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    • 2. 发明授权
    • Probe holder for a probe for testing semiconductor components
    • 用于测试半导体元件的探头的探头支架
    • US07579849B2
    • 2009-08-25
    • US11674430
    • 2007-02-13
    • Jorg KiesewetterStefan KreissigStojan Kanev
    • Jorg KiesewetterStefan KreissigStojan Kanev
    • G01R31/02
    • G01R1/06705G01R1/0675
    • A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force, includes a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test apparatus and has a holder arm having a needle holder at the free end thereof to fasten the probe needle, and a fastening arm for connecting the probe holder to the carrier device. The holder arm and the fastening arm are connected to one another by an articulated joint, whereby horizontal offset of the needle tip on account of external forces can be reduced or even prevented by increasing the radius of the yielding movement of the probe needle.
    • 探针支架,其中探针在垂直力的作用下具有轻微的水平偏移,包括用于探针的探针支架,其中该支架适于紧固和电接触连接在载体装置上 测试装置,并且具有在其自由端具有针保持器的保持臂,用于固定探针,以及用于将探针保持器连接到载体装置的紧固臂。 保持臂和紧固臂通过铰接接头彼此连接,由此可以通过增加探针的屈服运动的半径来减小或甚至防止由于外力引起的针尖的水平偏移。
    • 3. 发明申请
    • METHOD AND ARRANGEMENT FOR POSITIONING A PROBE CARD
    • 定位探针卡的方法和布置
    • US20090021275A1
    • 2009-01-22
    • US11947129
    • 2007-11-29
    • Stojan KanevHans-Jurgen FleischerStefan KreissigJorg Kiesewetter
    • Stojan KanevHans-Jurgen FleischerStefan KreissigJorg Kiesewetter
    • G01R1/067G01R31/02
    • G01R31/2891G01R31/2887
    • A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.
    • 一种用于相对于测试基板垂直定位探针卡的方法,包括将在第一定位步骤中接近的分离位置存储为探针卡的针尖与基底之间的距离,存储在第二定位中接近的接触位置 一直到探针卡接触基板,并显示针尖的图像。 为了避免在探针卡改变之后的错误操作,当成像针尖时,存储的接触位置成像并改变,直到该接触位置的呈现对应于适合于相应探针卡的尖端的实际高度,并且该设置为 然后存储为新的联系人位置。 显示装置呈现针尖和存储的接触位置,并且连接到存储器,记录装置和改变接触位置的输入装置。
    • 4. 发明申请
    • Method and prober for contacting a contact area with a contact tip
    • 用于将接触区域与接触尖端接触的方法和探测器
    • US20050007135A1
    • 2005-01-13
    • US10879622
    • 2004-06-29
    • Stefan SchneidewindClaus DietrichJorg KiesewetterStojan KanevStefan KreissigFrank FehrmannHans-Jurgen Fleischer
    • Stefan SchneidewindClaus DietrichJorg KiesewetterStojan KanevStefan KreissigFrank FehrmannHans-Jurgen Fleischer
    • G01R31/28G01R31/02
    • G01R31/2886
    • A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.
    • 接触区域与探针中的接触针尖(接触尖端)接触的方法以及这种探测器的布置的方法基于确保可靠接触和直接观察触点之间的接触的建立的目的 接触小尺寸接触垫时的接触面和接触面积。 探测器基本上包括具有移动装置的基架,该移动装置包括用于接收半导体晶片的夹持夹具以及与半导体晶片的自由表面相对布置的接触针。 接触尖端的接触最初需要半导体晶片的水平定位,使得接触面和接触尖端彼此之间并且彼此间隔一定距离,随后沿接触尖端的方向垂直移动, 直到接触尖端与接触区域的接触被建立。 该目的是通过半导体晶片的垂直移动直到达到最终位置在水平观察方向上直接观察为目的,为此目的,观察装置以这样的方式布置,使得观察轴以间隔 在自由晶片表面上方。
    • 5. 发明申请
    • PROBE STATION AND METHOD FOR MEASUREMENTS OF SEMICONDUCTOR DEVICES UNDER DEFINED ATMOSPHERE
    • 探测台和定义大气半导体器件测量方法
    • US20080143365A1
    • 2008-06-19
    • US11943975
    • 2007-11-21
    • Jorg KiesewetterStefan KreissigStojan KanevClaus Dietrich
    • Jorg KiesewetterStefan KreissigStojan KanevClaus Dietrich
    • G01R31/26
    • G01R31/2881
    • A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.
    • 描述了适用于在大气条件下偏离环境条件的半导体衬底的测试的探测器。 探测器包括用于安装半导体衬底的卡盘和用于安装用于半导体衬底的电接触的测试尖端的探针保持器。 半导体衬底和测试尖端布置在相对于周围大气密封的壳体内。 壳体包括与密封件连接的两个壳体部件。 密封件可以用两种不同的压力充气,并且在较高压力下可变形较小。 为了测试半导体衬底,半导体衬底相对于测试尖端的粗略定位发生在大气条件下,然后在密封件的较高压力下产生密封件的较低可变形性之前用密封壳体和可变形密封件进行精细定位, 半导体衬底被测试头接触并进行测试。
    • 6. 发明授权
    • Method and arrangement for positioning a probe card
    • 定位探针卡的方法和布置
    • US07733108B2
    • 2010-06-08
    • US12329968
    • 2008-12-08
    • Stojan KanevHans-Jurgen FleischerStefan KressigJorg Kiesewetter
    • Stojan KanevHans-Jurgen FleischerStefan KressigJorg Kiesewetter
    • G01R31/02
    • G01R31/2891G01R31/2887
    • A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.
