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1. 发明申请

US20080044981A1 Trench Isolation Methods, Methods of Forming Gate Structures Using the Trench Isolation Methods and Methods of Fabricating Non-Volatile Memory Devices Using the Trench Isolation Methods 审中-公开
标题翻译：沟槽隔离方法，使用沟槽隔离方法形成栅极结构的方法和使用沟槽隔离方法制造非易失性存储器件的方法
公开(公告)号：US20080044981A1
公开(公告)日：2008-02-21
申请号：US11769042
申请日：2007-06-27
申请人： Jung Geun Jee , Won-Jun Jang , Woong Lee , Ho-Min Son , Won-Jun Lee , Hyoeng-Ki Kim , Jung-Hyun Park
发明人： Jung Geun Jee , Won-Jun Jang , Woong Lee , Ho-Min Son , Won-Jun Lee , Hyoeng-Ki Kim , Jung-Hyun Park
IPC分类号： H01L21/3205 , H01L21/762
CPC分类号： H01L21/76232
摘要： Methods of fabricating semiconductor devices including forming a mask pattern on a semiconductor substrate are provided. The mask pattern defines a first opening that at least partially exposes the semiconductor substrate and includes a pad oxide layer and a nitride layer pattern on the pad oxide layer pattern. The nitride layer has a line width substantially larger than the pad oxide layer pattern. A second opening that is connected to the first opening is formed by at least partially removing a portion of the semiconductor substrate exposed through the first opening. The second opening has a sidewall that has a first inclination angle and at least partially exposing the semiconductor substrate. A trench connected to the second opening is formed by etching a portion of the semiconductor substrate exposed through the second opening using the mask pattern as an etch mask. The trench is substantially narrower than the second opening and has a sidewall that has a second inclination angle that is substantially larger than the first inclination angle.
摘要翻译：提供制造包括在半导体衬底上形成掩模图案的半导体器件的方法。掩模图案限定了至少部分地暴露半导体衬底并且在衬垫氧化物层图案上包括衬垫氧化物层和氮化物层图案的第一开口。氮化物层具有基本上大于衬垫氧化物层图案的线宽。通过至少部分去除通过第一开口暴露的半导体衬底的一部分，形成连接到第一开口的第二开口。第二开口具有具有第一倾斜角并且至少部分地暴露半导体衬底的侧壁。通过使用掩模图案蚀刻通过第二开口暴露的半导体衬底的一部分来形成连接到第二开口的沟槽作为蚀刻掩模。沟槽基本上比第二开口窄，并且具有侧壁，该侧壁的第二倾斜角度基本上大于第一倾斜角度。

2. 发明申请

US20080014729A1 Method of manufacturing a memory device 审中-公开
标题翻译：制造存储器件的方法
公开(公告)号：US20080014729A1
公开(公告)日：2008-01-17
申请号：US11820516
申请日：2007-06-20
申请人： Woong Lee , Jung-Geun Jee , Hyoeng-Ki Kim , Jung-Hyun Park , Ho-Min Son , Won-Jun Jang
发明人： Woong Lee , Jung-Geun Jee , Hyoeng-Ki Kim , Jung-Hyun Park , Ho-Min Son , Won-Jun Jang
IPC分类号： H01L21/3205
CPC分类号： H01L29/40114
摘要： In a method of manufacturing a memory device, a tunnel insulation layer and a floating gate layer are formed on a semiconductor substrate. A top surface of the floating gate layer is converted into a first nitride layer by a first nitridation treatment process. The first nitride layer is converted into a first oxynitride layer by a radical oxidation process. A lower oxide layer is formed on the first oxynitride layer by an LPCVD process. A second nitride layer and an upper oxide layer are formed on the lower oxide layer. A conductive layer is formed on the upper oxide layer. Thus, a multi-layered dielectric layer including the first oxynitride layer, the lower oxide layer, the second nitride layer, the upper oxide layer and the densified second oxynitride layer may have an increased capacitance without having degenerated leakage current characteristics.
摘要翻译：在制造存储器件的方法中，在半导体衬底上形成隧道绝缘层和浮栅层。通过第一氮化处理工艺将浮栅层的顶表面转化为第一氮化物层。第一氮化物层通过自由基氧化法转化为第一氮氧化物层。通过LPCVD工艺在第一氮氧化物层上形成低氧化物层。第二氮化物层和上氧化物层形成在低氧化物层上。导电层形成在上氧化物层上。因此，包括第一氧氮化物层，下氧化物层，第二氮化物层，上氧化物层和致密化的第二氧氮化物层的多层电介质层可以具有增加的电容而不具有退化的漏电流特性。

