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1. 发明授权

US08541741B2 Photonic measurement instrument using fiber optics 有权
标题翻译：使用光纤的光子测量仪器
公开(公告)号：US08541741B2
公开(公告)日：2013-09-24
申请号：US12949383
申请日：2010-11-18
申请人： Juan C. Ivaldi , Paul L. St. Cyr , Eugene Chow , Mark C. Werner
发明人： Juan C. Ivaldi , Paul L. St. Cyr , Eugene Chow , Mark C. Werner
IPC分类号： G01J5/00
CPC分类号： G01N21/3103 , G01N21/3151 , G01N21/68 , G01N21/72 , G01N21/74 , G01N2201/082 , G01N2201/0826 , G01N2201/0833
摘要： A photonic measurement system, such as an atomic absorption spectrometer, includes source, sample and detection modules that are interconnected by fiber optic cables. A first set of fiber optic cables guides light from one or more light sources in the source module to each of at least two analysis chambers in the sample module. A second set of fiber optic cables guides light from the analysis chambers to a detector in the detection module. The detector provides to a processing sub-system signals that correspond to intensities of the guided light. One analysis chamber is selected to perform a sample analysis at a given time, and the processing sub-system processes the signals associated with the selected analysis chamber as measurement signals. The processing sub-system may further process the signals associated with a given non-selected analysis chamber as reference signals.
摘要翻译：诸如原子吸收光谱仪的光子测量系统包括通过光纤电缆互连的源，样本和检测模块。第一组光纤电缆将源模块中的一个或多个光源的光引导到样品模块中的至少两个分析室中的每一个。第二组光纤电缆将来自分析室的光引导到检测模块中的检测器。检测器向处理子系统提供对应于导光的强度的信号。选择一个分析室以在给定时间执行样本分析，并且处理子系统处理与所选分析室相关联的信号作为测量信号。处理子系统可以进一步处理与给定的非选择分析室相关联的信号作为参考信号。

2. 发明申请

US20110122396A1 PHOTONIC MEASUREMENT INSTRUMENT USING FIBER OPTICS 有权
标题翻译：光纤测量仪器使用光纤光学
公开(公告)号：US20110122396A1
公开(公告)日：2011-05-26
申请号：US12949383
申请日：2010-11-18
申请人： Juan C. Ivaldi , Paul L. St. Cyr , Eugene Chow , Mark C. Werner
发明人： Juan C. Ivaldi , Paul L. St. Cyr , Eugene Chow , Mark C. Werner
IPC分类号： G01J3/28 , G01J3/00 , G01J3/30
CPC分类号： G01N21/3103 , G01N21/3151 , G01N21/68 , G01N21/72 , G01N21/74 , G01N2201/082 , G01N2201/0826 , G01N2201/0833
摘要： A photonic measurement system, such as an atomic absorption spectrometer, includes source, sample and detection modules that are interconnected by fiber optic cables. A first set of fiber optic cables guides light from one or more light sources in the source module to each of at least two analysis chambers in the sample module. A second set of fiber optic cables guides light from the analysis chambers to a detector in the detection module. The detector provides to a processing sub-system signals that correspond to intensities of the guided light. One analysis chamber is selected to perform a sample analysis at a given time, and the processing sub-system processes the signals associated with the selected analysis chamber as measurement signals. The processing sub-system may further process the signals associated with a given non-selected analysis chamber as reference signals.
摘要翻译：诸如原子吸收光谱仪的光子测量系统包括通过光纤电缆互连的源，样本和检测模块。第一组光纤电缆将源模块中的一个或多个光源的光引导到样品模块中的至少两个分析室中的每一个。第二组光纤电缆将来自分析室的光引导到检测模块中的检测器。检测器向处理子系统提供对应于导光的强度的信号。选择一个分析室以在给定时间执行样本分析，并且处理子系统处理与所选分析室相关联的信号作为测量信号。处理子系统可以进一步处理与给定的非选择分析室相关联的信号作为参考信号。

