专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06180931B2 Heater unit for semiconductor processing 有权
标题翻译：半导体加工加热装置
公开(公告)号：US06180931B2
公开(公告)日：2001-01-30
申请号：US09346447
申请日：1999-07-01
申请人： Jun Futakuchiya , Takashi Masaki , Shinya Miyaji , Hidenori Ishiwata
发明人： Jun Futakuchiya , Takashi Masaki , Shinya Miyaji , Hidenori Ishiwata
IPC分类号： H05B344
CPC分类号： H01L21/67103 , H05B3/48
摘要： An upper metallic base is placed over a lower metallic base with a resistance heater element interposed between them so as to cause a plastic deformation to at least one of the opposing surfaces until the corresponding surfaces conform to an outer profile of the heater element, and the opposing surfaces of the lower and upper bases, and the resistance heater element are substantially entirely bonded to one another by a metallic bonding which may consist of brazing, soldering or diffusion bonding. Because the metallic bonding provides a favorable heat conduction, and can thereby improve the thermal efficiency and prevent local heating, a rapid temperature rise and uniform heating are made possible. Because the base consists of two parts, the material for the base can be selected from a wide range of materials including those capable of withstanding high temperatures and corrosive materials.
摘要翻译：上金属底座放置在下金属底座上，电阻加热元件插在它们之间，以便对相对表面中的至少一个造成塑性变形，直到相应的表面符合加热器元件的外轮廓，并且下部和上部基座的相对表面和电阻加热器元件通过可由钎焊，焊接或扩散接合构成的金属接合而彼此基本上完全结合。由于金属接合提供有利的热传导，因此可以提高热效率并防止局部加热，可以实现快速的温度上升和均匀的加热。由于底座由两部分组成，所以基材的材料可以从宽范围的材料中选出，包括耐高温和腐蚀性材料的材料。

2. 发明授权

US06204486B1 Heater unit for semiconductor processing 有权
标题翻译：半导体加工加热装置
公开(公告)号：US06204486B1
公开(公告)日：2001-03-20
申请号：US09430516
申请日：1999-10-29
申请人： Takashi Masaki , Jun Futakuchiya , Kenzo Yasuda , Hidenori Ishiwata , Shinji Saito , Shinya Miyaji , Tsutomu Amakawa , Toshihiro Sugisawa
发明人： Takashi Masaki , Jun Futakuchiya , Kenzo Yasuda , Hidenori Ishiwata , Shinji Saito , Shinya Miyaji , Tsutomu Amakawa , Toshihiro Sugisawa
IPC分类号： H05B368
CPC分类号： H01L21/67103 , H05B3/283 , H05B3/30
摘要： In a heater unit, comprising a lower metallic base, an upper metallic base placed closely over an upper surface of said lower base, and a resistance heater wire received in a groove defined between opposing surfaces of said lower and upper bases, ceramic powder is filled in said groove to keep said heater wire at least away from a wall surface of said groove. Thus, the heater wire can be directly installed in the groove of the base without the intervention of a sheath pipe so that the heater wire can be bent in a desired dense pattern, and the heater unit can be heated both rapidly and uniformly. Also, the ceramic powder filled in the groove improves the heat transfer, and this even further enhances the these advantages of the present invention.
摘要翻译：在加热器单元中，包括下金属底座，紧靠所述下基座的上表面放置的上金属基座和容纳在所述下基座和上基座的相对表面之间限定的凹槽中的电阻加热丝，填充陶瓷粉末在所述凹槽中，以使所述加热丝线至少远离所述凹槽的壁表面。因此，加热器线可以直接安装在基座的槽中，而不需要护套管的介入，使得加热丝可以以期望的致密图案弯曲，并且可以快速均匀地加热加热器单元。此外，填充在槽中的陶瓷粉末改善了热传递，并且这进一步增强了本发明的这些优点。