3. 发明授权

US07972923B2 Non-volatile memory device and method of manufacturing the same 失效
标题翻译：非易失性存储器件及其制造方法
公开(公告)号：US07972923B2
公开(公告)日：2011-07-05
申请号：US11605317
申请日：2006-11-29
申请人： Jung-Hyun Park , Jung-Geun Jee , Hyoeng-Ki Kim , Yong-Woo Hyung , Won-Jun Jang
发明人： Jung-Hyun Park , Jung-Geun Jee , Hyoeng-Ki Kim , Yong-Woo Hyung , Won-Jun Jang
IPC分类号： H01L21/336
CPC分类号： H01L29/7881 , H01L29/66825
摘要： A semiconductor device may include a tunnel insulating layer disposed on an active region of a substrate, field insulating patterns disposed in surface portions of the substrate to define the active region, each of the field insulating patterns having an upper recess formed at an upper surface portion thereof, a stacked structure disposed on the tunnel insulating layer, and impurity diffusion regions disposed at surface portions of the active region adjacent to the stacked structure.
摘要翻译：半导体器件可以包括设置在衬底的有源区上的隧道绝缘层，设置在衬底的表面部分中以限定有源区的场绝缘图案，每个场绝缘图案具有形成在上表面部分的上凹部设置在隧道绝缘层上的堆叠结构，以及设置在与堆叠结构相邻的有源区的表面部分处的杂质扩散区。

4. 发明申请

US20080105915A1 Non-volatile memory device and method of manufacturing the same 失效
标题翻译：非易失性存储器件及其制造方法
公开(公告)号：US20080105915A1
公开(公告)日：2008-05-08
申请号：US11605317
申请日：2006-11-29
申请人： Jung-Hyun Park , Jung-Geun Jee , Hyoeng-Ki Kim , Yong-Woo Hyung , Won-Jun Jang
发明人： Jung-Hyun Park , Jung-Geun Jee , Hyoeng-Ki Kim , Yong-Woo Hyung , Won-Jun Jang
IPC分类号： H01L29/76
CPC分类号： H01L29/7881 , H01L29/66825
摘要： A semiconductor device may include a tunnel insulating layer disposed on an active region of a substrate, field insulating patterns disposed in surface portions of the substrate to define the active region, each of the field insulating patterns having an upper recess formed at an upper surface portion thereof, a stacked structure disposed on the tunnel insulating layer, and impurity diffusion regions disposed at surface portions of the active region adjacent to the stacked structure.
摘要翻译：半导体器件可以包括设置在衬底的有源区上的隧道绝缘层，设置在衬底的表面部分中以限定有源区的场绝缘图案，每个场绝缘图案具有形成在上表面部分的上凹部设置在隧道绝缘层上的堆叠结构，以及设置在与堆叠结构相邻的有源区的表面部分处的杂质扩散区。

5. 发明申请

US20070026651A1 Method of manufacturing a semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US20070026651A1
公开(公告)日：2007-02-01
申请号：US11480380
申请日：2006-07-05
申请人： Hun-Hyeoung Leam , Hyeon-Deok Lee , Young-Sub You , Won-Jun Jang , Woong Lee , Jung-Hyun Park , Sang-Kyoung Lee , Jung-Geun Jee , Sang-Hoon Lee
发明人： Hun-Hyeoung Leam , Hyeon-Deok Lee , Young-Sub You , Won-Jun Jang , Woong Lee , Jung-Hyun Park , Sang-Kyoung Lee , Jung-Geun Jee , Sang-Hoon Lee
IPC分类号： H01L21/38
CPC分类号： H01L21/28273 , H01L21/32115 , H01L27/115 , H01L27/11521 , H01L29/42324
摘要： In a method of manufacturing a semiconductor device such as a flash memory device, an insulating pattern having an opening is formed to partially expose a surface of a substrate. A first silicon layer is formed on the exposed surface portion of the substrate and the insulating pattern. The first silicon layer has an opened seam overlying the previously exposed portion of the substrate. A heat treatment on the substrate is performed at a temperature sufficient to induce silicon migration so as to cause the opened seam to be closed via the silicon migration. A second silicon layer is then formed on the first silicon layer. Thus, surface profile of a floating gate electrode obtained from the first and second silicon layers may be improved.
摘要翻译：在制造诸如闪速存储器件的半导体器件的方法中，形成具有开口的绝缘图案以部分地暴露衬底的表面。第一硅层形成在基板的露出表面部分和绝缘图案上。第一硅层具有覆盖衬底的先前暴露部分的开口接缝。在足以诱导硅迁移的温度下进行在基板上的热处理，以便通过硅迁移使开放的接缝闭合。然后在第一硅层上形成第二硅层。因此，可以提高从第一和第二硅层获得的浮栅的表面轮廓。

