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1. 发明授权

US08294068B2 Rapid thermal processing lamphead with improved cooling 有权
标题翻译：快速热处理灯头具有改进的冷却
公开(公告)号：US08294068B2
公开(公告)日：2012-10-23
申请号：US12207711
申请日：2008-09-10
申请人： Joseph M. Ranish , Khurshed Sorabji , Kedarnath Sangam , Alexander Lerner
发明人： Joseph M. Ranish , Khurshed Sorabji , Kedarnath Sangam , Alexander Lerner
IPC分类号： A21B1/22 , F26B19/00
CPC分类号： F27B17/0025 , F27D5/0037 , F27D21/0014 , H01L21/67109 , H01L21/67115
摘要： Embodiments of a lamphead and apparatus utilizing same are provided herein. In some embodiments, a lamphead for use in thermal processing may include a monolithic member having a plurality of coolant passages and a plurality of lamp passages and reflector cavities, wherein each lamp passage is configured to accommodate a lamp and each reflector cavity is shaped to act as a reflector or to receive a replaceable reflector for the lamp, and wherein the plurality of coolant passages are disposed proximate to the plurality of lamp passages; and at least one heat transfer member extending from the monolithic member into each coolant passage. In some embodiments, the lamphead may be disposed in an apparatus comprising a process chamber having a substrate support, wherein the lamphead is positioned to provide energy to the substrate support.
摘要翻译：本发明提供了一种灯头及其使用装置的实施例。在一些实施例中，用于热处理的灯头可以包括具有多个冷却剂通道和多个灯通道和反射器腔的整体构件，其中每个灯通道被配置成容纳灯，并且每个反射器空腔成形为能够起作用作为反射器或接收用于灯的可更换反射器，并且其中所述多个冷却剂通道设置成靠近所述多个灯通道; 以及至少一个传热构件，其从所述整体构件延伸到每个冷却剂通道中。在一些实施例中，灯头可以设置在包括具有基板支撑件的处理室的设备中，其中灯头被定位成向基板支撑件提供能量。

2. 发明授权

US08490660B2 Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber 有权
标题翻译：用于在处理室中支撑，定位和旋转衬底的装置和方法
公开(公告)号：US08490660B2
公开(公告)日：2013-07-23
申请号：US13294709
申请日：2011-11-11
申请人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
发明人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
IPC分类号： B65B31/04
CPC分类号： H01L21/6838 , H01L21/67115
摘要： An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.
摘要翻译：提供了用于支撑，定位和旋转衬底的装置和方法。在一个实施例中，用于支撑衬底的支撑组件包括上基板和下基板。衬底浮在上层底板上的薄层空气上。定位组件包括多个空气轴承边缘辊或气流袋，其用于将衬底定位在上部基板的上方所期望的取向。多个倾斜的孔或气流袋被配置在上基板中，用于使气体流过其中以旋转基板以确保在加工期间的均匀加热。

3. 发明授权

US08057602B2 Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber 有权
标题翻译：用于在处理室中支撑，定位和旋转衬底的装置和方法
公开(公告)号：US08057602B2
公开(公告)日：2011-11-15
申请号：US12017293
申请日：2008-01-21
申请人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
发明人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
IPC分类号： C23C16/00
CPC分类号： H01L21/67115 , H01L21/6838 , H01L21/68742 , H01L21/68785 , H01L21/68792
摘要： Embodiments of the invention contemplate a method, apparatus and system that are used to support, position, and rotate a substrate during processing. Embodiments of the invention may also include a method of controlling the transfer of heat between a substrate and substrate support positioned in a processing chamber. The apparatus and methods described herein remove the need for complex, costly and often unreliable components that would be required to accurately position and rotate a substrate during one or more processing steps, such as an rapid thermal processing (RTP) process, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, atomic layer deposition (ALD) process, dry etching process, wet clean, and/or laser annealing process.
摘要翻译：本发明的实施例考虑了一种用于在处理期间支撑，定位和旋转衬底的方法，装置和系统。本发明的实施例还可以包括控制位于处理室中的衬底和衬底支撑件之间的热传递的方法。本文描述的装置和方法消除了在一个或多个处理步骤（例如快速热处理（RTP）处理，化学气相沉积）中精确定位和旋转衬底所需的复杂，昂贵且经常不可靠的部件的需要（CVD）工艺，物理气相沉积（PVD）工艺，原子层沉积（ALD）工艺，干蚀刻工艺，湿法清洁和/或激光退火工艺。

