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    • 2. 发明授权
    • Heater for use in substrate processing apparatus to deposit tungsten
    • 用于衬底处理装置的加热器以沉积钨
    • US06179924B2
    • 2001-01-30
    • US09067618
    • 1998-04-28
    • Jun ZhaoTalex SajotoLeonid Selyutin
    • Jun ZhaoTalex SajotoLeonid Selyutin
    • C23C1646
    • C23C16/45521C23C16/14C23C16/4586C23C16/46C23C16/52H01L21/67109
    • The present invention provides a simplified heater design that is scaleable for equipment processing different diameter substrates and that can efficiently and economically process substrates to meet stringent film requirements such as film uniformity for fabricating high integration devices. The present invention is particularly useful for economically and efficiently producing integrated devices using increasingly larger diameter substrates, such as 12-inch (or 300-mm) diameter and even larger substrates. According to one embodiment, the present invention provides a heater assembly for use in a substrate processing apparatus. The heater assembly includes a metal pedestal including a surface for supporting a substrate, and a resistive heating element disposed in the metal pedestal. The heater assembly also includes a purge gas channel system disposed in the metal pedestal. The purge gas channel system includes a central purge gas inlet located substantially at a center of the metal pedestal. The central purge gas inlet is for providing a purge gas. The purge gas channel system also includes multiple radial purge gas channels radiating from the central purge gas inlet out toward a perimeter of the metal pedestal, and an annular purge gas channel formed in the metal pedestal at the perimeter. The purge gas channels form a substantially symmetric pattern, and each of the purge gas channels are substantially the same length. In a specific embodiment, the assembly includes an annular purge gas channel coupled to the surface via multiple holes near the perimeter to provide a purge guide ring integral to the metal pedestal. Other embodiments of the present invention are also provided.
    • 本发明提供了一种简化的加热器设计,其可用于设备处理不同直径的基底并且可以有效地和经济地处理基底以满足严格的膜要求,例如用于制造高集成器件的膜均匀性。 本发明对于经济地和有效地生产使用越来越大直径的基底(例如12英寸(或300mm)直径和甚至更大的基底)的集成装置特别有用。 根据一个实施例,本发明提供一种用于基板处理装置的加热器组件。 加热器组件包括金属基座,其包括用于支撑基板的表面和设置在金属基座中的电阻加热元件。 加热器组件还包括设置在金属基座中的吹扫气体通道系统。 吹扫气体通道系统包括基本上位于金属基座的中心处的中央吹扫气体入口。 中央吹扫气体入口用于提供净化气体。 吹扫气体通道系统还包括从中央吹扫气体入口向金属基座的周边辐射的多个径向吹扫气体通道,以及形成在金属基座周边的环形吹扫气体通道。 吹扫气体通道形成基本上对称的图案,并且每个吹扫气体通道基本上是相同的长度。 在具体实施例中,组件包括通过靠近周边的多个孔耦合到表面的环形吹扫气体通道,以提供与金属基座一体的清洗引导环。 还提供了本发明的其它实施例。
    • 9. 发明授权
    • Self-aligning lift mechanism
    • 自动调心机构
    • US6120609A
    • 2000-09-19
    • US892612
    • 1997-07-14
    • Leonid SelyutinTalex SajotoJun Zhao
    • Leonid SelyutinTalex SajotoJun Zhao
    • C23C16/458H01L21/68H01L21/687C23C16/00
    • C23C16/4583H01L21/68H01L21/68742H01L21/68792
    • An improved lift mechanism includes a configuration having two sections of bellows welded to a central flange. The central flange provides support for a precisely aligned lift pin support structure. The efficient utilization of space provides space for an enlarged stem while minimizing the interaction between pieces within the processing chamber. Outside the vacuum limits of the processing chamber, a catch arrangement is provided as part of a linkage that allows a single vertical drive to be utilized to manipulate both the vertical motion of lift pins and vertical motion of the pedestal supporting a substrate in a processing chamber. In one configuration a unitized lift mechanism can be replaced as a unit. Particular orientations for utilizing a lift pin support plate with ceramic inserts is disclosed to reduce particle generation within the processing chamber.
    • 改进的提升机构包括具有焊接到中心凸缘的波纹管的两个部分的构造。 中心凸缘为精确对齐的提升销支撑结构提供支撑。 空间的有效利用为扩大的茎提供空间,同时最小化处理室内的碎片之间的相互作用。 在处理室的真空限制之外,提供了捕捉装置作为连杆的一部分,其允许使用单个垂直驱动来操纵提升销的垂直运动和支撑基板的基座在处理室中的垂直运动 。 在一个配置中,可以将单元升降机构替换为一个单元。 公开了用于利用具有陶瓷插入件的提升销支撑板的特定取向,以减少处理室内的颗粒产生。