6. 发明授权

US07410869B2 Method of manufacturing a semiconductor device 失效
标题翻译：制造半导体器件的方法
公开(公告)号：US07410869B2
公开(公告)日：2008-08-12
申请号：US11480380
申请日：2006-07-05
申请人： Hun-Hyeoung Leam , Hyeon-Deok Lee , Young-Sub You , Won-Jun Jang , Woong Lee , Jung-Hyun Park , Sang-Kyoung Lee , Jung-Geun Jee , Sang-Hoon Lee
发明人： Hun-Hyeoung Leam , Hyeon-Deok Lee , Young-Sub You , Won-Jun Jang , Woong Lee , Jung-Hyun Park , Sang-Kyoung Lee , Jung-Geun Jee , Sang-Hoon Lee
IPC分类号： H01L21/336
CPC分类号： H01L21/28273 , H01L21/32115 , H01L27/115 , H01L27/11521 , H01L29/42324
摘要： In a method of manufacturing a semiconductor device such as a flash memory device, an insulating pattern having an opening is formed to partially expose a surface of a substrate. A first silicon layer is formed on the exposed surface portion of the substrate and the insulating pattern. The first silicon layer has an opened seam overlying the previously exposed portion of the substrate. A heat treatment on the substrate is performed at a temperature sufficient to induce silicon migration so as to cause the opened seam to be closed via the silicon migration. A second silicon layer is then formed on the first silicon layer. Thus, surface profile of a floating gate electrode obtained from the first and second silicon layers may be improved.
摘要翻译：在制造诸如闪速存储器件的半导体器件的方法中，形成具有开口的绝缘图案以部分地暴露衬底的表面。第一硅层形成在基板的露出表面部分和绝缘图案上。第一硅层具有覆盖衬底的先前暴露部分的开口接缝。在足以诱导硅迁移的温度下进行在基板上的热处理，以便通过硅迁移使开放的接缝闭合。然后在第一硅层上形成第二硅层。因此，可以提高从第一和第二硅层获得的浮栅的表面轮廓。

7. 发明申请

US20070020841A1 Method of manufacturing gate structure and method of manufacturing semiconductor device including the same 审中-公开
标题翻译：制造栅极结构的方法和制造其的半导体器件的制造方法
公开(公告)号：US20070020841A1
公开(公告)日：2007-01-25
申请号：US11490154
申请日：2006-07-21
申请人： Ki-Hyun Hwang , Won-Jun Jang , Jae-Young Ahn , Chang-Sup Mun , Jung-Hyun Park
发明人： Ki-Hyun Hwang , Won-Jun Jang , Jae-Young Ahn , Chang-Sup Mun , Jung-Hyun Park
IPC分类号： H01L21/8238
CPC分类号： B82Y10/00 , H01L21/823425 , H01L21/823462 , H01L27/115 , H01L27/11521
摘要： In a method for manufacturing a semiconductor device, a silicon oxide layer is formed on a substrate. The silicon oxide layer is treated with a solution comprising ozone. Then, a conductive layer is formed on the silicon oxide layer treated with the solution.
摘要翻译：在半导体装置的制造方法中，在基板上形成氧化硅层。氧化硅层用包含臭氧的溶液处理。然后，在用该溶液处理的氧化硅层上形成导电层。