3. 发明授权

US07851728B2 Heater unit 有权
标题翻译：加热器单元
公开(公告)号：US07851728B2
公开(公告)日：2010-12-14
申请号：US11819155
申请日：2007-06-25
申请人： Jun Futakuchiya , Toshihiro Tachikawa
发明人： Jun Futakuchiya , Toshihiro Tachikawa
IPC分类号： H05B3/68 , C23C16/00
CPC分类号： H05B3/68 , H01L21/67103 , H01L21/68792
摘要： The present invention provides a heater unit which can improve temperature uniformity of a heated object at the time of heating the object. A second heat conductor 32 which is the radial internal part of shaft 22 has a lower heat transfer ratio than a first heat conductor 30 which is the radial external part of shaft 22. As a result, in the case where a heated state and a non heated state of the resistance heating element 18 are repeatedly switched, the movement of heat from the front part 22B of the shaft 22 to the base point part 22A is suppressed by the second heat conductor 32 compared to the first heat conductor 30. As a result, in the part which confronts the hollow part 42 of the shaft 22 in the heater plate 16, the time required to heat the heater plate 16 and the wafer 28 to be heated to a desired heating temperature is shortened when compared to a conventional heater unit. Therefore, it is possible to improve the uniformity of the temperature of the wafer 28 which is to be heated by the heater plate 16.
摘要翻译：本发明提供一种能够提高被加热物体在加热物体时的温度均匀性的加热器单元。作为轴22的径向内部的第二导热体32具有比作为轴22的径向外部的第一导热体30低的传热比。结果，在加热状态和非加热状态的情况下，电阻加热元件18的加热状态被重复切换，与第一导热体30相比，通过第二导热体32抑制热量从轴22的前部22B向基点部22A的移动。结果在与加热板16中的轴22的中空部分42相对的部分中，与传统的加热器单元相比，将加热板16和待加热的晶片28加热到期望的加热温度所需的时间缩短。因此，能够提高被加热板16加热的晶片28的温度的均匀性。

4. 发明申请

US20070157466A1 Substrate supporting apparatus and manufacturing method therefor 有权
标题翻译：基板支撑装置及其制造方法
公开(公告)号：US20070157466A1
公开(公告)日：2007-07-12
申请号：US11642155
申请日：2006-12-20
申请人： Naoya Kida , Toshihiro Tachikawa , Jun Futakuchiya
发明人： Naoya Kida , Toshihiro Tachikawa , Jun Futakuchiya
IPC分类号： C23C16/00 , H01K3/10
CPC分类号： C23C16/4581 , F16C29/046 , H01L21/6875 , H01L21/68757 , Y10T29/49165
摘要： A substrate supporting apparatus includes a plate member of an aluminum alloy having a flat upper surface, bottomed pits formed in the plate member, and spacer members held in the pits, individually. The spacer members are sapphire spheres. The diameter of each spacer member is a little smaller than that of each pit. The upper end of each spacer member projects from the upper surface of the plate member. A spot facing is formed in a region that includes the open edge portion of the pit. A bending portion which is obtained by plastically deforming the open edge portion of the pit toward the spacer member is formed on a bottom surface of the spot facing. A V-shaped groove is formed behind the bending portion.
摘要翻译：基板支撑装置包括具有平坦的上表面的铝合金的板构件，形成在板构件中的底部凹坑和分别保持在凹坑中的间隔件。间隔件是蓝宝石球。每个间隔件的直径比每个凹坑的直径稍小。每个间隔件的上端从板件的上表面突出。在包括凹坑的开口边缘部分的区域中形成一个光斑。通过将凹坑的开口边缘部分朝向间隔件塑性变形而获得的弯曲部分形成在点面对的底表面上。在弯曲部分的后面形成V形槽。

5. 发明申请

US20080006618A1 Heater unit 有权
标题翻译：加热器单元
公开(公告)号：US20080006618A1
公开(公告)日：2008-01-10
申请号：US11819155
申请日：2007-06-25
申请人： Jun Futakuchiya , Toshihiro Tachikawa
发明人： Jun Futakuchiya , Toshihiro Tachikawa
IPC分类号： H05B3/68
CPC分类号： H05B3/68 , H01L21/67103 , H01L21/68792
摘要： The present invention provides a heater unit which can improve temperature uniformity of a heated object at the time of heating the object. A second heat conductor 32 which is the radial internal part of shaft 22 has a lower heat transfer ratio than a first heat conductor 30 which is the radial external part of shaft 22. As a result, in the case where a heated state and a non heated state of the resistance heating element 18 are repeatedly switched, the movement of heat from the front part 22B of the shaft 22 to the base point part 22A is suppressed by the second heat conductor 32 compared to the first heat conductor 30. As a result, in the part which confronts the hollow part 42 of the shaft 22 in the heater plate 16, the time required to heat the heater plate 16 and the wafer 28 to be heated to a desired heating temperature is shortened when compared to a conventional heater unit. Therefore, it is possible to improve the uniformity of the temperature of the wafer 28 which is to be heated by the heater plate 16.
摘要翻译：本发明提供一种能够提高加热物体时的加热物体的温度均匀性的加热器单元。作为轴22的径向内部的第二导热体32具有比作为轴22的径向外部的第一导热体30低的传热比。结果，在反复切换电阻加热元件18的加热状态和非加热状态的情况下，热量从轴22的前部22B向基点部22A的移动被抑制第二热导体32与第一热导体30相比较。结果，在与加热板16中的轴22的中空部分42相对的部分中，将加热板16和加热晶片28加热至期望的加热温度所需的时间缩短，常规加热器单元。因此，能够提高被加热板16加热的晶片28的温度的均匀性。

