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1. 发明申请

US20140109824A1 METHOD OF GROWING SILICON SINGLE CRYSTAL 审中-公开
标题翻译：生产硅单晶的方法
公开(公告)号：US20140109824A1
公开(公告)日：2014-04-24
申请号：US13823932
申请日：2012-11-16
申请人： Jung Ha Hwang , Sang Hee Kim
发明人： Jung Ha Hwang , Sang Hee Kim
IPC分类号： C30B15/04 , C30B15/22
CPC分类号： C30B15/04 , C30B15/22 , C30B29/06
摘要： Disclosed is a method of growing a silicon single crystal. The method includes preparing a silicon melt, adding a dopant having a lower melting point than the silicon melt to the silicon melt, and growing a silicon single crystal from the silicon melt to which the dopant is added in the order of a neck, a shoulder, and a body. During the silicon single crystal growth, the length of a neck is adjusted in the range of 35 to 45 cm, and a ratio of inert gas quantity to pressure of a chamber is adjusted to 1.5 or less.
摘要翻译：公开了生长硅单晶的方法。该方法包括制备硅熔体，将具有比硅熔体更低的熔点的掺杂剂加入到硅熔体中，并且以从颈部，肩部的顺序从添加了掺杂剂的硅熔体生长硅单晶，和身体。在硅单晶生长期间，将颈部的长度调节在35〜45cm的范围内，将惰性气体与室的压力的比例调整为1.5以下。

2. 发明申请

US20110095321A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM 有权
标题翻译：发光装置包装和照明系统
公开(公告)号：US20110095321A1
公开(公告)日：2011-04-28
申请号：US12911466
申请日：2010-10-25
申请人： Yong Seon SONG , Jung Ha Hwang
发明人： Yong Seon SONG , Jung Ha Hwang
IPC分类号： H01L33/58
CPC分类号： H01L33/508 , H01L33/505 , H01L33/54 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48465 , H01L2224/8592 , H01L2924/0002 , H01L2924/181 , H01L2933/0041 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device (LED) package includes a submount and a light emitting chip. The submount has a chip region and a supporting region over which the chip is mounted, and an encapsulating material and fluorescent material are formed over the chip. The coverage area of encapsulating and fluorescent materials is substantially coextensive with the chip or chip region, and a first area between an edge of the chip region and an edge of the supporting region is greater than a second area between the edge of the chip region and the chip.
摘要翻译：发光器件（LED）封装包括底座和发光芯片。底座具有芯片区域和支撑区域，芯片安装在该支撑区域上，并且在芯片上形成封装材料和荧光材料。封装和荧光材料的覆盖区域与芯片或芯片区域基本上共同延伸，并且芯片区域的边缘和支撑区域的边缘之间的第一区域大于芯片区域的边缘与第二区域之间的第二区域芯片。

3. 发明授权

US5976241A Activated kaolin powder compound for mixing with cement and method of preparing the same 失效
标题翻译：用于与水泥混合的活性高岭土粉末化合物及其制备方法
公开(公告)号：US5976241A
公开(公告)日：1999-11-02
申请号：US925951
申请日：1997-09-08
申请人： Moon Han Kim , Hey Zoo Hwang , Jung Ha Hwang , Hee Sung Cha , Kwang Choon Kim , Jong Kuk Lee
发明人： Moon Han Kim , Hey Zoo Hwang , Jung Ha Hwang , Hee Sung Cha , Kwang Choon Kim , Jong Kuk Lee
IPC分类号： C04B14/10 , C04B18/02 , C04B22/08 , C04B28/02 , C04B103/60 , C04B111/24 , C04B14/00
CPC分类号： C04B18/025 , C04B14/106 , C04B28/02
摘要： The activated kaolin powder compound is prepared from naturally-existing kaolin (hereinafter "natural kaolin"). The activated kaolin powder compound is prepared by heating natural kaolin to 480.degree. C. within at most one hour, calcinating the heated kaolin at high temperature by heating to 980.degree. C. over at least one hour, quenching the calcinated kaolin with water or air, and pulverizing the quenched kaolin to give particle sizes of 2 .mu.m or less. The activated kaolin powder compound is employed in an amount of about 5 to 15% by weight of cement for preparing mortar or cement. The cement composition containing the activated kaolin powder compound can provide a mortar or concrete having superior properties in compressive strength, flexural strength and water permeability.
摘要翻译：活化的高岭土粉末化合物由天然存在的高岭土（以下称为“天然高岭土”）制备。活性高岭土粉末化合物的制备方法是将天然高岭土加热至480℃至多1小时，在高温下通过在至少1小时内加热至980℃煅烧加热的高岭土，用水或空气淬火煅烧的高岭土粉碎淬火后的高岭土，得到2μm以下的粒径。活性高岭土粉末化合物的使用量为用于制备砂浆或水泥的水泥的约5至15重量％。含有活性高岭土粉末化合物的水泥组合物可以提供具有优异的抗压强度，弯曲强度和透水性的砂浆或混凝土。

