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1. 发明授权

US5170245A Semiconductor device having metallic interconnects formed by grit blasting 失效
标题翻译：具有通过喷砂形成的金属互连的半导体装置
公开(公告)号：US5170245A
公开(公告)日：1992-12-08
申请号：US653978
申请日：1991-02-11
申请人： Jungihl Kim , Joseph C. Logue , John J. Ritsko , Robert R. Shaw , George F. Walker
发明人： Jungihl Kim , Joseph C. Logue , John J. Ritsko , Robert R. Shaw , George F. Walker
IPC分类号： B24C1/04 , B24C3/32 , H01L21/48 , H05K1/03 , H05K3/00
CPC分类号： H01L21/4807 , B24C1/04 , B24C3/322 , H01L21/486 , H05K3/0044 , H05K1/0306 , H05K2203/025 , H05K3/4629
摘要： This invention relates to a ceramic module and to methods for forming protruding, upstanding electrically conducting pins by the selective abrasion of a surface 18 of a multilayered ceramic module 10. An abrasive blasting device 40 is disposed adjacent to the surface 18 for directing a stream of abrasive particles 42 against the surface. The particles 42 strike both metallic conductors 20 and 22 and also the ceramic material of the layer 14. Inasmuch as the ceramic material is relatively hard and brittle as compared to the ductile metallic conductors the abrasive particles 42 abrade away the ceramic layer 14 at a faster rate than the ductile metallic material of the conductors 20 and 22. The abrasive particles 42 may be comprised of any suitable abrasive, such as Al.sub.2 O.sub.3, SiC or WC. The module may be rotated beneath a nozzle of the grit blasting device, the nozzle being linearly translated above the surface being abraded.
摘要翻译：本发明涉及一种陶瓷模块以及通过多层陶瓷模块10的表面18的选择性磨损来形成突出的，直立的导电销的方法。喷砂装置40邻近表面18设置，用于引导研磨颗粒42抵靠表面。颗粒42撞击金属导体20和22以及层14的陶瓷材料。由于与延性金属导体相比，陶瓷材料相对硬且脆，研磨颗粒42以更快的速度磨掉陶瓷层14 导体20和22的韧性金属材料的比率。磨料颗粒42可以由任何合适的研磨剂，例如Al 2 O 3，SiC或WC组成。模块可以在喷砂装置的喷嘴下方旋转，喷嘴在被磨损的表面上线性平移。

2. 发明授权

US4896464A Formation of metallic interconnects by grit blasting 失效
标题翻译：通过喷砂形成金属互连
公开(公告)号：US4896464A
公开(公告)日：1990-01-30
申请号：US207085
申请日：1988-06-15
申请人： Jungihl Kim , Joseph C. Logue , John J. Ritsko , Robert R. Shaw , George F. Walker
发明人： Jungihl Kim , Joseph C. Logue , John J. Ritsko , Robert R. Shaw , George F. Walker
IPC分类号： H01L23/50 , B24C1/04 , B24C3/32 , H01L21/48 , H05K1/03 , H05K3/00 , H05K3/46
CPC分类号： H01L21/486 , B24C1/04 , B24C3/322 , H01L21/4807 , H05K3/0044 , H05K1/0306 , H05K2203/025 , H05K3/4629
摘要： This invention relates to a ceramic module and to methods for forming protruding, upstanding electrically conducting pins by the selective abrasion of a surface 18 of a multilayered ceramic module 10. An abrasive blasting device 40 is disposed adjacent to the surface 18 for directing a stream of abrasive particles 42 against the surface. The particles 42 strike both metallic conductors 20 and 22 and also the ceramic material of the layer 14. Inasmuch as the ceramic material is relatively hard and brittle as compared to the ductile metallic conductors the abrasive particles 42 abrade away the ceramic layer 14 at a faster rate than the ductile metallic material of the conductors 20 and 22. The abrasive particles 42 may be comprised of any suitable abrasive, such as Al.sub.2 O.sub.3, SiC or WC. The module may be rotated beneath a nozzle of the grit blasting device, the nozzle being linearly translated above the surface being abraded.

