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    • 3. 发明授权
    • Manufacturing method of SOI semiconductor device
    • SOI半导体器件的制造方法
    • US08343847B2
    • 2013-01-01
    • US12575555
    • 2009-10-08
    • Masaki KoyamaJunpei MomoEiji HigaHiroaki HondaTamae MoriwakaAkihisa Shimomura
    • Masaki KoyamaJunpei MomoEiji HigaHiroaki HondaTamae MoriwakaAkihisa Shimomura
    • H01L21/76
    • H01L27/1266H01L21/02381H01L21/02422H01L21/02532H01L21/02683H01L21/02686H01L21/76254H01L27/1214H01L27/1274H01L29/66772
    • To prevent, in the case of irradiating a single crystal semiconductor layer with a laser beam, an impurity element from being taken into the single crystal semiconductor layer at the time of laser irradiation. In a manufacturing method of an SOI substrate, a single crystal semiconductor substrate and a base substrate are prepared; an embrittlement region is formed in a region at a predetermined depth from a surface of the single crystal semiconductor substrate by irradiating the single crystal semiconductor substrate with accelerated ions; the single crystal semiconductor substrate and a base substrate are bonded to each other with an insulating layer interposed therebetween; a single crystal semiconductor layer is formed over the base substrate with the insulating layer interposed therebetween by heating the single crystal semiconductor substrate to cause separation using the embrittlement region as a boundary; an oxide film formed on the single crystal semiconductor layer is removed; and at least a surface of the single crystal semiconductor layer is melted by irradiating the surface of the single crystal semiconductor layer with a laser beam after the removal of the oxide film. The number of times the single crystal semiconductor layer is melted by the irradiation with the laser beam is one.
    • 为了防止在用激光束照射单晶半导体层的情况下,在激光照射时将杂质元素摄入单晶半导体层。 在SOI衬底的制造方法中,制备单晶半导体衬底和基底衬底; 通过用加速的离子照射单晶半导体衬底,在单晶半导体衬底的表面的预定深度的区域中形成脆化区域; 单晶半导体衬底和基底衬底之间具有绝缘层而彼此接合; 通过加热单晶半导体衬底以使脆化区域作为边界进行分离,在基底衬底上形成绝缘层,形成单晶半导体层; 去除形成在单晶半导体层上的氧化膜; 并且在除去氧化膜之后,通过用激光束照射单晶半导体层的表面,使单晶半导体层的至少一个表面熔融。 单晶半导体层通过激光束的照射而熔化的次数是1。
    • 4. 发明申请
    • MANUFACTURING METHOD OF SOI SUBSTRATE
    • SOI衬底的制造方法
    • US20100093153A1
    • 2010-04-15
    • US12575555
    • 2009-10-08
    • Masaki KoyamaJunpei MomoEiji HigaHiroaki HondaTamae MoriwakaAkihisa Shimomura
    • Masaki KoyamaJunpei MomoEiji HigaHiroaki HondaTamae MoriwakaAkihisa Shimomura
    • H01L21/762
    • H01L27/1266H01L21/02381H01L21/02422H01L21/02532H01L21/02683H01L21/02686H01L21/76254H01L27/1214H01L27/1274H01L29/66772
    • To prevent, in the case of irradiating a single crystal semiconductor layer with a laser beam, an impurity element from being taken into the single crystal semiconductor layer at the time of laser irradiation. In a manufacturing method of an SOI substrate, a single crystal semiconductor substrate and a base substrate are prepared; an embrittlement region is formed in a region at a predetermined depth from a surface of the single crystal semiconductor substrate by irradiating the single crystal semiconductor substrate with accelerated ions; the single crystal semiconductor substrate and a base substrate are bonded to each other with an insulating layer interposed therebetween; a single crystal semiconductor layer is formed over the base substrate with the insulating layer interposed therebetween by heating the single crystal semiconductor substrate to cause separation using the embrittlement region as a boundary; an oxide film formed on the single crystal semiconductor layer is removed; and at least a surface of the single crystal semiconductor layer is melted by irradiating the surface of the single crystal semiconductor layer with a laser beam after the removal of the oxide film. The number of times the single crystal semiconductor layer is melted by the irradiation with the laser beam is one.
    • 为了防止在用激光束照射单晶半导体层的情况下,在激光照射时将杂质元素摄入单晶半导体层。 在SOI衬底的制造方法中,制备单晶半导体衬底和基底衬底; 通过用加速的离子照射单晶半导体衬底,在单晶半导体衬底的表面的预定深度的区域中形成脆化区域; 单晶半导体衬底和基底衬底之间具有绝缘层而彼此接合; 通过加热单晶半导体衬底以使脆化区域作为边界进行分离,在基底衬底上形成绝缘层,形成单晶半导体层; 去除形成在单晶半导体层上的氧化膜; 并且在除去氧化膜之后,通过用激光束照射单晶半导体层的表面,使单晶半导体层的至少一个表面熔融。 单晶半导体层通过激光束的照射而熔化的次数是1。
    • 6. 发明授权
    • Apparatus for measuring hemoglobin concentration and oxygen saturation
thereof
    • 用于测量血红蛋白浓度和氧气饱和度的装置
    • US5149503A
    • 1992-09-22
    • US460057
    • 1990-03-02
    • Hiromasa KohnoHiroaki HondaMasahiro Nudeshima
    • Hiromasa KohnoHiroaki HondaMasahiro Nudeshima
    • A61B5/00G01N21/31
    • G01N21/3151A61B5/0059A61B5/14557G01N2021/3144Y10S435/808
    • A light beam having a first wavelength (.lambda..sub.1) is applied to the blood from a first light radiation section, while a light beam having a second wavelength (.lambda..sub.2) is applied from second and third light radiation sections different in positions from the first radiation section and from each other to the blood and the respective reflected-light intensity (I.sub.1, I.sub.2, I.sub.3) is detected. A first correction value (X) for correcting the reflected-light intensity ratio (I.sub.2 /I.sub.3) is calculated by a first correction value operation section (40) and a second correction value (C.sub.1) is calculated by a second correction value operation section (42) by use of this first correction value and the reflected-light intensity (I.sub.3). The reflected-light intensity ratio (I.sub.1 /I.sub.2) is corrected by use of this second correction value and an oxygen saturation in the blood is operated based on correlation function by use of the corrected reflected-light intensity ratio (R.sub.s). The reflected-light intensity ratio (I.sub.2 /I.sub.3) is corrected by the coefficient of correction thus operated and the hemoglobin concentration in the blood is operated based on correlation function by use of the reflected light intensity ratio thus corrected.
    • PCT No.PCT / JP88 / 00742 Sec。 371日期1990年3月2日 102(e)1990年3月2日PCT PCT。 第WO89 / 01144号公报 日期:1989年2月9日。具有第一波长(λ1)的光束从第一光辐射部分施加到血液,而具有第二波长(λ2)的光束从第二和第三光辐射 检测到与第一辐射部分和彼此不同的部分与血液不同的部分和各自的反射光强度(I1,I2,I3)。 通过第一校正值运算部(40)计算用于校正反射光强度比(I2 / I3)的第一校正值(X),第二校正值(C1)由第二校正值运算部 42)通过使用该第一校正值和反射光强度(I3)。 通过使用该第二校正值来校正反射光强度比(I1 / I2),并且通过使用校正的反射光强度比(Rs),基于相关函数来操作血液中的氧饱和度。 反射光强度比(I2 / I3)由这样操作的校正系数校正,并且通过使用如此校正的反射光强度比,基于相关函数来操作血液中的血红蛋白浓度。