专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120007625A1 Test Socket for Testing Electrical Characteristics of a Memory Module 有权
标题翻译：用于测试内存模块电气特性的测试插座
公开(公告)号：US20120007625A1
公开(公告)日：2012-01-12
申请号：US13165927
申请日：2011-06-22
申请人： Jung-Hoon Kim , Yong-Hyun Kim , Seong-Chan Han , Kwang-Su Yu , Jae-Seon Hwang
发明人： Jung-Hoon Kim , Yong-Hyun Kim , Seong-Chan Han , Kwang-Su Yu , Jae-Seon Hwang
IPC分类号： H01R24/00 , H01R13/62 , G01R1/06
CPC分类号： H01R12/87 , G01R1/0441 , H01R2201/20
摘要： A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage.
摘要翻译：测试插座可以包括插座框架，板，插座销和连接件。插座框架可以具有配置成接受对象的插槽。板可以沿着物体的插入方向在槽中自由移动以支撑物体的下表面。插座销可以沿着与物体的插入方向基本垂直的方向可移动地布置。插座销可以选择性地与物体的突片接触。连杆可以枢转地连接到插座销和板。因此，测试插座的插座销可以避免在插入期间沿着物体的突出部拖动，因此，物体的突片可以避免损坏。

2. 发明授权

US08616907B2 Test socket for testing electrical characteristics of a memory module 有权
标题翻译：用于测试内存模块电气特性的测试插座
公开(公告)号：US08616907B2
公开(公告)日：2013-12-31
申请号：US13165927
申请日：2011-06-22
申请人： Jung-Hoon Kim , Yong-Hyun Kim , Seong-Chan Han , Kwang-Su Yu , Jae-Seon Hwang
发明人： Jung-Hoon Kim , Yong-Hyun Kim , Seong-Chan Han , Kwang-Su Yu , Jae-Seon Hwang
IPC分类号： H01R13/15
CPC分类号： H01R12/87 , G01R1/0441 , H01R2201/20
摘要： A test socket may include a socket frame, a plate, a socket pin and a link. The socket frame may have a slot configured to accept an object. The plate may be free to move in the slot along an inserting direction of the object to support a lower surface of the object. The socket pin may be movably arranged in a direction substantially perpendicular to the inserting direction of the object. The socket pin may selectively make contact with a tab of the object. A link may be pivotally connected to the socket pin and the plate. Thus, the socket pin of the test socket may avoid dragging along the tab of the object during insertion, and accordingly, the tab of the object may avoid damage.
摘要翻译：测试插座可以包括插座框架，板，插座销和连接件。插座框架可以具有配置成接受对象的插槽。板可以沿着物体的插入方向在槽中自由移动以支撑物体的下表面。插座销可以沿着与物体的插入方向基本垂直的方向可移动地布置。插座销可以选择性地与物体的突片接触。连杆可以枢转地连接到插座销和板。因此，测试插座的插座销可以避免在插入期间沿着物体的突出部拖动，因此，物体的突片可以避免损坏。

3. 发明申请

US20110079872A1 PASSIVE DEVICE, SEMICONDUCTOR MODULE, ELECTRONIC CIRCUIT BOARD, AND ELECTRONIC SYSTEM HAVING THE PASSIVE DEVICE, AND METHODS OF FABRICATING AND INSPECTING THE SEMICONDUCTOR MODULE 审中-公开
标题翻译：被动装置，半导体模块，电子电路板和具有被动装置的电子系统，以及制造和检查半导体模块的方法
公开(公告)号：US20110079872A1
公开(公告)日：2011-04-07
申请号：US12772351
申请日：2010-05-03
申请人： Seong-Chan HAN , Jin-Kyu Yang , Jae-Young Kim , Kwang-Su Yu
发明人： Seong-Chan HAN , Jin-Kyu Yang , Jae-Young Kim , Kwang-Su Yu
IPC分类号： H01L29/86
CPC分类号： H05K1/023 , H01L24/16 , H01L29/86 , H01L2224/16 , H01L2924/01077 , H01L2924/04941 , H01L2924/14 , H01L2924/19015 , H05K1/0269 , H05K3/3442 , H05K3/3484 , H05K2201/09181 , H05K2201/09781 , H05K2201/10515 , H05K2201/10734 , Y02P70/613 , H01L2924/00
摘要： Provided are a passive device of a semiconductor module, a semiconductor module having the passive device, an electronic circuit board and electronic system having the passive device or semiconductor module, and methods of fabricating and inspecting the semiconductor module. The passive device of the semiconductor module includes a main body and at least two real electrodes disposed on one lateral surface of the main body.
摘要翻译：提供半导体模块的无源器件，具有无源器件的半导体模块，具有无源器件或半导体模块的电子电路板和电子系统以及制造和检查半导体模块的方法。半导体模块的无源器件包括主体和设置在主体的一个侧表面上的至少两个实际电极。