4. 发明申请

US20110095329A1 LIGHT EMITTING DEVICE PACKAGE 有权
标题翻译：发光装置包装
公开(公告)号：US20110095329A1
公开(公告)日：2011-04-28
申请号：US12900126
申请日：2010-10-07
申请人： Jung Ha Hwang
发明人： Jung Ha Hwang
IPC分类号： H01L33/62
CPC分类号： H01L33/505 , H01L24/45 , H01L33/54 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2924/01015 , H01L2924/01047 , H01L2924/01322 , H01L2924/12035 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： Provided are a light emitting device package and a lighting system. The light emitting device package includes a light emitting device chip, at least one wire, and an encapsulating material. The light emitting device chip includes a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer between the first and second conductive type semiconductor layers. The wire is on the light emitting device chip. The encapsulating material is on the light emitting device chip out of the wire, and includes a phosphor. The wire is perpendicular to an upper surface of the light emitting device chip, at least up to a height of the encapsulating material.
摘要翻译：提供了一种发光器件封装和照明系统。发光器件封装包括发光器件芯片，至少一根引线和封装材料。发光器件芯片包括第一导电类型半导体层，第一导电类型半导体层上的第二导电类型半导体层以及第一和第二导电类型半导体层之间的有源层。导线位于发光器件芯片上。封装材料位于发光器件芯片外的电线中，并且包括磷光体。导线垂直于发光器件芯片的上表面，至少高达封装材料的高度。

5. 发明授权

US09035325B2 Light emitting device package and lighting system 有权
标题翻译：发光装置封装和照明系统
公开(公告)号：US09035325B2
公开(公告)日：2015-05-19
申请号：US12911466
申请日：2010-10-25
申请人： Yong Seon Song , Jung Ha Hwang
发明人： Yong Seon Song , Jung Ha Hwang
IPC分类号： H01L33/00 , H01L33/50 , H01L33/54
CPC分类号： H01L33/508 , H01L33/505 , H01L33/54 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48465 , H01L2224/8592 , H01L2924/0002 , H01L2924/181 , H01L2933/0041 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
摘要： A light emitting device (LED) package includes a submount and a light emitting chip. The submount has a chip region and a supporting region over which the chip is mounted, and an encapsulating material and fluorescent material are formed over the chip. The coverage area of encapsulating and fluorescent materials is substantially coextensive with the chip or chip region, and a first area between an edge of the chip region and an edge of the supporting region is greater than a second area between the edge of the chip region and the chip.
摘要翻译：发光器件（LED）封装包括底座和发光芯片。底座具有芯片区域和支撑区域，芯片安装在该支撑区域上，并且在芯片上形成封装材料和荧光材料。封装和荧光材料的覆盖区域与芯片或芯片区域基本上共同延伸，并且芯片区域的边缘和支撑区域的边缘之间的第一区域大于芯片区域的边缘与第二区域之间的第二区域芯片。

6. 发明申请

US20110156579A1 LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHTING SYSTEM 有权
标题翻译：发光装置，发光装置包装和照明系统
公开(公告)号：US20110156579A1
公开(公告)日：2011-06-30
申请号：US12910276
申请日：2010-10-22
申请人： Kyoung Woo Jo , Jung Ha Hwang , Hyeong Seon Yun
发明人： Kyoung Woo Jo , Jung Ha Hwang , Hyeong Seon Yun
IPC分类号： H01J1/62
CPC分类号： H01L33/38 , H01L33/508 , H01L2224/45139 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a light emitting structure on the substrate, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer between the first and second conductive type semiconductor layers; a first electrode on the light emitting structure; and a patterned phosphor layer on the light emitting structure, wherein the patterned phosphor layer converts light generated from the light emitting structure into light having a wavelength longer than that of the light generated from the light emitting structure, and wherein the pattern of the phosphor layer exposes the first electrode.
摘要翻译：提供了一种发光器件，发光器件封装和照明系统。发光器件包括衬底，衬底上的发光结构，发光结构包括第一导电类型半导体层，第一导电类型半导体层上的第二导电类型半导体层以及第一和第二导电类型半导体层之间的有源层第二导电型半导体层; 在发光结构上的第一电极; 以及在所述发光结构上的图案化荧光体层，其中，所述图案化荧光体层将从所述发光结构产生的光转换为具有比从所述发光结构产生的光的波长更长的波长的光，并且其中所述荧光体层的图案暴露第一电极。

