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    • 1. 发明授权
    • Method for manufacturing semiconductor device
    • 制造半导体器件的方法
    • US06277756B1
    • 2001-08-21
    • US09501762
    • 2000-02-10
    • Junji OharaShinji YoshiharaKazuhiko KanoNobuyuki Ohya
    • Junji OharaShinji YoshiharaKazuhiko KanoNobuyuki Ohya
    • H01L21311
    • G01P15/0802B81B2203/033B81C1/00619B81C2201/0112H01L21/30655H01L21/762
    • A method of manufacturing a semiconductor device, which can effectively form a trench having a high aspect ratio with relatively simple steps. An initial trench is formed in a silicon substrate by a reactive ion etching using an oxide film mask as an etching mask. After forming a protection oxide film on an inside surface of the trench, a part of the protection oxide film at which positions at a bottom surface of the trench is removed by a reactive ion etching, so that an etching of the silicon substrate is advanced through the bottom surface of the trench. Furthermore, the step for forming the protection oxide film and the step for re-etching the bottom surface of the trench are repeatedly performed, so that a depth of the trench becomes a predetermined depth. These steps are performed in a common chamber by using plasma processed with switching gases to be introduced to the chamber.
    • 一种制造半导体器件的方法,其可以通过相对简单的步骤有效地形成具有高纵横比的沟槽。 通过使用氧化物膜掩模作为蚀刻掩模的反应离子蚀刻在硅衬底中形成初始沟槽。 在沟槽的内表面上形成保护氧化膜之后,通过反应离子蚀刻去除沟槽底面的位置的保护氧化膜的一部分,使得硅衬底的蚀刻通过 沟槽的底面。 此外,重复执行用于形成保护氧化膜的步骤和重新蚀刻沟槽的底表面的步骤,使得沟槽的深度变为预定深度。 这些步骤通过使用等离子体处理的切换气体被引入腔室在公共室中进行。