3. 发明授权

US5326643A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5326643A
公开(公告)日：1994-07-05
申请号：US771929
申请日：1991-10-07
申请人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , B32B9/00
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络嵌入在陶瓷和/或聚合物基材内。在制造该制品时，可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底，粘合聚酰亚胺膜或聚酰亚胺膜上。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

4. 发明授权

US5599582A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5599582A
公开(公告)日：1997-02-04
申请号：US475412
申请日：1995-06-07
申请人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , B05D5/10
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate. A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络嵌入在陶瓷和/或聚合物基材内。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

5. 发明授权

US5137461A Separable electrical connection technology 失效
标题翻译：可分离的电气连接技术
公开(公告)号：US5137461A
公开(公告)日：1992-08-11
申请号：US606007
申请日：1990-10-30
申请人： Perminder S. Bindra , Jerome J. Cuomo , Thomas P. Gall , Anthony P. Ingraham , Sung K. Kang , Jungihl Kim , Paul Lauro , David N. Light , Voya R. Markovich , Ekkehard F. Miersch , Jaynal A. Molla , Douglas O. Powell , John J. Ritsko , George J. Saxenmeyer, Jr. , Jack A. Varcoe , George F. Walker
发明人： Perminder S. Bindra , Jerome J. Cuomo , Thomas P. Gall , Anthony P. Ingraham , Sung K. Kang , Jungihl Kim , Paul Lauro , David N. Light , Voya R. Markovich , Ekkehard F. Miersch , Jaynal A. Molla , Douglas O. Powell , John J. Ritsko , George J. Saxenmeyer, Jr. , Jack A. Varcoe , George F. Walker
IPC分类号： H01R4/26 , H01R4/58 , H01R13/22 , H05K3/32
CPC分类号： H01R4/26 , H01L24/83 , H01L24/90 , H01L24/98 , H01R13/22 , H01R4/58 , H05K3/325 , H01L2224/13111 , H01L2224/29111 , H01L2224/2919 , H01L2224/48227 , H01L2224/8319 , H01L2224/838 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , Y10T29/49224
摘要： A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.
摘要翻译：提供一种用于电气设备的可分离和可重新连接的连接件，其适于小型化，其中容纳从平面部分一体地附接和突出的垂直交叉构件，以控制与相对的类似接触件配合时发生的横向位移损坏。通过提供一个或多个共形相对的接触，通过加强涂层和基底加强件以及可变形的涂层来容纳横向应力来避免位移损伤。接触是通过物理和化学过程制造的，包括溅射，正常和脉冲电镀以及化学气相沉积。完成的触点设置有增强刚性的周边固定材料。

