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    • 6. 发明授权
    • Laser diode driving device and optical scanning device
    • 激光二极管驱动装置和光学扫描装置
    • US07760780B2
    • 2010-07-20
    • US12169363
    • 2008-07-08
    • Takashi Kanno
    • Takashi Kanno
    • H01S3/00
    • H01S5/06832B41J2/442H01S5/06812H01S5/183
    • A laser diode driving device capable of obtaining a stable pulse emission state even when variation in the current-light amount characteristic of a laser diode thereof is caused by environmental changes. A photodiode detects the amount of light emitted from the laser diode. A laser controller determines the amount of light to be emitted from the laser diode. Further, the laser controller controls the laser diode to emit light in the determined light amount. A bias current value-determining section determines a bias current value based on results of light emission performed by the laser diode in three or more kinds of light amounts determined by the laser controller.
    • 激光二极管驱动装置即使在其激光二极管的电流光量特性的变化是由环境变化引起的情况下也能获得稳定的脉冲发射状态。 光电二极管检测从激光二极管发射的光量。 激光控制器确定从激光二极管发射的光量。 此外,激光控制器控制激光二极管以确定的光量发光。 偏置电流值确定部基于由激光控制器确定的三种或更多种光量,基于由激光二极管执行的发光结果来确定偏置电流值。
    • 10. 发明授权
    • Heat radiation structure for semiconductor device
    • 半导体器件的散热结构
    • US5262922A
    • 1993-11-16
    • US842331
    • 1992-03-26
    • Hiroshi YamajiTakashi KannoTakashi SatoRiichi MagomeTomoyuki Hongho
    • Hiroshi YamajiTakashi KannoTakashi SatoRiichi MagomeTomoyuki Hongho
    • H01L23/40H05K1/02H05K7/20
    • H05K1/0204H01L23/40H01L23/4006H01L2023/405H01L2023/4062H01L2023/4087H01L2924/0002H05K2201/083H05K2201/10409H05K2201/10416H05K2201/10689
    • A heat radiation structure is provided for a semiconductor device, by which a mounting height of the semiconductor device can be lowered to increase an accommodation density in a shelf, and the mounting/dismounting is easily carried out. In a heat-radiation structure for a semiconductor device, in which a semiconductor device (2) is mounted on a printed circuit board (1) so that the bottom surface thereof confronts an opening (1a) formed in the printed circuit board, a heat-conductive member (3, 11) is brought into tight contact with the bottom surface of the semiconductor device and the opposite end surface of thereof is protruded through the opening (1a) from the back side of the printed circuit board while in tight contact with a heat-radiation plate (4) disposed at that position, so that heat generated from the semiconductor device is transmitted to the heat-radiation plate (4) via the heat-conductive member (3, 11) and radiated from the outer surface thereof into air. At least one of the semiconductor device (2) and the heat-radiation plate (4) is made of a magnetic substance so that the two members are brought into tight contact with the heat-conductive member by the attraction force of a permanent magnet (3, 10) disposed between the two members.
    • PCT No.PCT / JP91 / 01006 Sec。 371日期:1992年3月26日 102(e)1992年3月26日PCT PCT 1991年7月26日PCT公布。 出版物WO92 / 02117 日本1992年2月6日。为半导体器件提供散热结构,通过该辐射结构可以降低半导体器件的安装高度以增加搁板中的调节密度,并且容易进行安装/拆卸。 在半导体器件的散热结构中,其中将半导体器件(2)安装在印刷电路板(1)上,使得其底表面面对形成在印刷电路板中的开口(1a),热量 导电构件(3,11)与半导体器件的底表面紧密接触,并且其相对端表面从印刷电路板的背面突出穿过开口(1a),同时与 设置在该位置处的散热板(4),使得从半导体器件产生的热量经由导热部件(3,11)传递到散热板(4),并从其外表面辐射 进入空气 半导体器件(2)和散热板(4)中的至少一个由磁性物质制成,使得两个部件通过永磁体的吸引力与导热部件紧密接触( 3,10)设置在两个构件之间。