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    • 2. 发明申请
    • Method and prober for contacting a contact area with a contact tip
    • 用于将接触区域与接触尖端接触的方法和探测器
    • US20050007135A1
    • 2005-01-13
    • US10879622
    • 2004-06-29
    • Stefan SchneidewindClaus DietrichJorg KiesewetterStojan KanevStefan KreissigFrank FehrmannHans-Jurgen Fleischer
    • Stefan SchneidewindClaus DietrichJorg KiesewetterStojan KanevStefan KreissigFrank FehrmannHans-Jurgen Fleischer
    • G01R31/28G01R31/02
    • G01R31/2886
    • A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.
    • 接触区域与探针中的接触针尖(接触尖端)接触的方法以及这种探测器的布置的方法基于确保可靠接触和直接观察触点之间的接触的建立的目的 接触小尺寸接触垫时的接触面和接触面积。 探测器基本上包括具有移动装置的基架,该移动装置包括用于接收半导体晶片的夹持夹具以及与半导体晶片的自由表面相对布置的接触针。 接触尖端的接触最初需要半导体晶片的水平定位,使得接触面和接触尖端彼此之间并且彼此间隔一定距离,随后沿接触尖端的方向垂直移动, 直到接触尖端与接触区域的接触被建立。 该目的是通过半导体晶片的垂直移动直到达到最终位置在水平观察方向上直接观察为目的,为此目的,观察装置以这样的方式布置,使得观察轴以间隔 在自由晶片表面上方。
    • 3. 发明授权
    • Modular prober and method for operating same
    • 模块化探测器和操作方法
    • US09194885B2
    • 2015-11-24
    • US13820098
    • 2011-09-02
    • Stojan KanevBotho HirschfeldAxel BeckerUlf Hackius
    • Stojan KanevBotho HirschfeldAxel BeckerUlf Hackius
    • G01R1/04G01R31/26G01R31/28G01R31/319
    • G01R1/0408G01R31/2601G01R31/2868G01R31/31907
    • The invention relates to a prober for checking and testing electronic semiconductor components and methods of using the same. The prober comprises at least two checking units, each of which is equipped with a chuck, probes, and a positioning unit, and each of which is assigned to a machine control system and a process control system. The prober further comprises a loading unit for automatically loading both testing units and an additional loader for manually loading at least one of the testing units, a user interface, and a module control system for controlling the process control systems and/or the machine control systems and the loading unit. The user interface can optionally be connected to at least one of the process control systems or the module control system by means of a switching device of the prober.
    • 本发明涉及用于检查和测试电子半导体元件的探测器及其使用方法。 探测器包括至少两个检查单元,每个检查单元都配备有卡盘,探针和定位单元,并且每个检查单元分配给机器控制系统和过程控制系统。 探测器还包括用于自动加载两个测试单元的加载单元和用于手动加载至少一个测试单元的附加加载器,用户界面和用于控制过程控制系统和/或机器控制系统的模块控制系统 和装载单元。 用户界面可以通过探测器的切换装置可选地连接到过程控制系统或模块控制系统中的至少一个。
    • 4. 发明申请
    • MODULAR PROBER AND METHOD FOR OPERATING SAME
    • 模块化探测器及其操作方法
    • US20140145743A1
    • 2014-05-29
    • US13820098
    • 2011-09-02
    • Stojan KanevBotho HirschfeldAxel BeckerUlf Hackius
    • Stojan KanevBotho HirschfeldAxel BeckerUlf Hackius
    • G01R1/04G01R31/26
    • G01R1/0408G01R31/2601G01R31/2868G01R31/31907
    • The invention relates to a prober for checking and testing electronic semiconductor components and methods of using the same. The prober comprises at least two checking units, each of which is equipped with a chuck, probes, and a positioning unit, and each of which is assigned to a machine control system and a process control system. The prober further comprises a loading unit for automatically loading both testing units and an additional loader for manually loading at least one of the testing units, a user interface, and a module control system for controlling the process control systems and/or the machine control systems and the loading unit. The user interface can optionally be connected to at least one of the process control systems or the module control system by means of a switching device of the prober.