6. 发明授权

US5582858A Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier 失效
标题翻译：多层包装中的粘合层和有机材料作为金属扩散屏障
公开(公告)号：US5582858A
公开(公告)日：1996-12-10
申请号：US474985
申请日：1995-06-07
申请人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
发明人： Eleftherios Adamopoulos , Jungihl Kim , Kang-Wook Lee , Tae S. Oh , Terrence R. O'Toole , Sampath Purushothaman , John J. Ritsko , Jane M. Shaw , Alfred Viehbeck , George F. Walker
IPC分类号： B32B7/10 , B32B15/08 , B32B15/088 , B32B27/00 , C08G73/00 , C08G73/10 , H01B3/30 , H01L21/52 , H05K1/03 , H05K3/46 , B05D5/10
CPC分类号： C08G73/1089 , C08G73/1003 , C08G73/1007 , C08G73/101 , H01B3/306 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The disclosure describes a multilayer article of manufacture comprising a substrate having adhered to it a terminally unsaturated adhesive polyimide, where the surface of the adhesive opposite the substrate is adhered to a polyimide, the article further characterized in having one set or a plurality of alternating layers of the terminally unsaturated adhesive polyimide and the polyimide. In another embodiment, the article has at least one adhesive polyimide layer adhered to a metal substrate or an electrical circuit component such as an integrated circuit, or means for forming electrical connections in an electrical circuit such as metal conduits on the circuit or a wiring network embedded within a ceramic and/or polymer substrate.In manufacturing the article of manufacture, a surface treatment technique such as wet process or a plasma/optional silane coupling agent may be applied to either the substrate, adhesive polyimide film or polyimide film prior to the bonding operation.A novel adhesive polyimide is also described which is an adhesive polyimide such as ODPA-APB terminated with unsaturated heterocyclic monoamines such as azaadenines, aminobenzotriazoles, aminopurines or aminopyrazolopyrimidines and optionally anhydrides, aminoacetylenes, vinylamines or amino phosphines. The novel polyimide may also contain unsaturated heterocyclic groups in the polymer backbone or chain, either as a partial or complete replacement for the aromatic diamines used in synthesizing the polyimide. This novel adhesive polyimide in this invention acts as an adhesive layer for the polymer-substrate (copper, polymer, glass ceramic) interface as well as a copper diffusion barrier layer for the polymer-copper interface.
摘要翻译：本公开描述了一种多层制品，其包括粘附到其上的末端不饱和粘合聚酰亚胺的基底，其中与基底相对的粘合剂的表面粘附到聚酰亚胺上，该制品进一步的特征在于具有一组或多个交替层的末端不饱和粘合聚酰亚胺和聚酰亚胺。在另一个实施方案中，制品具有粘附到金属基底或诸如集成电路的电路部件的至少一个粘合聚酰亚胺层，或用于在电路中形成电连接的装置，例如电路上的金属管道或布线网络嵌入在陶瓷和/或聚合物基材内。在制造该制品时，可以在接合操作之前将表面处理技术如湿法或等离子体/任选的硅烷偶联剂施加到基底，粘合聚酰亚胺膜或聚酰亚胺膜上。还描述了一种新型粘合聚酰亚胺，其是粘合聚酰亚胺，例如用不饱和杂环单胺如氮杂腺嘌呤，氨基苯并三唑，氨基嘌呤或氨基吡唑并嘧啶和任选的酸酐，氨基乙炔，乙烯胺或氨基膦封端的ODPA-APB。新型聚酰亚胺还可以在聚合物主链或链中含有不饱和杂环基团，作为用于合成聚酰亚胺的芳族二胺的部分或完全替代物。本发明中的这种新型粘合聚酰亚胺作为聚合物基材（铜，聚合物，玻璃陶瓷）界面的粘合剂层以及用于聚合物 - 铜界面的铜扩散阻挡层。

7. 发明授权

US5185073A Method of fabricating nendritic materials 失效
标题翻译：制造树枝状材料的方法
公开(公告)号：US5185073A
公开(公告)日：1993-02-09
申请号：US692606
申请日：1991-04-29
申请人： Perminder S. Bindra , Jerome J. Cuomo , Thomas P. Gall , Anthony P. Ingraham , Sung K. Kang , Jungihl Kim , Paul Lauro , David N. Light , Voya R. Markovich , Ekkehard F. Miersch , Jaynal A. Molla , Douglas O. Powell , John J. Ritsko , George J. Saxenmeyer, Jr. , Jack A. Varcoe , George F. Walker
发明人： Perminder S. Bindra , Jerome J. Cuomo , Thomas P. Gall , Anthony P. Ingraham , Sung K. Kang , Jungihl Kim , Paul Lauro , David N. Light , Voya R. Markovich , Ekkehard F. Miersch , Jaynal A. Molla , Douglas O. Powell , John J. Ritsko , George J. Saxenmeyer, Jr. , Jack A. Varcoe , George F. Walker
IPC分类号： H01R4/26 , H01R4/58 , H01R13/22 , H05K3/32
CPC分类号： H01L24/83 , H01L24/90 , H01R13/22 , H01R4/26 , H01R4/58 , H05K3/325 , H01L2224/0401 , H01L2224/05557 , H01L2224/13111 , H01L2224/29111 , H01L2224/2919 , H01L2224/48227 , H01L2224/8319 , H01L2224/838 , H01L2224/85444 , H01L2224/85464 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14
摘要： A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.
摘要翻译：提供一种用于电气设备的可分离和可重新连接的连接件，其适于小型化，其中容纳从平面部分一体地附接和突出的垂直交叉构件，以控制与相对的类似接触件配合时发生的横向位移损坏。通过提供一个或多个共形相对的接触，通过加强涂层和基底加强件以及可变形的涂层来容纳横向应力来避免位移损伤。接触是通过物理和化学过程制造的，包括溅射，正常和脉冲电镀以及化学气相沉积。钯的脉冲电镀提供均匀高度，均匀圆点和较少支化的树枝状沉积物。完成的触点设置有增强刚性的周边固定材料。