8. 发明授权

US08592269B2 Method of manufacturing gate structure and method of manufacturing semiconductor device including the same 有权
标题翻译：制造栅极结构的方法和制造其的半导体器件的制造方法
公开(公告)号：US08592269B2
公开(公告)日：2013-11-26
申请号：US12942107
申请日：2010-11-09
申请人： Ki-Hyun Hwang , Won-Jun Jang , Jae-Young Ahn , Chang-Sup Mun , Jung-Hyun Park
发明人： Ki-Hyun Hwang , Won-Jun Jang , Jae-Young Ahn , Chang-Sup Mun , Jung-Hyun Park
IPC分类号： H01L21/8238
CPC分类号： B82Y10/00 , H01L21/823425 , H01L21/823462 , H01L27/115 , H01L27/11521
摘要： In a method for manufacturing a semiconductor device, a silicon oxide layer is formed on a substrate. The silicon oxide layer is treated with a solution comprising ozone. Then, a conductive layer is formed on the silicon oxide layer treated with the solution.
摘要翻译：在半导体装置的制造方法中，在基板上形成氧化硅层。氧化硅层用包含臭氧的溶液处理。然后，在用该溶液处理的氧化硅层上形成导电层。

9. 发明申请

US20120111607A1 CIRCUIT BOARD WITH HIGH-DENSITY CIRCUIT PATTERNS 有权
标题翻译：具有高密度电路图形的电路板
公开(公告)号：US20120111607A1
公开(公告)日：2012-05-10
申请号：US13354438
申请日：2012-01-20
申请人： Shuhichi OKABE , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
发明人： Shuhichi OKABE , Myung-Sam Kang , Jung-Hyun Park , Hoe-Ku Jung , Jeong-Woo Park , Ji-Eun Kim
IPC分类号： H05K1/02
CPC分类号： H05K1/0265 , H05K1/116 , H05K3/107 , H05K3/108 , H05K3/205 , H05K3/421 , H05K2201/0379 , H05K2201/0394 , H05K2201/09509 , H05K2201/09736 , H05K2203/0361
摘要： A circuit board including: an insulator having a trench; a first circuit pattern formed to bury a portion of the trench; and a second circuit pattern formed on a surface of the insulator having the trench formed therein.
摘要翻译：一种电路板，包括：具有沟槽的绝缘体; 形成为埋入沟槽的一部分的第一电路图案; 以及形成在其中形成有沟槽的绝缘体的表面上的第二电路图案。

10. 发明授权

US07992291B2 Method of manufacturing a circuit board 有权
标题翻译：制造电路板的方法
公开(公告)号：US07992291B2
公开(公告)日：2011-08-09
申请号：US11976070
申请日：2007-10-19
申请人： Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
发明人： Hoe-Ku Jung , Je-Gwang Yoo , Myung-Sam Kang , Ji-Eun Kim , Jeong-Woo Park , Jung-Hyun Park
IPC分类号： H05K3/20 , H05K1/18
CPC分类号： H05K3/205 , H01L21/4846 , H01L23/49816 , H01L2224/16225 , H01L2224/16227 , H01L2224/73204 , H01L2924/15311 , H05K3/4007 , H05K2201/09745 , H05K2201/10674 , H05K2203/0338 , H05K2203/0435 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165
摘要： A method of manufacturing a circuit board, which includes a bump pad on which a solder bump may be placed, may include forming a solder pad on a surface of a first carrier; forming a metal film, which covers the solder pad and which extends to a bump pad forming region; forming a circuit layer and a circuit pattern, which are electrically connected with the metal film, on a surface of the first carrier; pressing the first carrier and an insulator such that a surface of the first carrier and the insulator faces each other; and removing the first carrier. Utilizing this method, the amount of solder for the contacting of a flip chip can be adjusted, and solder can be filled inside the board, so that after installing a chip, the overall thickness of the package can be reduced.
摘要翻译：一种制造电路板的方法，包括可以放置焊锡凸块的凸块焊盘，可以包括在第一载体的表面上形成焊盘; 形成覆盖焊盘并延伸到凸块焊盘形成区域的金属膜; 在所述第一载体的表面上形成与所述金属膜电连接的电路层和电路图案; 按压所述第一载体和绝缘体，使得所述第一载体和所述绝缘体的表面彼此面对; 并移除第一载体。利用这种方法，可以调节用于接合倒装芯片的焊料的量，并且可以在板内填充焊料，使得在安装芯片之后，可以减小封装的整体厚度。

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