6. 发明申请

US20050167421A1 Heater unit 有权
标题翻译：加热器单元
公开(公告)号：US20050167421A1
公开(公告)日：2005-08-04
申请号：US11042724
申请日：2005-01-24
申请人： Jun Futakuchiya , Toshihiro Tachikawa
发明人： Jun Futakuchiya , Toshihiro Tachikawa
IPC分类号： H05B3/06 , H01L21/00 , H01L21/02 , H01L21/027 , H05B3/72
CPC分类号： H01L21/67126 , H01L21/67103
摘要： A heater unit has a heater plate including a resistive heat generator, and a hollow shaft portion of a short type with a length of 20 to 50 mm, which is provide on the side of the lower face of the heater plate. The shaft portion is made from aluminum alloy. The bottom face of the shaft portion is fixed to a heater mounting portion of a casing. A sealing member is provided between the bottom face of the shaft portion and the casing. The thickness of the shaft portion is set to 0.5 to 5.0 mm, and the length, area of heat-transfer surface, and material of the shaft portion are selected such that the thermal resistance Rth of the shaft portion is 0.4 K/W or more.
摘要翻译：加热器单元具有包括电阻式发热体的加热板和长度为20〜50mm的短型空心轴部，其设置在加热板的下表面侧。轴部由铝合金制成。轴部的底面固定在壳体的加热器安装部上。密封构件设置在轴部的底面和壳体之间。将轴部的厚度设定为0.5〜5.0mm，并且选择轴部的长度，面积和轴部的材料，使得轴的热阻R th < 部分为0.4K / W以上。

7. 发明授权

US09153463B2 Substrate support device 有权
标题翻译：基板支撑装置
公开(公告)号：US09153463B2
公开(公告)日：2015-10-06
申请号：US13304493
申请日：2011-11-25
申请人： Jun Futakuchiya , Junichi Miyahara , Daisuke Hashimoto
发明人： Jun Futakuchiya , Junichi Miyahara , Daisuke Hashimoto
IPC分类号： H05B3/68 , H05B3/02 , H05B3/44 , H05B3/50 , H01L21/67 , H01L21/687
CPC分类号： H01L21/67103 , H01L21/67109 , H01L21/68735 , H01L21/68785 , H05B3/68
摘要： A substrate support device formed of a metal and having a high withstand voltage and a high thermal resistance is provided. A substrate support device according to the present invention includes a plate section formed of a metal; a shaft section connected to the plate section and formed of a metal; a heating element provided in the plate section; and an insulating film formed on a first surface of the plate section, the first surface opposite to the shaft section, by ceramic thermal spraying. The substrate support device may further include an insulating film formed on a second surface of the plate section which intersects the first surface of the plate section approximately perpendicularly.
摘要翻译：提供了由金属形成并具有高耐压和高耐热性的基板支撑装置。根据本发明的基板支撑装置包括由金属形成的板部分; 连接到所述板部并由金属形成的轴部; 设置在所述板部中的加热元件; 以及通过陶瓷热喷涂形成在所述板部的第一表面上的与所述轴部相对的所述第一表面的绝缘膜。基板支撑装置还可以包括形成在板部分的第二表面上的绝缘膜，其大致垂直地与板部分的第一表面相交。