8. 发明授权

US5283104A Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates 失效
标题翻译：通过糊剂组合物及其在电路化陶瓷衬底中形成导电通孔的用途
公开(公告)号：US5283104A
公开(公告)日：1994-02-01
申请号：US672272
申请日：1991-03-20
申请人： Farid Y. Aoude , Emanuel I. Cooper , Peter R. Duncombe , Shaji Farooq , Edward A. Giess , Young-Ho Kim , Sarah H. Knickerbocker , Friedel Muller-Landau , Mark O. Neisser , Jae M. Park , Robert R. Shaw , Robert A. Rita , Thomas M. Shaw , Rao Vallabhaneni , Jon A. Van Hise , George F. Walker , Jungihl Kim , James M. Brownlow, deceased
发明人： Farid Y. Aoude , Emanuel I. Cooper , Peter R. Duncombe , Shaji Farooq , Edward A. Giess , Young-Ho Kim , Sarah H. Knickerbocker , Friedel Muller-Landau , Mark O. Neisser , Jae M. Park , Robert R. Shaw , Robert A. Rita , Thomas M. Shaw , Rao Vallabhaneni , Jon A. Van Hise , George F. Walker , Jungihl Kim , James M. Brownlow, deceased
IPC分类号： H01B1/16 , H01L21/48 , H01L23/498 , H05K1/03 , H05K1/09 , H05K3/46 , B32B9/00
CPC分类号： H05K1/092 , H01B1/16 , H01L21/486 , H01L21/4867 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4611 , H05K3/4629 , Y10S428/901 , Y10T29/49147 , Y10T29/49165 , Y10T428/12472 , Y10T428/12556 , Y10T428/12604 , Y10T428/12611 , Y10T428/24322 , Y10T428/24802 , Y10T428/25 , Y10T428/251 , Y10T428/252 , Y10T428/2982 , Y10T428/2991
摘要： Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.
摘要翻译：用于在电路化陶瓷衬底，特别是多层衬底中产生导电通孔的改进的通孔填充组合物，不会破裂和/或失去气密密封。通孔填充组合物包含含有（a）在约0.5和6（my）m之间的基本均匀直径的陶瓷和/或玻璃球的混合物的浆料，（b）具有最大尺寸或直径在约为陶瓷和/或玻璃球直径的1/3和1/4，和（c）粘合剂载体。形成的导电通孔体包括致密地包裹在共烧结陶瓷和/或玻璃球的均匀基质内的烧结金属颗粒的均匀导电骨架网络，该基质被气密地融合并与形成通孔壁的陶瓷层成一体陶瓷电路基板。