4. 发明授权

US08057601B2 Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber 有权
标题翻译：用于在处理室中支撑，定位和旋转衬底的装置和方法
公开(公告)号：US08057601B2
公开(公告)日：2011-11-15
申请号：US11746392
申请日：2007-05-09
申请人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
发明人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
IPC分类号： C23C16/00
CPC分类号： H01L21/6838 , H01L21/67115
摘要： An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.
摘要翻译：提供了用于支撑，定位和旋转衬底的装置和方法。在一个实施例中，用于支撑衬底的支撑组件包括上基板和下基板。衬底浮在上层底板上的薄层空气上。定位组件包括多个空气轴承边缘辊或气流袋，其用于将衬底定位在上部基板的上方所期望的取向。多个倾斜的孔或气流袋被配置在上基板中，用于使气体流过其中以旋转基板以确保在加工期间的均匀加热。

5. 发明申请

US20080276864A1 APPARATUS AND METHOD FOR SUPPORTING, POSITIONING AND ROTATING A SUBSTRATE IN A PROCESSING CHAMBER 有权
标题翻译：用于支撑，定位和旋转处理室中的基板的装置和方法
公开(公告)号：US20080276864A1
公开(公告)日：2008-11-13
申请号：US11746392
申请日：2007-05-09
申请人： BLAKE KOELMEL , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
发明人： BLAKE KOELMEL , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
IPC分类号： B05C13/02
CPC分类号： H01L21/6838 , H01L21/67115
摘要： An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.
摘要翻译：提供了用于支撑，定位和旋转衬底的装置和方法。在一个实施例中，用于支撑衬底的支撑组件包括上基板和下基板。衬底浮在上层底板上的薄层空气上。定位组件包括多个空气轴承边缘辊或气流袋，其用于将衬底定位在上部基板的上方所期望的取向。多个倾斜的孔或气流袋被构造在上基板中，用于使气体流过其中以旋转基板，以确保在加工期间的均匀加热。

6. 发明申请

US20120055405A1 APPARATUS AND METHOD FOR SUPPORTING, POSITIONING AND ROTATING A SUBSTRATE IN A PROCESSING CHAMBER 有权
标题翻译：用于支撑，定位和旋转处理室中的基板的装置和方法
公开(公告)号：US20120055405A1
公开(公告)日：2012-03-08
申请号：US13294709
申请日：2011-11-11
申请人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
发明人： Blake Koelmel , Alexander N. Lerner , Joseph M. Ranish , Kedarnath Sangam , Khurshed Sorabji
IPC分类号： C23C16/458 , B05C13/02
CPC分类号： H01L21/6838 , H01L21/67115
摘要： An apparatus and method for supporting, positioning and rotating a substrate are provided. In one embodiment, a support assembly for supporting a substrate includes an upper base plate and a lower base plate. The substrate is floated on a thin layer of air over the upper base plate. A positioning assembly includes a plurality of air bearing edge rollers or air flow pockets used to position the substrate in a desired orientation inside above the upper base plate. A plurality of slanted apertures or air flow pockets are configured in the upper base plate for flowing gas therethrough to rotate the substrate to ensure uniform heating during processing.
摘要翻译：提供了用于支撑，定位和旋转衬底的装置和方法。在一个实施例中，用于支撑衬底的支撑组件包括上基板和下基板。衬底浮在上层底板上的薄层空气上。定位组件包括多个空气轴承边缘辊或气流袋，其用于将衬底定位在上部基板的上方所期望的取向。多个倾斜的孔或气流袋被配置在上基板中，用于使气体流过其中以旋转基板以确保在加工期间的均匀加热。

7. 再颁专利

USRE44712E1 Lamp for rapid thermal processing chamber 有权
标题翻译：快速热处理腔灯
公开(公告)号：USRE44712E1
公开(公告)日：2014-01-21
申请号：US13288586
申请日：2011-11-03
申请人： Joseph M. Ranish , Khurshed Sorabji
发明人： Joseph M. Ranish , Khurshed Sorabji
IPC分类号： H01J5/48
CPC分类号： H01K1/58 , H01K1/46 , H01L21/67115
摘要： A lamp assembly adapted for use in a substrate thermal processing chamber to heat the substrate to temperatures up to at least about 1100° C. is disclosed. In one embodiment, the lamp assembly comprises a bulb enclosing at least one radiation generating filament attached to a pair of leads, a lamp base configured to receive the pair of leads, a sleeve having a wall thickness of at least about 0.013 inches and a potting compound having a thermal conductivity greater than about 100 W/(K-m).
摘要翻译：公开了适用于基板热处理室以将基板加热至高达至少约1100℃的温度的灯组件。在一个实施例中，灯组件包括封闭连接到一对引线的至少一个辐射生成细丝的灯泡，被配置为容纳一对引线的灯座，具有至少约0.013英寸的壁厚的套管和一个灌封具有大于约100W /（Km）的热导率的化合物。