    • 本发明涉及用于检查和测试电子半导体元件的探测器及其使用方法。 探测器包括至少两个检查单元,每个检查单元都配备有卡盘,探针和定位单元,并且每个检查单元分配给机器控制系统和过程控制系统。 探测器还包括用于自动加载两个测试单元的加载单元和用于手动加载至少一个测试单元的附加加载器,用户界面和用于控制过程控制系统和/或机器控制系统的模块控制系统 和装载单元。 用户界面可以通过探测器的切换装置可选地连接到过程控制系统或模块控制系统中的至少一个。
    • 5. 发明授权
    • Probe holder for a probe for testing semiconductor components
    • 用于测试半导体元件的探头的探头支架
    • US07579849B2
    • 2009-08-25
    • US11674430
    • 2007-02-13
    • Jorg KiesewetterStefan KreissigStojan Kanev
    • Jorg KiesewetterStefan KreissigStojan Kanev
    • G01R31/02
    • G01R1/06705G01R1/0675
    • A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force, includes a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test apparatus and has a holder arm having a needle holder at the free end thereof to fasten the probe needle, and a fastening arm for connecting the probe holder to the carrier device. The holder arm and the fastening arm are connected to one another by an articulated joint, whereby horizontal offset of the needle tip on account of external forces can be reduced or even prevented by increasing the radius of the yielding movement of the probe needle.
    • 探针支架,其中探针在垂直力的作用下具有轻微的水平偏移,包括用于探针的探针支架,其中该支架适于紧固和电接触连接在载体装置上 测试装置,并且具有在其自由端具有针保持器的保持臂,用于固定探针,以及用于将探针保持器连接到载体装置的紧固臂。 保持臂和紧固臂通过铰接接头彼此连接,由此可以通过增加探针的屈服运动的半径来减小或甚至防止由于外力引起的针尖的水平偏移。
    • 7. 发明授权
    • Method and arrangement for positioning a probe card
    • 定位探针卡的方法和布置
    • US07733108B2
    • 2010-06-08
    • US12329968
    • 2008-12-08
    • Stojan KanevHans-Jurgen FleischerStefan KressigJorg Kiesewetter
    • Stojan KanevHans-Jurgen FleischerStefan KressigJorg Kiesewetter
    • G01R31/02
    • G01R31/2891G01R31/2887
    • A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.
    • 一种用于相对于测试基板垂直定位探针卡的方法,包括将在第一定位步骤中接近的分离位置存储为探针卡的针尖与基底之间的距离,存储在第二定位中接近的接触位置 一直到探针卡接触基板,并显示针尖的图像。 为了避免在探针卡改变之后的错误操作,当成像针尖时,存储的接触位置成像并改变,直到该接触位置的呈现对应于适合于相应探针卡的尖端的实际高度,并且该设置为 然后存储为新的联系人位置。 显示装置呈现针尖和存储的接触位置,并且连接到存储器,记录装置和改变接触位置的输入装置。
    • 8. 发明申请
    • METHOD AND ARRANGEMENT FOR POSITIONING A PROBE CARD
    • 定位探针卡的方法和布置
    • US20090021275A1
    • 2009-01-22
    • US11947129
    • 2007-11-29
    • Stojan KanevHans-Jurgen FleischerStefan KreissigJorg Kiesewetter
    • Stojan KanevHans-Jurgen FleischerStefan KreissigJorg Kiesewetter
    • G01R1/067G01R31/02
    • G01R31/2891G01R31/2887
    • A method for perpendicular positioning of a probe card relative to a test substrate, includes storing a separation position approached in a first positioning step as a distance between the needle tips of the probe card and the substrate, storing a contact position approached in a second positioning step until the probe card contacts the substrate, and displaying an image of the needle tips. For avoiding erroneous operation after a probe card has been changed, when imaging the needle tips, the stored contact position is imaged and is changed until presentation of this contact position corresponds to actual height of the tips appropriate for the respective probe card and this setting is then stored as a new contact position. A display device presents the needle tips and the stored contact position and is connected to a memory, a recording device and an input device which changes the contact position.