9. 发明授权

US5337475A Process for producing ceramic circuit structures having conductive vias 失效
标题翻译：具有导电孔的陶瓷电路结构的制造方法
公开(公告)号：US5337475A
公开(公告)日：1994-08-16
申请号：US992091
申请日：1992-12-17
申请人： Farid Y. Aoude , Emanuel I. Cooper , Peter R. Duncombe , Shaji Farooq , Edward A. Giess , Young-Ho Kim , Sarah H. Knickerbocker , Friedel Muller-Landau , Mark O. Neisser , Jae M. Park , Robert R. Shaw , Robert A. Rita , Thomas M. Shaw , Rao Vallabhaneni , Jon A. Van Hise , George F. Walker , Jungihl Kim , James M. Brownlow, deceased
发明人： Farid Y. Aoude , Emanuel I. Cooper , Peter R. Duncombe , Shaji Farooq , Edward A. Giess , Young-Ho Kim , Sarah H. Knickerbocker , Friedel Muller-Landau , Mark O. Neisser , Jae M. Park , Robert R. Shaw , Robert A. Rita , Thomas M. Shaw , Rao Vallabhaneni , Jon A. Van Hise , George F. Walker , Jungihl Kim , James M. Brownlow, deceased
IPC分类号： H01B1/16 , H01L21/48 , H01L23/498 , H05K1/03 , H05K1/09 , H05K3/46 , H01K3/10
CPC分类号： H05K1/092 , H01B1/16 , H01L21/486 , H01L21/4867 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/4611 , H05K3/4629 , Y10S428/901 , Y10T29/49147 , Y10T29/49165 , Y10T428/12472 , Y10T428/12556 , Y10T428/12604 , Y10T428/12611 , Y10T428/24322 , Y10T428/24802 , Y10T428/25 , Y10T428/251 , Y10T428/252 , Y10T428/2982 , Y10T428/2991
摘要： Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.
摘要翻译：用于在电路化陶瓷衬底，特别是多层衬底中产生导电通孔的改进的充填组合物，而不会破裂和/或损失气密密封。通孔填充组合物包含含有（a）在约0.5至6μm之间具有基本均匀直径的陶瓷和/或玻璃球的混合物的浆料，（b）具有约1至约6μm的最大尺寸或直径的导电金属颗粒或球体 / 3和1/4的陶瓷和/或玻璃球的直径，和（c）粘合剂载体。形成的导电通孔体包括致密地包裹在共烧结陶瓷和/或玻璃球的均匀基质内的烧结金属颗粒的均匀导电骨架网络，该基质被气密地融合并与形成通孔壁的陶瓷层成一体陶瓷电路基板。

10. 发明授权

US5531022A Method of forming a three dimensional high performance interconnection package 失效
公开(公告)号：US5531022A
公开(公告)日：1996-07-02
申请号：US300620
申请日：1994-09-02
申请人： Brain S. Beaman , Fuad E. Doany , Keith E. Fogel , James L. Hedrick, Jr. , Paul A. Lauro , Maurice H. Norcott , John J. Ritsko , Leathen Shi , Da-Yuan Shih , George F. Walker
发明人： Brain S. Beaman , Fuad E. Doany , Keith E. Fogel , James L. Hedrick, Jr. , Paul A. Lauro , Maurice H. Norcott , John J. Ritsko , Leathen Shi , Da-Yuan Shih , George F. Walker
IPC分类号： H01L23/52 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L23/498 , H01L23/538 , H01L25/065 , H01L25/07 , H01L25/18 , H05K3/40 , H01R9/09
CPC分类号： G01R1/07371 , G01R1/07307 , G01R1/07314 , G01R1/07342 , G01R3/00 , G01R31/2886 , H01L23/49827 , H01L23/5384 , H01L25/0652 , G01R1/06711 , G01R1/0675 , G01R1/07378 , H01L2224/1134 , H01L2224/13099 , H01L2224/16 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/45164 , H01L2224/48091 , H01L2224/48227 , H01L2224/78301 , H01L2224/85205 , H01L2224/85214 , H01L24/45 , H01L24/48 , H01L2924/00013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/1627 , H01L2924/19107 , H01L2924/3011 , Y10S29/029 , Y10T29/49004 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49158 , Y10T29/49162 , Y10T29/49192 , Y10T29/53174
摘要： The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection means electrically interconnecting each assembly. The electrical interconnection means is formed from an elastomeric interposer. The elastomeric interposer is formed from an elastomeric material having a plurality of electrical conductors extending therethrough, either in a clustered or un-clustered arrangement. The electrical interconnection means is fabricated having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection means is disposed over the array of electronic devices so that the electrical interconnection means is between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection means between adjacent assemblies. The substrate or each assembly is formed from a thermally conductive material such as diamond. A heat dissipation means is thermally connected to the edges of the substrate to extract heat generated within the structure. Methods for fabricating the electrical interconnection means as a stand alone elastomeric sheet are described. The ends of the plurality of conductors in the electrical interconnection means are fabricated so that upon compression between adjacent assemblies there is a wiping action between the conductor ends and contact locations on the adjacent assemblies to form a good electrical contact therewith.

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