8. 发明授权

US08314371B2 Rapid thermal processing chamber with micro-positioning system 有权
标题翻译：具有微型定位系统的快速热处理室
公开(公告)号：US08314371B2
公开(公告)日：2012-11-20
申请号：US12611958
申请日：2009-11-04
申请人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
发明人： Khurshed Sorabji , Joseph M. Ranish , Wolfgang Aderhold , Aaron M. Hunter , Blake R. Koelmel , Alexander N. Lerner , Nir Merry
IPC分类号： H01B1/00
CPC分类号： H01L21/67259 , C23C16/46 , H01L21/324 , H01L21/67115 , H01L21/68 , H01L21/681 , H01L21/6835 , H01L21/68742
摘要： Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.
摘要翻译：描述了包括将衬底轴向对准衬底支撑件或经验确定的位置的用于快速热处理平面衬底的方法和装置。所述方法和装置包括确定衬底和衬底支撑件的相对取向的传感器系统。

9. 发明申请

US20090298300A1 Apparatus and Methods for Hyperbaric Rapid Thermal Processing 审中-公开
标题翻译：高压快速热处理装置与方法
公开(公告)号：US20090298300A1
公开(公告)日：2009-12-03
申请号：US12437257
申请日：2009-05-07
申请人： Joseph M. Ranish , Khurshed Sorabji , Alexander N. Lerner , Aaron M. Hunter
发明人： Joseph M. Ranish , Khurshed Sorabji , Alexander N. Lerner , Aaron M. Hunter
IPC分类号： H01L21/324 , H01L21/67
CPC分类号： H01L21/324 , H01L21/67115 , H01L21/67248
摘要： Methods and apparatus for hyperbaric rapid thermal processing of a substrate are described. Methods of processing a substrate in a rapid thermal processing chamber are described that include passing a substrate from outside the chamber through an access port onto a support in the interior region of the processing chamber, closing a port door sealing the chamber, pressurizing the chamber to a pressure greater than 1.5 atmospheres absolute and directing radiant energy toward the substrate. Hyperbaric rapid thermal processing chambers are described which are constructed to withstand pressures greater than at least about 1.5 atmospheres absolute or, optionally, 2 atmospheres of absolute pressure. Processing chambers may include pressure control valves to control the pressure within the chamber.
摘要翻译：描述了用于衬底高压快速热处理的方法和装置。描述了在快速热处理室中处理基板的方法，其包括将基板从室外通过进入端口传送到处理室的内部区域中的支撑件上，关闭密封该室的端口门，将该室加压至绝对压力大于1.5个大气压，并将辐射能量引向基板。描述了高压快速热处理室，其被构造为承受大于至少约1.5大气压绝对压力或任选地大气压绝压的压力。处理室可以包括压力控制阀，以控制室内的压力。

10. 发明申请

US20080199163A1 Lamp for Rapid Thermal Processing Chamber 有权
标题翻译：快速热处理室灯
公开(公告)号：US20080199163A1
公开(公告)日：2008-08-21
申请号：US11675150
申请日：2007-02-15
申请人： Joseph M. Ranish , Khurshed Sorabji
发明人： Joseph M. Ranish , Khurshed Sorabji
IPC分类号： H05B3/00
CPC分类号： H01K1/28 , H01K1/22 , H01K1/32 , H01K1/325 , H01K1/46 , H01K1/58 , H01K7/00 , H01L21/67115 , H05B3/0047
摘要： A lamp assembly for the lamp assembly adapted for use in a substrate thermal processing chamber to heat the substrate to temperatures up to at least about 1100° C. is disclosed. In one embodiment, the lamp assembly comprises a bulb enclosing at least one radiation generating filament attached to a pair of leads, the bulb having an inner surface and an outer surface, a lamp base configured to receive the pair of leads and at least a portion of the bulb having a surface treatment adapted to reflect light away from the lamp base. In another embodiment, a sleeve covers the lamp base, which has a cross-sectional area less than about 1.2 times the cross-sectional area of the bulb.
摘要翻译：公开了一种用于灯组件的灯组件，其适用于衬底热处理室以将衬底加热至高达至少约1100℃的温度。在一个实施例中，灯组件包括灯泡，其包围附接到一对引线的至少一个辐射生成细丝，灯泡具有内表面和外表面，灯基座被配置为接收一对引线和至少一部分具有适于将光反射离开灯座的表面处理的灯泡。在另一个实施例中，套筒覆盖灯座，其具有小于灯泡横截面面积的约1.2倍的横截面面积。

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