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1. 发明授权

US06328638B1 Apparatus and methods for recovering abrasive from an abrasive-laden fluid 失效
标题翻译：从磨料载液中回收磨料的装置和方法
公开(公告)号：US06328638B1
公开(公告)日：2001-12-11
申请号：US09491684
申请日：2000-01-26
申请人： Jordan J. Hopkins , Jonathan M. Stewart , Felice M. Sciulli , Katherine Zaring , Daniel Chin , John Massenburg , Daniel Devine
发明人： Jordan J. Hopkins , Jonathan M. Stewart , Felice M. Sciulli , Katherine Zaring , Daniel Chin , John Massenburg , Daniel Devine
IPC分类号： B24B900
CPC分类号： B01D21/2416 , B01D21/0039 , B01D21/0045 , B01D21/0063 , B01D21/009 , B01D21/2494 , B24C1/045 , B24C9/003 , B24C9/006 , B26F3/008 , Y02P70/179
摘要： An improved apparatus and methods for recovering abrasive from an abrasive-laden fluid are shown and described. An abrasive-laden fluid handling device is coupled to a catcher tank to collect abrasive-laden fluid and transport it to a hydro-classifier. Wet recovered abrasive is discharged from the hydro-classifier and transferred to a de-watering device. The de-watering device removes water from the abrasive by decanting fluid and via use of an air eduction system. De-watered abrasive is then ejected from the de-watering device to a dryer unit, to be further dried and processed for reuse.
摘要翻译：显示和描述了一种改进的从含磨料流体中回收磨料的设备和方法。装载磨料的流体处理装置联接到捕集罐以收集磨料载流体并将其输送到加氢分级器。湿回收的磨料从加氢分级机排出并转移到脱水装置。脱水装置通过倾析流体和通过使用空气排出系统从磨料中除去水分。然后将脱水的研磨剂从脱水装置喷射到干燥器单元，以进一步干燥和处理以便重新使用。

2. 发明授权

US06361416B1 Apparatus and methods for recovering abrasive from an abrasive-laden fluid for use with abrasive jet cutting systems 有权
标题翻译：用于从研磨剂的流体中回收磨料以用于磨料射流切割系统的装置和方法
公开(公告)号：US06361416B1
公开(公告)日：2002-03-26
申请号：US09383044
申请日：1999-08-25
申请人： Jordan J. Hopkins , Jonathan M. Stewart , Felice M. Sciulli , Katherine Zaring , Daniel Chin , John Massenburg , Daniel Devine
发明人： Jordan J. Hopkins , Jonathan M. Stewart , Felice M. Sciulli , Katherine Zaring , Daniel Chin , John Massenburg , Daniel Devine
IPC分类号： B24C900
CPC分类号： B26F3/008 , B24C1/045 , B24C9/003 , B24C9/006 , Y02P70/179
摘要： This invention relates to methods and apparatus for recovering abrasive for use with abrasive jet cutting systems. In one embodiment, an apparatus in accordance with the invention includes an abrasive-laden fluid handling device coupled to a catcher tank of an abrasive jet cutting system, a pre-classifier fluidly coupled to the abrasive-laden fluid handling device, a hydro-classifier fluidly coupled to the pre-classifier, a fine-particle separation tank fluidly coupled to a clarified-fluid flow outlet of the hydro-classifier, a wet abrasive receptacle positioned to receive a wet recovered abrasive discharged from the hydro-classifier, a de-watering device engageable with the wet recovered abrasive in wet abrasive receptacle, and a dryer unit. The abrasive-laden fluid handling device may include an abrasive-laden fluid conduit having a first end in fluid communication with the catcher tank and an abrasive-laden fluid outlet. Alternately, the abrasive-laden fluid handling device may include a fluid drive system. In another embodiment, a de-watering device includes a housing having a wet abrasive intake and a de-watered abrasive, and an eductor port situated along an abrasive travel path extending between the wet abrasive intake and the de-watered abrasive outlet, an eductor inlet coupled to the eductor port and coupleable to a source of eduction air, and a transport device. In a further embodiment, an apparatus includes an airflow control valve fluidly coupled to the eductor port and positionable in a first position to draw an entrained airflow from within the housing through the eductor port, and a second position to backflow the eduction air through the eductor port into the housing.
摘要翻译：本发明涉及用于回收用于磨料射流切割系统的磨料的方法和设备。在一个实施例中，根据本发明的装置包括耦合到磨料喷射切割系统的捕集罐的磨料载流体处理装置，流体耦合到磨料载流体处理装置的预分级器，加氢分级器流体耦合到预分类器，流体耦合到加氢分选机的澄清流体流出口的细颗粒分离罐，设置成接收从加氢分级器排出的湿回收磨料的湿磨料容器，可在湿磨机容器中与湿回收的磨料接合的浇水装置和干燥器单元。含磨料的流体处理装置可以包括具有磨料的流体导管，其具有与捕集罐和磨料填充的流体出口流体连通的第一端。或者，含磨料的流体处理装置可以包括流体驱动系统。在另一个实施例中，脱水装置包括具有湿磨料入口和脱水磨料的壳体，以及沿着在湿磨料入口和脱水磨料出口之间延伸的研磨行进路径设置的喷射器端口，喷射器入口连接到喷射器端口并且可耦合到排出的空气源，以及输送装置。在另一实施例中，一种装置包括流体耦合到喷射器端口的气流控制阀，并且可定位在第一位置，以便通过喷射器端口从壳体内抽出夹带的气流，以及第二位置，以使排出的空气通过喷射器港口进入住房。