3. 发明申请

US20070148895A1 Integrateable capacitors and microcoils and methods of making thereof 有权
标题翻译：可集成电容器和微型线圈及其制造方法
公开(公告)号：US20070148895A1
公开(公告)日：2007-06-28
申请号：US11319075
申请日：2005-12-28
申请人： Koenraad Van Schuylenbergh , Eugene Chow , JengPing Lu
发明人： Koenraad Van Schuylenbergh , Eugene Chow , JengPing Lu
IPC分类号： H01L21/00
CPC分类号： H01G5/18 , H01F17/0006 , H01F17/02 , H01F21/04 , H01F27/40 , H01F41/041 , H01L28/10 , H01L28/40
摘要： Methods for integrally forming high Q tunable capacitors and high Q inductors on a substrate are described. A method for integrally forming a capacitor and a microcoil on a substrate may involve depositing and patterning a dielectric layer on the substrate, depositing and patterning a sacrificial layer on the substrate, depositing and patterning conductive material on the semiconductor substrate, depositing and patterning a polymer layer on the semiconductor substrate, removing an exposed portion of the conductive material exposed by the patterned polymer layer to release a portion of the conductive pattern from the semiconductor substrate to form out-of-plane windings of the microcoil, depositing second conductive material on exposed portions of the conductive material, and removing the sacrificial layer. The patterned conductive material may include a windings portion of the microcoil, an overlapping electrode portion of the capacitor and a support portion for the electrode of the capacitor.
摘要翻译：描述了在衬底上整体形成高Q可调谐电容器和高Q电感器的方法。用于在基板上一体地形成电容器和微线圈的方法可以包括在基板上沉积和图案化电介质层，在衬底上沉积和图案化牺牲层，在半导体衬底上沉积和图案化导电材料，沉积和图案化聚合物去除由所述图案化聚合物层暴露的所述导电材料的暴露部分，以从所述半导体衬底释放所述导电图案的一部分，以形成所述微线圈的面外绕组，将第二导电材料沉积在暴露的部分导电材料，并去除牺牲层。图案化导电材料可以包括微线圈的绕组部分，电容器的重叠电极部分和用于电容器电极的支撑部分。

4. 发明申请

US20060128057A1 Xerographic micro-assembler 有权
标题翻译：静电复印机
公开(公告)号：US20060128057A1
公开(公告)日：2006-06-15
申请号：US11011652
申请日：2004-12-14
申请人： Jeng Lu , Eugene Chow
发明人： Jeng Lu , Eugene Chow
IPC分类号： H01L21/50 , H01L21/30 , B23P21/00
CPC分类号： H01L25/50 , H01L21/67271 , H01L21/67282 , H01L21/67294 , H01L24/95 , H01L2224/95085 , H01L2224/95144 , H01L2224/95145 , H01L2924/14 , H01L2924/1461 , Y10T29/4913 , Y10T29/49133 , Y10T29/53004 , Y10T29/5313 , Y10T29/53174 , Y10T29/53178 , Y10T29/53278 , H01L2924/00
摘要： Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and specifies its orientation for sorting. The micro-objects are sorted in a sorting unit so that they have defined positions and orientations. The sorting unit has the capability of electrostatically and magnetically manipulating the micro-objects based on their select charge encoding. The sorted micro-objects are provided to an image transfer unit. The image transfer unit is adapted to receive the sorted micro-objects, maintain them in their sorted order and orientation, and deliver them to a substrate. Maintaining the sorted order as the micro-objects are delivered to the substrate may be accomplished through the use of an electrostatic image, as is done in xerography. The substrate with the micro-objects is further processed to interconnect the micro-objects—through electrical wiring, for example—to form the final micro-assembly.
摘要翻译：公开了静电印刷微组装系统和方法。系统和方法涉及操纵电荷编码的微物体。电荷编码识别每个微物体并指定其排列方向。微物体在分类单元中排序，使得它们具有定义的位置和取向。分选单元具有基于其选择电荷编码的静电和磁性操纵微物体的能力。分类的微物体被提供给图像传送单元。图像传送单元适于接收分类的微物体，将它们保持在排列顺序和方位，并将其传送到基底。将排序的顺序作为微物体传送到基底可以通过使用静电图像来实现，如在静电复印中所做的那样。具有微物体的衬底被进一步处理以使例如微通孔电线互连，以形成最终的微组件。

5. 发明申请

US20060087335A1 Curved spring structure with elongated section located under cantilevered section 有权
标题翻译：弯曲弹簧结构，细长部分位于悬臂部分下方
公开(公告)号：US20060087335A1
公开(公告)日：2006-04-27
申请号：US10971467
申请日：2004-10-21
申请人： Thomas Hantschel , Eugene Chow
发明人： Thomas Hantschel , Eugene Chow
IPC分类号： G01R31/02
CPC分类号： H01G5/18 , G01R1/06738
摘要： A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.
摘要翻译：弯曲弹簧结构包括平行于基板表面延伸的基部部分，弯曲的远离基板表面的弯曲悬臂部分，以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。弹簧结构包括由图案化和释放的自弯曲材料膜（例如，应力工程金属，双晶型/双金属）形成的弹簧指状物。然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。细长部分由与包覆层同时沉积的电镀材料形成。为了促进细长部分的形成，在弹簧指状物下方设置有胶结层以促进电镀，或者基板表面被预处理以便于化学镀。