    • 一种用于相对于测试基板垂直定位探针卡的方法,包括将在第一定位步骤中接近的分离位置存储为探针卡的针尖与基底之间的距离,存储在第二定位中接近的接触位置 一直到探针卡接触基板,并显示针尖的图像。 为了避免在探针卡改变之后的错误操作,当成像针尖时,存储的接触位置成像并改变,直到该接触位置的呈现对应于适合于相应探针卡的尖端的实际高度,并且该设置为 然后存储为新的联系人位置。 显示装置呈现针尖和存储的接触位置,并且连接到存储器,记录装置和改变接触位置的输入装置。
    • 9. 发明申请
    • PROBE STATION AND METHOD FOR MEASUREMENTS OF SEMICONDUCTOR DEVICES UNDER DEFINED ATMOSPHERE
    • 探测台和定义大气半导体器件测量方法
    • US20080143365A1
    • 2008-06-19
    • US11943975
    • 2007-11-21
    • Jorg KiesewetterStefan KreissigStojan KanevClaus Dietrich
    • Jorg KiesewetterStefan KreissigStojan KanevClaus Dietrich
    • G01R31/26
    • G01R31/2881
    • A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.
    • 描述了适用于在大气条件下偏离环境条件的半导体衬底的测试的探测器。 探测器包括用于安装半导体衬底的卡盘和用于安装用于半导体衬底的电接触的测试尖端的探针保持器。 半导体衬底和测试尖端布置在相对于周围大气密封的壳体内。 壳体包括与密封件连接的两个壳体部件。 密封件可以用两种不同的压力充气,并且在较高压力下可变形较小。 为了测试半导体衬底,半导体衬底相对于测试尖端的粗略定位发生在大气条件下,然后在密封件的较高压力下产生密封件的较低可变形性之前用密封壳体和可变形密封件进行精细定位, 半导体衬底被测试头接触并进行测试。
    • 10. 发明申请
    • METHOD FOR TESTING ELECTRONIC COMPONENTS OF A REPETITIVE PATTERN UNDER DEFINED THERMAL CONDITIONS
    • 根据定义的热条件测试重复图案的电子元件的方法
    • US20110221461A1
    • 2011-09-15
    • US13119916
    • 2009-09-01
    • Stojan KanevFrank FehrmannJens FiedlerClaus DietrichJörg Kiesewetter
    • Stojan KanevFrank FehrmannJens FiedlerClaus DietrichJörg Kiesewetter
    • G01R31/00
    • G01R31/319G01R1/07392G01R31/2891
    • The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component (1) is positioned and contacted by a first positioning step which jointly affects all probes (12) first being carried out in an intermediate position, in the result of which the component (1) lies at a defined distance under the probe tips (13), the position of each individual probe tip (13) being subsequently corrected by means of separate manipulators to the position of the corresponding contact pad (3) to be contacted with the particular probe tip (13) so that each probe tip (13) lies above a contact pad (3), and the probe tips (13) further subsequently being brought into contact with the contact pads (3) of the component (1) by means of an advancing movement.
    • 本发明涉及一种用于在探测器中在限定的热条件下测试多个重复图案的电子部件(1)的方法,其包括用于保持部件(1)的卡盘(10)和用于保持个人的特殊保持装置(15) 探针(12)。 为了测试,组件(1)被调节到限定的温度,(12)和第一电子部件(1)通过至少一个定位装置相对于彼此定位,电子的接触垫(3) 组件(1)随后被探针(12)接触,使得可以测试组件(1),然后重复定位和接触以测试重复图案的另一组件(1)。 为了缩短在变化的温度下进行测量的测试时间,同时通过使用单个探针确保部件的可靠接触,组件(1)通过第一定位步骤定位和接触,第一定位步骤共同影响首先执行的所有探头(12) 在中间位置,其结果是部件(1)位于探针尖端(13)下方的限定距离处,每个单独的探针尖端(13)的位置随后通过单独的操纵器被校正到 相应的接触垫(3)与特定探针尖端(13)接触,使得每个探针尖端(13)位于接触垫(3)上方,并且探针尖端(13)进一步随后与 通过前进运动,组件(1)的接触垫(3)。