film is formed on the cell 11 as an upper electrode 13 so as to be extended to the film 12 on the substrate 1. With this constitution, the electrodes 2, 7 and 13 are isolated from each other by the insulating film 6 and 12.
    • 4. 发明专利
    • MANUFACTURE OF SOLAR CELL
    • JPH023992A
    • 1990-01-09
    • JP15237188
    • 1988-06-22
    • KAWASAKI STEEL CO
    • TAKAHASHI MAKOTOTAKAGI NOBORUTSUGAI NORIJIISHIHARA KANJI
    • H01L31/04
    • PURPOSE:To improve characteristics such as photovoltaic power, by providing a non-doped layer between N- and P-layers for inhibiting diffusion of a dopant to the N-layer during formation of the P-layer and for controlling position of the P-N junction and distribution of carriers in the direction of depth. CONSTITUTION:An N-type CdTe thin film doped with a donor dopant of a group III element such as In or the like is deposited at a substrate temperature of 400-600 deg.C. Then, a 100-500Angstrom thick undoped CdTe layer is deposited at a substrate temperature of 300-380 deg.C that is lower than said substrate temperature. Thereafter, a P-type CdTe thin film doped with an acceptor dopant of a group V element such as As or the like is deposited also at a substrate temperature of 300-380 deg.C. By interposing the non-doped CdTe layer between the N- and P-layers in the formation of the P-N junction in this manner, possible deviation between the designed and actual positions of the P-N junction and deviation between the designed and actual distributions of the dopant in the direction of depth in the P- and N-layers are limited to the thickness of the non-doped CdTe layer formed between the N- and P-layers.
    • 6. 发明专利
    • MANUFACTURE OF SEMICONDUCTOR CRYSTAL
    • JPH04318940A
    • 1992-11-10
    • JP8503191
    • 1991-04-17
    • KAWASAKI STEEL CO
    • ISHIHARA KANJITAKAHASHI MAKOTOTAKAGI NOBORUUNNO HIROSHIKATO KIYONORI
    • H01L21/36H01L21/365H01L21/86
    • PURPOSE:To reduce the generation of through-defects in a film by interrupting the supply of at least one component in the formed film components of a semiconductor crystal film once or more and keeping a substrate temperature during interruption at a temperature higher than the substrate temperature during film formation. CONSTITUTION:A substrate: a sapphire (1111) face, a aw material gas: dimethyl cadmium, diethyl tellurium, a carrier gas: hydrogen are included as the conditions of film formation. A substrate temperature: 370-400 deg.C, a raw-material gas flow rate: dimethyl cadium, 40cc/min, diethyl tellurium, 110cc/min, a carrier- gas flow rate: 5-10l/min are included as the conditions of film formation beofre interruption. The substrate temperature: 450-600 deg.C, the raw-material gas flow rate: dimethyl cadmium, 0-40cc/min, the carrier-gas flow rate: 1-5l/min, a time: 10-30min are contained on interruption. The substrate temperature: 370-400 deg.C, the raw-material gas flow rate: dimethyl cadmium, 40cc/min, diethyl tellurium, 110cc/min, the carrier-gas flow rate: 5-10l/min and film thickness: 1mum are comprised as the conditions of film formation after interruption.