4. 发明申请

US20070047377A1 Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly 有权
标题翻译：内存模块印制电路板，制造方法及内存模块/插座组件
公开(公告)号：US20070047377A1
公开(公告)日：2007-03-01
申请号：US11500960
申请日：2006-08-09
申请人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
发明人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
IPC分类号： G11C8/00
CPC分类号： H05K3/403 , H01L2224/48091 , H01L2224/4824 , H05K3/0052 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K2201/0355 , H05K2201/0919 , H05K2203/1189 , H01L2924/00014
摘要： Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.
摘要翻译：本发明的示例性实施例可以包括印刷电路板，制造印刷电路板的方法和存储器模块/插座组件。本发明的示例实施例可以增加存储器模块上的接触抽头的数量，此外，可以减少将存储器模块插入模块插座所需的力。

5. 发明授权

US07576437B2 Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
标题翻译：半导体封装的印刷电路板和使用其的半导体封装的安装方法
公开(公告)号：US07576437B2
公开(公告)日：2009-08-18
申请号：US11598755
申请日：2006-11-14
申请人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
发明人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
IPC分类号： H01L23/48 , H01L23/495
CPC分类号： H05K3/3421 , H05K3/243 , H05K3/282 , H05K3/3452 , H05K2201/0989 , H05K2201/099 , H05K2201/10689 , H05K2203/046 , Y02P70/613
摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.
摘要翻译：示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。半导体封装的引线可以安装在绝缘基板上。连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊料焊接涂覆到半导体封装引线的肩部。

6. 发明授权

US08189342B2 Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly 有权
标题翻译：内存模块印制电路板，制造方法及内存模块/插座组件
公开(公告)号：US08189342B2
公开(公告)日：2012-05-29
申请号：US11500960
申请日：2006-08-09
申请人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
发明人： Hyo-Jae Bang , Dong-Chun Lee , Ho-Geon Song , Seong-Chan Han , Kwang-Su Yu , Dong-Woo Shin
IPC分类号： H05K1/14
CPC分类号： H05K3/403 , H01L2224/48091 , H01L2224/4824 , H05K3/0052 , H05K3/4069 , H05K3/4614 , H05K3/4647 , H05K2201/0355 , H05K2201/0919 , H05K2203/1189 , H01L2924/00014
摘要： Example embodiments of the present invention may include a printed circuit board, a method of manufacturing the printed circuit board, and a memory module/socket assembly. Example embodiments of the present invention may increase the number of contact taps on a memory module, in addition, a force required to insert the memory module into a module socket may be decreased.
摘要翻译：本发明的示例性实施例可以包括印刷电路板，制造印刷电路板的方法和存储器模块/插座组件。本发明的示例实施例可以增加存储器模块上的接触抽头的数量，此外，可以减少将存储器模块插入模块插座所需的力。

7. 发明申请

US20070109758A1 Printed circuit board of semiconductor package and method for mounting semiconductor package using the same 失效
标题翻译：半导体封装的印刷电路板和使用其的半导体封装的安装方法
公开(公告)号：US20070109758A1
公开(公告)日：2007-05-17
申请号：US11598755
申请日：2006-11-14
申请人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
发明人： Seong-Chan Han , Dong-Chun Lee , Kwang-Su Yu , Dong-Woo Shin , Hyo-Jae Bang , Hyun-Seok Choi , Si-Suk Kim
IPC分类号： H05K7/00
CPC分类号： H05K3/3421 , H05K3/243 , H05K3/282 , H05K3/3452 , H05K2201/0989 , H05K2201/099 , H05K2201/10689 , H05K2203/046 , Y02P70/613
摘要： Example embodiments may be directed to a printed circuit board having an insulating substrate, pads disposed on the surface of the insulating substrate, a solder resist, and a solder moving portion. Leads of a semiconductor package may be mounted on the insulating substrate. The pads to which the leads of the semiconductor package are connected may be disposed on the surface of the insulating substrate. The solder resist layer may cover the insulating substrate, but may also contain openings exposing at least a portion of the pads to which the leads of the semiconductor package are connected. During the process by which each semiconductor lead is connected to a pad, the solder moving portion on the pad may allow an adhesion solder coating each of the leads of the semiconductor package to move towards a shoulder portion of the semiconductor package leads.
摘要翻译：示例性实施例可以涉及具有绝缘基板，设置在绝缘基板的表面上的焊盘，阻焊剂和焊料移动部分的印刷电路板。半导体封装的引线可以安装在绝缘基板上。连接半导体封装的引线的焊盘可以设置在绝缘基板的表面上。阻焊层可以覆盖绝缘基板，但也可以包含露出半导体封装的引线连接到的焊盘的至少一部分的开口。在每个半导体引线连接到焊盘的过程中，焊盘上的焊料移动部分可以允许将半导体封装的每个引线的每个引线的焊锡涂层移动到半导体封装引线的肩部。

