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1. 发明授权

US06704130B1 Electromechanical optical modulator providing stray light control 有权
标题翻译：提供杂散光控制的机电光调制器
公开(公告)号：US06704130B1
公开(公告)日：2004-03-09
申请号：US09415581
申请日：1999-10-08
申请人： Joseph Earl Ford , John VanAtta Gates, II , Gerard Edmond Henein , David Andrew Ramsey , James Albert Walker
发明人： Joseph Earl Ford , John VanAtta Gates, II , Gerard Edmond Henein , David Andrew Ramsey , James Albert Walker
IPC分类号： G02B2710
CPC分类号： G02B26/001 , G02B6/4214
摘要： In accordance with the invention, a electromechanical optical modulator comprising an optical membrane, a substrate and Fabry-Perot air gap between them is provided with an improved structure for controlling light transmitted into the substrate. Specifically, an etched and coated cavity is formed in the backwall of the substrate underlying the air gap to receive transmitted light and redirect it onto controllable paths within the substrate. Advantageously the substrate is silicon, and the cavity is produced by anisotropic etching.
摘要翻译：根据本发明，包括光学膜，基底和它们之间的法布里 - 珀罗气隙的机电光学调制器具有改进的结构，用于控制透射到基底中的光。具体来说，蚀刻和涂覆的空腔形成在气隙下面的基板的后壁中以接收透射光并将其重定向到基板内的可控路径上。有利地，衬底是硅，并且通过各向异性蚀刻产生空腔。

2. 发明申请

US20130058042A1 Laminated heat sinks 审中-公开
标题翻译：层压散热片
公开(公告)号：US20130058042A1
公开(公告)日：2013-03-07
申请号：US13199565
申请日：2011-09-03
申请人： Todd Richard Salamon , David Andrew Ramsey
发明人： Todd Richard Salamon , David Andrew Ramsey
IPC分类号： H05K7/20 , B23P11/00 , F28F7/00
CPC分类号： F28D15/02 , H01L23/3672 , H01L23/467 , H01L23/473 , H01L2924/0002 , Y10T29/49826 , H01L2924/00
摘要： An apparatus includes a heat sink with a complex 3D structure. The heat sink includes a stack of metal layers. The metal layers are mechanically connected together and being separated by physical interface regions. The stack has array of channels for carrying fluid through the stack. Each channel of the array has a lateral surface formed by portions of more than one of the metal layers.
摘要翻译：一种装置包括具有复杂3D结构的散热器。散热器包括一叠金属层。金属层机械地连接在一起并由物理界面区域分离。该堆叠具有用于承载通过堆叠的流体的通道阵列。阵列的每个通道具有由多于一个金属层的部分形成的侧表面。

3. 发明申请

US20070279885A1 Backages with buried electrical feedthroughs 审中-公开
标题翻译：带埋地电气馈电的后备箱
公开(公告)号：US20070279885A1
公开(公告)日：2007-12-06
申请号：US11444860
申请日：2006-05-31
申请人： Nagesh R. Basavanhally , Christopher D. W. Jones , David Andrew Ramsey
发明人： Nagesh R. Basavanhally , Christopher D. W. Jones , David Andrew Ramsey
IPC分类号： H05K7/14
CPC分类号： H01L23/49822 , B81B7/0051 , B81B7/007 , B81B2207/097 , B81C2203/0109 , B81C2203/019 , H01L23/10 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2224/48465 , H01L2224/49052 , H01L2224/49175 , H01L2224/49176 , H01L2924/01006 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/15153 , H01L2924/1517 , H01L2924/16152 , H01L2924/19107 , H01L2924/20752 , H01L2924/00014 , H01L2924/00
摘要： Apparatus include a substrate having a top surface, a housing having an inner surface, and a joint located between the housing and the substrate. The top and inner surfaces are located to form a cavity between the housing and the substrate. The joint is located to seal the cavity. The apparatus includes a micro-electronic structure that is exposed to the cavity and is located between the substrate and housing. The apparatus also includes a dielectric layer located over the substrate and electrical feedthroughs that traverse the joint and connect to the micro-electronic structure. Portions of the electrical feedthroughs that traverse the joint are located in trenches in the dielectric layer. The electrical feedthroughs have a density along part of the joint of at least 10 per millimeter.
摘要翻译：装置包括具有顶表面的基底，具有内表面的壳体和位于壳体和基底之间的接头。顶表面和内表面被定位成在壳体和基底之间形成空腔。接头位于密封腔。该装置包括微电子结构，其暴露于空腔并且位于基板和壳体之间。该装置还包括位于基板上的电介质层和穿过接头并连接到微电子结构的电馈通。穿过接头的电馈通件的部分位于电介质层的沟槽中。电馈通沿着接头部分的密度至少为每毫米10。