7. 发明授权

US08757841B2 Lighting device 有权
标题翻译：照明设备
公开(公告)号：US08757841B2
公开(公告)日：2014-06-24
申请号：US13287631
申请日：2011-11-02
申请人： Tae Young Choi , Won Jin Son , Dong Nyung Lim , Jung Ha Hwang , Seung Yeon Lee , Cheon Joo Kim , Sung Ho Kim
发明人： Tae Young Choi , Won Jin Son , Dong Nyung Lim , Jung Ha Hwang , Seung Yeon Lee , Cheon Joo Kim , Sung Ho Kim
IPC分类号： F21V3/00 , F21V29/00 , F21V23/00
CPC分类号： F21V29/74 , F21K9/23 , F21K9/232 , F21K9/238 , F21V3/00 , F21V19/0055 , F21V23/005 , F21V23/006 , F21V29/773 , F21V29/89 , F21Y2105/10 , F21Y2105/12 , F21Y2113/00 , F21Y2113/13 , F21Y2115/10
摘要： A lighting device may be provided that includes a heat sink which includes one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and includes a substrate and a plurality of light sources disposed on the substrate, wherein the substrate includes a hole and a plurality of via-holes; a power controller which includes an electrode pin electrically connected to the light emitting module through the via hole; and aninsulating inner case which receives the power controller therein and is disposed in the receiving recess of the heat sink, wherein the light sources include an lighting emitting diode.
摘要翻译：可以提供一种照明装置，其包括散热器，该散热器包括一个表面和一个接收凹部; 发光模块，其设置在所述散热器的一个表面上，并且包括基板和设置在所述基板上的多个光源，其中所述基板包括孔和多个通孔; 功率控制器，其包括通过所述通孔电连接到所述发光模块的电极引脚; 以及在内部接收功率控制器并且设置在散热器的接收凹部中的绝缘内壳体，其中光源包括发光二极管。

8. 发明授权

US08415698B2 Light emitting device with encapsulant formed with barriers and light emitting device package having the same 有权
公开(公告)号：US08415698B2
公开(公告)日：2013-04-09
申请号：US12909438
申请日：2010-10-21
申请人： Jung Ha Hwang , Kyoung Woo Jo
发明人： Jung Ha Hwang , Kyoung Woo Jo
IPC分类号： H01L33/00 , H01L21/00 , F21V9/16 , G09F13/04 , G09F13/08
CPC分类号： H01L33/50 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/508 , H01L33/54 , H01L2924/0002 , H01L2924/00
摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device (LED) comprises an LED chip, a barrier over the LED chip, and an encapsulating material containing a phosphor, wherein the encapsulating material is disposed inside the barrier over the LED chip.

9. 发明授权

US08395180B2 Light emitting device package 有权
标题翻译：发光装置封装
公开(公告)号：US08395180B2
公开(公告)日：2013-03-12
申请号：US12900126
申请日：2010-10-07
申请人： Jung Ha Hwang
发明人： Jung Ha Hwang
IPC分类号： H01L33/62 , H01L33/60 , H01L33/00
CPC分类号： H01L33/505 , H01L24/45 , H01L33/54 , H01L33/62 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2924/01015 , H01L2924/01047 , H01L2924/01322 , H01L2924/12035 , H01L2924/181 , H01L2924/00014 , H01L2924/00
摘要： Provided are a light emitting device package and a lighting system. The light emitting device package includes a light emitting device chip, at least one wire, and an encapsulating material. The light emitting device chip includes a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer between the first and second conductive type semiconductor layers. The wire is on the light emitting device chip. The encapsulating material is on the light emitting device chip out of the wire, and includes a phosphor. The wire is perpendicular to an upper surface of the light emitting device chip, at least up to a height of the encapsulating material.
摘要翻译：提供了一种发光器件封装和照明系统。发光器件封装包括发光器件芯片，至少一根引线和封装材料。发光器件芯片包括第一导电类型半导体层，第一导电类型半导体层上的第二导电类型半导体层以及第一和第二导电类型半导体层之间的有源层。导线位于发光器件芯片上。封装材料位于发光器件芯片外的电线中，并且包括磷光体。导线垂直于发光器件芯片的上表面，至少高达封装材料的高度。

10. 发明授权

US08368300B2 Light emitting device, light emitting device package, and lighting system 有权
标题翻译：发光装置，发光装置封装和照明系统
公开(公告)号：US08368300B2
公开(公告)日：2013-02-05
申请号：US12910276
申请日：2010-10-22
申请人： Kyoung Woo Jo , Jung Ha Hwang , Hyeong Seon Yun
发明人： Kyoung Woo Jo , Jung Ha Hwang , Hyeong Seon Yun
IPC分类号： H01J1/62
CPC分类号： H01L33/38 , H01L33/508 , H01L2224/45139 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a light emitting structure on the substrate, the light emitting structure comprising a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer between the first and second conductive type semiconductor layers; a first electrode on the light emitting structure; and a patterned phosphor layer on the light emitting structure, wherein the patterned phosphor layer converts light generated from the light emitting structure into light having a wavelength longer than that of the light generated from the light emitting structure, and wherein the pattern of the phosphor layer exposes the first electrode.
摘要翻译：提供了一种发光器件，发光器件封装和照明系统。发光器件包括衬底，衬底上的发光结构，发光结构包括第一导电类型半导体层，第一导电类型半导体层上的第二导电类型半导体层以及第一和第二导电类型半导体层之间的有源层第二导电型半导体层; 在发光结构上的第一电极; 以及在所述发光结构上的图案化荧光体层，其中，所述图案化荧光体层将从所述发光结构产生的光转换为具有比从所述发光结构产生的光的波长更长的波长的光，并且其中所述荧光体层的图案暴露第一电极。

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