8. 发明授权

US07521788B2 Semiconductor module with conductive element between chip packages 有权
标题翻译：具有芯片封装之间导电元件的半导体模块
公开(公告)号：US07521788B2
公开(公告)日：2009-04-21
申请号：US11233078
申请日：2005-09-23
申请人： Hyo-Jae Bang , Byung-Man Kim , Dong-Chun Lee , Kwang-Su Yu
发明人： Hyo-Jae Bang , Byung-Man Kim , Dong-Chun Lee , Kwang-Su Yu
IPC分类号： H01L23/48 , H01L21/00 , H05K1/14 , H01R12/00
CPC分类号： H05K3/325 , H01L25/105 , H01L2224/32225 , H01L2224/48091 , H01L2224/4824 , H01L2224/73215 , H01L2225/1023 , H01L2225/1058 , H01L2225/107 , H01L2225/1094 , H01L2924/01079 , H01L2924/15311 , H01L2924/15331 , H01L2924/1627 , H01L2924/3511 , H05K2201/0314 , H05K2201/10515 , H05K2201/10734 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A semiconductor module and a method of manufacturing a semiconductor module including at least one chip package, at least one module board, at least one conductive element provided between the first chip package and the module board and a protector for applying pressure to the conductive element, the module board, and the first chip package and/or acting as a heat sink for the first chip package.
摘要翻译：一种半导体模块和半导体模块的制造方法，所述半导体模块包括至少一个芯片封装，至少一个模块板，设置在所述第一芯片封装和所述模块板之间的至少一个导电元件和用于向所述导电元件施加压力的保护器，模块板和第一芯片封装和/或用作第一芯片封装的散热器。

9. 发明申请

US20050118878A1 Open socket 失效
标题翻译：打开插座
公开(公告)号：US20050118878A1
公开(公告)日：2005-06-02
申请号：US10868976
申请日：2004-06-17
申请人： Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
发明人： Dong-Chun Lee , Byung-Man Kim , Kwang-Su Yu , Dong-Woo Shin , Young-Soo Lee
IPC分类号： H01R33/76 , H01R13/24 , H01R24/00
CPC分类号： H01R13/2471 , H01R13/111
摘要： An open socket, into which a module can be inserted, may include: a body into which the module is insertable; a pin to contact an electrical connection member of the inserted module, the pin serving as at least a part of an electrical signal path to/from the module upon insertion thereof; an elastic biasing member to exert an elastic biasing force to cause the pin to contact the module; and at least one lower support to limit insertion depth as being a depth at which a lower portion of the inserted module comes to rest upon the at least one lower support; the body and the at least one lower support being constructed and arranged to provide a gap adjacent the at least one support, which leaves an area of the socket underlying the lower portion of the inserted module open to the outside.
摘要翻译：可以插入模块的开放式插座可以包括：可插入模块的主体; 一个与所插入的模块的电连接构件接触的销，所述销用作在插入模块时与模块电信号路径的至少一部分的一部分; 弹性偏置构件，以施加弹性偏压力以使销与模块接触; 以及至少一个下部支撑件，以将插入深度限制为所述插入模块的下部部分停靠在所述至少一个下部支撑件上的深度; 所述主体和所述至少一个下支撑件被构造和布置成提供邻近所述至少一个支撑件的间隙，所述间隙将所述插入模块的下部的下方的所述插座的区域留在外部。

10. 发明申请

US20070181993A1 Printed circuit board including reinforced copper plated film and method of fabricating the same 审中-公开
标题翻译：包括增强镀铜膜的印刷电路板及其制造方法
公开(公告)号：US20070181993A1
公开(公告)日：2007-08-09
申请号：US11699498
申请日：2007-01-30
申请人： Jae-Hoon Choi , Kwang-Su Yu , Hyo-Jae Bang , Dong-Chun Lee
发明人： Jae-Hoon Choi , Kwang-Su Yu , Hyo-Jae Bang , Dong-Chun Lee
IPC分类号： H01L23/04
CPC分类号： H05K1/09 , H05K3/241 , H05K3/282 , H05K3/428 , H05K2201/0209 , H05K2201/0215
摘要： A printed circuit board (PCB) may include a substrate. A copper layer may be formed over a portion of the substrate, the copper layer including at least one of a metallic powder and a ceramic powder.
摘要翻译：印刷电路板（PCB）可以包括基板。可以在基板的一部分上形成铜层，铜层包括金属粉末和陶瓷粉末中的至少一种。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式