6. 发明申请

US20060009051A1 Flexible cable interconnect assembly 有权
公开(公告)号：US20060009051A1
公开(公告)日：2006-01-12
申请号：US11226186
申请日：2005-09-13
申请人： Koenraad Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
发明人： Koenraad Schuylenbergh , Armin Volkel , Thomas DiStefano , Michel Rosa , David Fork , Eugene Chow , Meng Lean
IPC分类号： H01R12/00
CPC分类号： H01R12/78 , H05K1/147 , H05K3/323 , H05K3/361 , H05K3/365 , H05K2201/044 , H05K2201/09845
摘要： A data transmission interconnect assembly capable of transmission speeds in excess of 40 Gbps in which, for example, a line-card is detachably coupled to a backplane using flexible flat cables that are bent to provide a continuous, smooth curve between the connected boards, and connected by a connection apparatus that employs cable-to-cable interface members that are transparent to the transmitted signal waves. Microspring interface members are formed on the contact structure pressed against the cables to provide interface arrangements that are smaller than a wavelength of the transmitted signal. A connector apparatus uses a cam mechanism to align the cables, and then to press the contact structure, having the microspring interface members formed thereon, against the cables. An alterative contact structure uses anisotropic conductive film.

7. 发明申请

US20110167526A1 Microsprings Having Nanowire Tip Structures 审中-公开
标题翻译：具有纳米线尖端结构的微管
公开(公告)号：US20110167526A1
公开(公告)日：2011-07-07
申请号：US13045042
申请日：2011-03-10
申请人： Eugene Chow , Pengfei Qi
发明人： Eugene Chow , Pengfei Qi
IPC分类号： G01Q70/08 , B82Y30/00
CPC分类号： B81C1/0015 , B81B2203/019 , B81B2207/07 , B82Y10/00
摘要： A stress-engineered microspring is formed generally in the plane of a substrate. A nanowire (or equivalently, a nanotube) is formed at the tip thereof, also in the plane of the substrate. Once formed, the length of the nanowire may be defined, for example photolithographically. A sacrificial layer underlying the microspring may then be removed, allowing the engineered stresses in the microspring to cause the structure to bend out of plane, elevating the nanowire off the substrate and out of plane. Use of the nanowire as a contact is thereby provided. The nanowire may be clamped at the tip of the microspring for added robustness. The nanowire may be coated during the formation process to provide additional functionality of the final device.
摘要翻译：应力工程微球通常在基底的平面上形成。纳米线（或等效地，纳米管）也在其顶端形成在基板的平面中。一旦形成，可以例如光刻地限定纳米线的长度。然后可以去除位于微弹簧下面的牺牲层，允许微弹簧中的工程应力使结构弯曲出平面，从而使纳米线离开基底并离开平面。由此提供了使用纳米线作为接触。可以将纳米线夹在微弹簧的末端以增加坚固性。在形成过程中可以涂覆纳米线以提供最终装置的附加功能。

8. 发明申请

US20090322845A1 ANISOTROPICALLY CONDUCTIVE BACKSIDE ADDRESSABLE IMAGING BELT FOR USE WITH CONTACT ELECTROGRAPHY 有权
标题翻译：使用联系电子技术的非均匀导电背面可寻址成像带
公开(公告)号：US20090322845A1
公开(公告)日：2009-12-31
申请号：US12145677
申请日：2008-06-25
申请人： Timothy D. Stowe , Chu-heng Liu , Jeng Ping Lu , Eugene Chow , Gregory B. Anderson , Armin Volkel , Eric Peeters
发明人： Timothy D. Stowe , Chu-heng Liu , Jeng Ping Lu , Eugene Chow , Gregory B. Anderson , Armin Volkel , Eric Peeters
IPC分类号： B41J2/41
CPC分类号： B41J2/41 , G03G15/32
摘要： An addressable imaging belt for use in printing applications having embedded anisotropically conductive addressable islands configured for electric contact on a first side of the belt by a write head consisting of an array of compliant cantilevered fingers with contact pads/points to which a voltage can be applied. The conductive addressable islands electrically isolated from one another and extending substantially through the thickness of the belt in order to allow charge to flow through the belt towards a second side of the belt, in order to form a latent electrostatic image on the second side and develop this latent image by attracting colorized toner or other electrically charged particles to the second side.
摘要翻译：一种用于印刷应用的可寻址成像带，其具有嵌入的各向异性导电可寻址岛，其配置用于通过由柔性悬臂指状物阵列组成的写头组成，用于在带的第一侧上进行电接触，所述写头具有可被施加电压的接触焊盘/点。导电寻址岛彼此电隔离并且基本上延伸穿过带的厚度，以便允许电荷通过带流向带的第二侧，以在第二面上形成静电潜像并显影该潜像通过将着色调色剂或其它带电粒子吸引到第二侧。