3. 发明申请

US20070175864A1 Low Cost High Throughput Processing Platform 有权
标题翻译：低成本高吞吐量处理平台
公开(公告)号：US20070175864A1
公开(公告)日：2007-08-02
申请号：US11622361
申请日：2007-01-11
申请人： Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： C03C15/00 , B44C1/22 , H01L21/306
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.
摘要翻译：作为用于处理工件的系统的一部分，与处理室装置分离的工件支撑装置至少大体上以堆叠关系支撑至少两个工件以形成工件柱。传送装置通过同时移动两个工件至少大致沿着分别在工件柱和第一和第二过程之间的第一和第二传送路径移动工件柱和处理室装置之间的至少两个工件车站。传送装置可以同时移动未经处理和处理的工件。描述了垂直运动摆臂和同轴摆臂。一对间隔开的摆臂，工件列和加工台可以协调地限定五边形形状。还描述了同步带齿隙消除，双自由度槽阀和低点室泵送，用于去除室污染物。

4. 发明申请

US20070131671A1 Selective reflectivity process chamber with customized wavelength response and method 有权
标题翻译：选择性反射处理室，具有定制的波长响应和方法
公开(公告)号：US20070131671A1
公开(公告)日：2007-06-14
申请号：US11506174
申请日：2006-08-16
申请人： Paul Timans , Daniel Devine , Young Lee , Yao Hu , Peter Bordiga
发明人： Paul Timans , Daniel Devine , Young Lee , Yao Hu , Peter Bordiga
IPC分类号： F27D11/00
CPC分类号： H01L21/67115 , F27B17/0025
摘要： A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processing a treatment object having a given emission spectrum at a treatment object temperature which causes the treatment object to produce a treatment object radiated energy. The chamber responds in a first way to the heating arrangement radiated energy and in a second way to the treatment object radiated energy that is incident thereon. The chamber may respond in the first way by reflecting the majority of the heat source radiated energy and in the second way by absorbing the majority of the treatment object radiated energy. Different portions of the chamber may be treated with selectively reflectivity based on design considerations to achieve objectives with respect to a particular chamber performance parameter.
摘要翻译：描述了可定制的室光谱响应，其可以至少用于定制晶片加热，晶片冷却，温度测量和杂散光的室性能。在一个方面，描述了一种系统，用于处理在处理对象温度下具有给定发射光谱的治疗对象，其使得治疗对象产生治疗对象的辐射能。室以第一种方式响应于加热装置的辐射能量，并以第二种方式响应入射在其上的处理对象辐射能。通过反映大部分热源辐射能量，腔室可以以第一种方式作出反应，并且以第二种方式吸收大部分治疗对象的辐射能量。可以基于设计考虑来选择反射率来处理室的不同部分，以实现关于特定室性能参数的目标。

5. 发明申请

US20050029153A1 Mint package 有权
公开(公告)号：US20050029153A1
公开(公告)日：2005-02-10
申请号：US10637907
申请日：2003-08-08
申请人： Daniel Devine
发明人： Daniel Devine
IPC分类号： B65D47/28 , B65D85/60 , B65D85/00
CPC分类号： B65D85/60 , B65D47/286 , B65D83/0481
摘要： In accordance the present invention a package assembly 10 for the storage and distribution of a plurality of mints 14 is provided comprising a bottom container 12 for the storage of the plurality of mints 14, the bottom container 12 comprising a bottom container base 16 and a plurality of bottom container sidewalls 18. The package assembly 10 also includes an upper cover 24 including an upper cover top surface 36. The upper cover 24 is mountable to the bottom container 12. An arched longitudinal detent 38 is formed in the upper cover 24. The arched longitudinal detent 38 is comprised of a detent surface 40 having a detent width 42, a detent length 44 and a detent depth 46. A delivery orifice 54 is formed through a portion of the arched longitudinal detent 38 and has an orifice width 56 and an orifice length 58. The orifice width 56 and the orifice length 58 are sized to allow one of the plurality of mints 14 to pass through the delivery orifice 54. An engagement slot 60 is formed into the arched longitudinal detent 38, the engagement slot 60 having a slot width 63, a slot length 64, and a slot depth 66. The engagement slot 60 is preferably connected to said delivery orifice 54. A slidable arched tongue element 68 is movable between a tongue open position 72 and a tongue closed position 70. The tongue element 68 includes a tongue upper surface 74 and a tongue lower surface 76. The slidable arched tongue element 68 covers the delivery orifice 54 when in the tongue closed position 70 and the slidable arched tongue element 68 uncovers the delivery orifice 54 when in the tongue open position 72. A t-shaped tongue engagement element 92 is mounted to the tongue lower surface 76 and is comprised of a longitudinal vertical member 94 and a longitudinal horizontal member 96. The longitudinal vertical member 94 has a vertical member length 102, a vertical member width 98, and a vertical member depth 100. The longitudinal vertical member 94 is positioned within the engagement slot 60 such that the slidable arched tongue element 68 is slidably secured to the arched longitudinal detent 38.