8. 发明授权

US07045747B2 Heater unit 有权
标题翻译：加热器单元
公开(公告)号：US07045747B2
公开(公告)日：2006-05-16
申请号：US11042724
申请日：2005-01-24
申请人： Jun Futakuchiya , Toshihiro Tachikawa
发明人： Jun Futakuchiya , Toshihiro Tachikawa
IPC分类号： H05B3/68 , C23C16/00
CPC分类号： H01L21/67126 , H01L21/67103
摘要： A heater unit has a heater plate including a resistive heat generator, and a hollow shaft portion of a short type with a length of 20 to 50 mm, which is provide on the side of the lower face of the heater plate. The shaft portion is made from aluminum alloy. The bottom face of the shaft portion is fixed to a heater mounting portion of a casing. A sealing member is provided between the bottom face of the shaft portion and the casing. The thickness of the shaft portion is set to 0.5 to 5.0 mm, and the length, area of heat-transfer surface, and material of the shaft portion are selected such that the thermal resistance Rth of the shaft portion is 0.4 K/W or more.
摘要翻译：加热器单元具有包括电阻式发热体的加热板和长度为20〜50mm的短型空心轴部，其设置在加热板的下表面侧。轴部由铝合金制成。轴部的底面固定在壳体的加热器安装部上。密封构件设置在轴部的底面和壳体之间。将轴部的厚度设定为0.5〜5.0mm，并且选择轴部的长度，面积和轴部的材料，使得轴的热阻R th < 部分为0.4K / W以上。

9. 发明申请

US20060081601A1 Device for heating or cooling workpieces and manufacturing method therefor 审中-公开
标题翻译：用于加热或冷却工件的装置及其制造方法
公开(公告)号：US20060081601A1
公开(公告)日：2006-04-20
申请号：US11194424
申请日：2005-08-01
申请人： Jun Futakuchiya , Toshihiro Tachikawa
发明人： Jun Futakuchiya , Toshihiro Tachikawa
IPC分类号： H05B3/68
CPC分类号： H01L21/67109
摘要： A heater unit comprises a shaft member and a plate member. The shaft member has a body and a flange portion formed on an end portion of the shaft body. The plate member is formed by brazing a plurality of plate elements together. One of the plate elements has a recess in which the flange portion is inserted. A gap is formed between a peripheral surface of the flange portion and an inner peripheral surface of the recess. An end face of the flange portion is brazed to the plate element in a manner such that the flange portion is inserted into the recess and the flange portion is loaded and heated by a pressurizing jig.
摘要翻译：加热器单元包括轴构件和板构件。轴构件具有形成在轴体的端部上的主体和凸缘部。板构件通过将多个板元件钎焊在一起而形成。板元件之一具有凸缘部分插入其中的凹部。在凸缘部的周面与凹部的内周面之间形成间隙。凸缘部的端面以这样的方式钎焊到板状元件，使得凸缘部分插入凹部中，并且凸缘部分被加压夹具加载和加热。

10. 再颁专利

USRE43837E1 Substrate supporting apparatus 有权
标题翻译：基板支撑装置
公开(公告)号：USRE43837E1
公开(公告)日：2012-12-04
申请号：US13049056
申请日：2011-03-16
申请人： Naoya Kida , Toshihiro Tachikawa , Jun Futakuchiya
发明人： Naoya Kida , Toshihiro Tachikawa , Jun Futakuchiya
IPC分类号： H01L21/00 , C23C14/00 , C23C16/00
CPC分类号： C23C16/4581 , F16C29/046 , H01L21/6875 , H01L21/68757 , Y10T29/49165
摘要： A substrate supporting apparatus includes a plate member of an aluminum alloy having a flat upper surface, bottomed pits formed in the plate member, and spacer members held in the pits, individually. The spacer members are sapphire spheres. The diameter of each spacer member is a little smaller than that of each pit. The upper end of each spacer member projects from the upper surface of the plate member. A spot facing is formed in a region that includes the open edge portion of the pit. A bending portion which is obtained by plastically deforming the open edge portion of the pit toward the spacer member is formed on a bottom surface of the spot facing. A V-shaped groove is formed behind the bending portion.
摘要翻译：基板支撑装置包括具有平坦的上表面的铝合金的板构件，形成在板构件中的底部凹坑和分别保持在凹坑中的间隔件。间隔件是蓝宝石球。每个间隔件的直径比每个凹坑的直径稍小。每个间隔件的上端从板件的上表面突出。在包括凹坑的开口边缘部分的区域中形成一个光斑。通过将凹坑的开口边缘部分朝向间隔件塑性变形而获得的弯曲部分形成在点面对的底表面上。在弯曲部分的后面形成V形槽。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式