4. 发明授权

US06603182B1 Packaging micromechanical devices 失效
标题翻译：包装微机械装置
公开(公告)号：US06603182B1
公开(公告)日：2003-08-05
申请号：US10097072
申请日：2002-03-12
申请人： Yee Leng Low , David Andrew Ramsey
发明人： Yee Leng Low , David Andrew Ramsey
IPC分类号： H01L310232
CPC分类号： B81B7/0077 , H01L2224/48091 , H01L2224/48227 , H01L2924/09701 , H01L2924/10253 , H05K1/142 , H05K1/183 , H01L2924/00014 , H01L2924/00
摘要： The specification describes a packaging arrangement for micro-electromechanical systems (MEMS). The MEMS devices are mounted on a ceramic platform and are then packaged in a hybrid package. The hybrid package may be hermetically sealed. The hybrid package uses a ceramic insert as the primary MEMS device enclosure. The ceramic insert is mounted on a polymer printed wiring board, which provides both support and electrical interconnection for the ceramic insert. Optical access to the MEMS device is through a transparent window that may be hermetically sealed to the ceramic insert. The use of a ceramic primary enclosure for the MEMS device array substantially eliminates thermomechanical instabilities and provides thermomechanical and hermetic performance for the elements that require it. The main interconnection and routing function, implemented using standard epoxy printed circuit technology, yields high interconnection versatility and performance at low cost.
摘要翻译：本说明书描述了用于微机电系统（MEMS）的封装装置。 MEMS器件安装在陶瓷平台上，然后被封装在混合封装中。混合包装可以密封。混合封装使用陶瓷插件作为主要的MEMS器件外壳。陶瓷插入件安装在聚合物印刷线路板上，其为陶瓷插入件提供支撑和电互连。对MEMS器件的光学访问通过透明窗口，其可以与陶瓷插入件气密密封。使用用于MEMS器件阵列的陶瓷初级外壳基本上消除了热机械不稳定性并且为需要元件提供热机械和密封性能。使用标准环氧印刷电路技术实现的主要互连和布线功能以低成本产生高互连通用性和性能。

5. 发明授权

US5881193A Low profile optical subassembly 失效
标题翻译：薄型光学组件
公开(公告)号：US5881193A
公开(公告)日：1999-03-09
申请号：US764960
申请日：1996-12-13
申请人： Felix Anigbo , Mindaugas Fernand Dautartas , William Michael MacDonald , Edward A. Pitman , David Andrew Ramsey , Dominic Paul Rinaudo , Yiu-Huen Wong
发明人： Felix Anigbo , Mindaugas Fernand Dautartas , William Michael MacDonald , Edward A. Pitman , David Andrew Ramsey , Dominic Paul Rinaudo , Yiu-Huen Wong
IPC分类号： G01J1/02 , G02B6/32 , G02B6/42 , H01L21/66 , H01S5/00 , H01S5/02 , H01S5/022 , G02B6/36 , H01S3/19
CPC分类号： G02B6/4295 , G02B6/4201 , G02B6/4224 , G02B6/4244 , G02B6/4257 , G02B6/4274 , G02B6/4204 , G02B6/423 , H01S5/02252 , H01S5/02288 , H01S5/0683
摘要： There is disclosed, an optical subassembly includes a platform on which a laser and photodiode are mounted. The laser has a rear facet through which passes a small portion of the light emitted by the laser. The photodiode is mounted on the surface of the platform with a light admitting facet for receiving a portion of the light emitted from the rear facet of the laser being substantially perpendicular to the light emitting facet of the laser. The surface of the platform may include a channel. The channel may be tapered from a narrower end near the laser to a wider end near the photodiode, and may be coated with a light-reflective material.
摘要翻译：公开了一种光学子组件，其包括安装有激光器和光电二极管的平台。激光器具有后面，通过该小面通过激光器发射的光的一小部分。光电二极管安装在平台的表面上，具有光入射面，用于接收从激光器的后面发射的光的一部分基本上垂直于激光的发光小面。平台的表面可以包括通道。通道可以从激光附近的较窄端到光电二极管附近的较宽端逐渐变细，并且可以涂覆有光反射材料。

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