    • 一种用于相对于测试基板垂直定位探针卡的方法,包括将在第一定位步骤中接近的分离位置存储为探针卡的针尖与基底之间的距离,存储在第二定位中接近的接触位置 一直到探针卡接触基板,并显示针尖的图像。 为了避免在探针卡改变之后的错误操作,当成像针尖时,存储的接触位置成像并改变,直到该接触位置的呈现对应于适合于相应探针卡的尖端的实际高度,并且该设置为 然后存储为新的联系人位置。 显示装置呈现针尖和存储的接触位置,并且连接到存储器,记录装置和改变接触位置的输入装置。
    • 7. 发明申请
    • METHOD FOR TESTING ELECTRONIC COMPONENTS AND TEST APPARATUS FOR CARRYING OUT THE METHOD
    • 用于测试电子元件的方法和用于实施该方法的测试装置
    • US20080180119A1
    • 2008-07-31
    • US11947206
    • 2007-11-29
    • Stojan KANEVJorg Kiesewetter
    • Stojan KANEVJorg Kiesewetter
    • G01R31/26G01R31/02
    • G01R31/2887
    • A method and an apparatus are provided which make it possible, when testing chips arranged on a wafer, to be able to test optionally both additional components arranged on horizontal boundary lines and on vertical boundary lines. The additional components arranged on horizontal boundary lines are tested in a first position of the wafer. For testing the additional components arranged on vertical boundary lines, the wafer is rotated about its vertical axis through 90° relative to the first position into a second position. The apparatus comprises a housing and, in the housing, at least one test probe for making contact with an electronic component, a chuck for moving the wafer and a rotatably mounted additional plate operatively connected to the chuck.
    • 提供了一种方法和装置,其使得当测试布置在晶片上的芯片时能够可选地测试布置在水平边界线上和垂直边界线上的两个附加组件。 布置在水平边界线上的附加部件在晶片的第一位置被测试。 为了测试布置在垂直边界线上的附加组件,晶片围绕其垂直轴线相对于第一位置旋转90°进入第二位置。 该装置包括壳体,并且在壳体中,用于与电子部件接触的至少一个测试探针,用于移动晶片的卡盘和可操作地连接到卡盘的可旋转地安装的附加板。
    • 10. 发明授权
    • Test apparatus with loading device
    • 带装载装置的试验装置
    • US07038441B2
    • 2006-05-02
    • US10677524
    • 2003-10-02
    • Karsten StollStefan KreissigAlf WachtveitlMichael TeichStefan SchneidewindClaus DietrichJorg KiesewetterDietmar Runge
    • Karsten StollStefan KreissigAlf WachtveitlMichael TeichStefan SchneidewindClaus DietrichJorg KiesewetterDietmar Runge
    • G01R31/02
    • G01R31/2865G01R31/2806G01R31/2831G01R31/2887
    • The invention, which relates to a test apparatus with loading device which has a chuck, which is provided with a bearing surface for a test substrate and with a chuck drive, by means of which the chuck can be displaced with a working area, and which has a receiving means for receiving test substrates, which can be displaced from a working area of the chuck to a receiving position outside the working area, is based on the object of increasing the accuracy of the movement of the chuck. Moreover, in the case of test apparatus with a controlled atmosphere, a further object is to prevent the chuck from being exposed to the open-air atmosphere. This is achieved by virtue of the fact that a carriage, which can be displaced between a position close to the chuck, in which the chuck is located in a position inside the working area, and the receiving position, is provided, which carriage is provided with a holder, in which the test substrate can be at least indirectly inserted in such a way that the test substrate, when the carriage is in the position close to the chuck, is located above the chuck. The holder and the chuck can move vertically relative to one another when the carriage is in the position close to the chuck.
    • 本发明涉及具有卡盘的装载装置的测试装置,其具有用于测试基板的轴承表面和卡盘驱动装置,通过该卡盘驱动器卡盘可以移动工作区域,并且其中 具有用于接收可以从卡盘的工作区域移动到工作区域外部的接收位置的测试基板的接收装置,其基础是提高卡盘的运动精度的目的。 此外,在具有受控气氛的测试装置的情况下,另一个目的是防止卡盘暴露于露天气氛。 这是通过以下事实来实现的:提供了可以在卡盘位于工作区域内的位置的接近卡盘的位置之间移动的托架和接收位置,该托架被设置 具有保持器,其中测试基板可以至少间接地插入,使得当托架处于靠近卡盘的位置时,测试基板位于卡盘上方。 当托架位于靠近卡盘的位置时,托架和夹头可以相对于彼此垂直移动。