9. 发明申请

US20070125486A1 Vertically spaced plural microsprings 有权
标题翻译：垂直间隔的多个微弹簧
公开(公告)号：US20070125486A1
公开(公告)日：2007-06-07
申请号：US11292474
申请日：2005-12-02
申请人： Thomas Hantschel , Eugene Chow
发明人： Thomas Hantschel , Eugene Chow
IPC分类号： B32B37/00
CPC分类号： B81B3/001 , B81B2207/07 , B81C1/00666 , B81C1/00952 , G01R1/06722 , G01R1/06727 , G01R1/06744 , G01R3/00 , H05K3/4092
摘要： A plurality of vertically spaced-apart microsprings are provided to increase microspring contact force, contact area, contact reliability, and contact yield. The microspring material is deposited, either as a single layer or as a composite of multiple sub layers, to have a tailored stress differential along its cross-section. A lower microspring may be made to push up against an upper microspring to provide increased contact force, or push down against a substrate to ensure release during manufacture. The microsprings may be provided with similar stress differentials or opposite stress differentials to obtain desired microspring profiles and functionality. Microsprings may also be physically connected at their distal ends for increased contact force. The microsprings may be formed of electrically conductive material or coated with electrically conductive material for probe card and similar applications.
摘要翻译：提供多个垂直间隔开的微弹簧以增加微弹簧接触力，接触面积，接触可靠性和接触屈服。微珠材料作为单层或作为多个子层的复合材料沉积，沿其横截面具有定制的应力差。可以制备较低的微弹簧以向上推动上部微型弹性体以提供增加的接触力，或者向下推动抵靠基底以确保制造过程中的释放。可以提供类似的应力差异或相反的应力差异以获得所需的微弹体轮廓和功能性。微弹簧也可以在其远端物理连接以增加接触力。微弹簧可以由导电材料形成或涂覆有用于探针卡和类似应用的导电材料。

10. 发明申请

US20070069751A1 Curved spring structure with elongated section located under cantilevered section 有权
标题翻译：弯曲弹簧结构，细长部分位于悬臂部分下方
公开(公告)号：US20070069751A1
公开(公告)日：2007-03-29
申请号：US11549066
申请日：2006-10-12
申请人： Thomas Hantschel , Eugene Chow
发明人： Thomas Hantschel , Eugene Chow
IPC分类号： G01R31/02
CPC分类号： H01G5/18 , G01R1/06738
摘要： A curved spring structure includes a base section extending parallel to the substrate surface, a curved cantilever section bent away from the substrate surface, and an elongated section extending from the base section along the substrate surface under the cantilevered section. The spring structure includes a spring finger formed from a self-bending material film (e.g., stress-engineered metal, bimorph/bimetallic) that is patterned and released. A cladding layer is then electroplated and/or electroless plated onto the spring finger for strength. The elongated section is formed from plating material deposited simultaneously with cladding layers. To promote the formation of the elongated section, a cementation layer is provided under the spring finger to facilitate electroplating, or the substrate surface is pre-treated to facilitate electroless plating.
摘要翻译：弯曲弹簧结构包括平行于基板表面延伸的基部部分，弯曲的远离基板表面的弯曲悬臂部分，以及从基部沿着悬臂部分下方的基板表面延伸的细长部分。弹簧结构包括由图案化和释放的自弯曲材料膜（例如，应力工程金属，双晶型/双金属）形成的弹簧指状物。然后将包覆层电镀和/或无电镀在弹簧手指上用于强度。细长部分由与包覆层同时沉积的电镀材料形成。为了促进细长部分的形成，在弹簧指状物下方设置有胶结层以促进电镀，或者基板表面被预处理以便于化学镀。

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