6. 发明申请

US20060032848A1 Process and system for heating semiconductor substrates in a processing chamber containing a susceptor 审中-公开
公开(公告)号：US20060032848A1
公开(公告)日：2006-02-16
申请号：US11253271
申请日：2005-10-18
申请人： Young Lee , Ronald Wang , Steven Ly , Daniel Devine
发明人： Young Lee , Ronald Wang , Steven Ly , Daniel Devine
IPC分类号： H05B6/02 , C23C16/00
CPC分类号： H01L21/67103 , C23C16/4583 , C23C16/4585 , C23C16/46 , C30B25/12
摘要： A process and system for heating semiconductor substrates in a processing chamber on a susceptor as disclosed. In accordance with the present invention, the susceptor includes a support structure made from a material having a relatively low thermal conductivity for suspending the wafer over the susceptor. The support structure has a particular height that inhibits or prevents radial temperature gradients from forming in the wafer during high temperature processing. If needed, recesses can be formed in the susceptor for locating and positioning a support structure. The susceptor can include a wafer supporting surface defining a pocket that has a shape configured to conform to the shape of a wafer during a heat cycle.

7. 发明授权

US06953131B2 Mint roll package 有权
公开(公告)号：US06953131B2
公开(公告)日：2005-10-11
申请号：US10637425
申请日：2003-08-08
申请人： Daniel Devine
发明人： Daniel Devine
IPC分类号： B65D83/04 , B65G59/00
CPC分类号： B65D83/0409 , B65D2583/0431
摘要： A package assembly 10 for the storage and distribution of a plurality of stacked mints 12 is provided. The package assembly 10 includes a cylindrical outer shell 14 including a shell sidewall 16, a shell bottom surface 18, and a shell open top 20. The shell sidewall 16 includes a sidewall inner surface 22 and a sidewall outer surface 24. A vertical control slot 28 is formed in the shell sidewall 16, the vertical control slot 28 having a control slot height 40 and a control slot width 42. At least one retention protrusion 78 is formed onto a slot side edge 34 such that the control slot width 42 is reduced in the location of the at least one retention protrusion 78. A cylindrical inner insert 26 including an insert sidewall 44, an insert top surface 46, and an insert open bottom 48, is formed to house the plurality of stacked mints 12. The cylindrical inner insert 26 is positioned within the cylindrical outer shell 14 such that the insert open bottom 48 faces the shell bottom surface 18. A control pad 52 is formed onto and protrudes outwards from the insert sidewall 44. The control pad 52 is positioned within the vertical control slot 28 and is movable such that the cylindrical inner insert 26 can be moved between a closed position 68 and an open position 70. The control pad 52 has a control pad width 54 such that said control pad 52 engages the at least one retention protrusion 78 when in the closed position 68 and such that the cylindrical inner insert 26 is resisted from moving into the open position 70. A dispensing chamber 72 is formed in the insert sidewall 44 adjoining the insert top surface 46. The dispensing chamber 72 is covered by the shell sidewall 16 when the cylindrical inner insert 26 is in the closed position 68. The dispensing chamber 72 is positioned outside the cylindrical outer shell 14 when the cylindrical inner insert 26 is in the open position 70. The dispensing chamber 72 has a dispensing chamber height 74 sufficient to allow one of the plurality of stacked mints 12 to be removed from the cylindrical inner insert 26.

8. 发明申请

US20050098553A1 Shadow-free shutter arrangement and method 有权
标题翻译：无阴影快门布置和方法
公开(公告)号：US20050098553A1
公开(公告)日：2005-05-12
申请号：US10706367
申请日：2003-11-12
申请人： Daniel Devine , Young Lee , Paul Timans , Frank Lema
发明人： Daniel Devine , Young Lee , Paul Timans , Frank Lema
IPC分类号： B23H20060101 , F27B5/14 , F27B17/00 , F27D5/00 , F27D11/00 , H01L21/00
CPC分类号： H01L21/67115 , F27B17/0025 , F27D5/0037
摘要： As part of a system for processing a workpiece by applying a controlled heat to the workpiece, a heating arrangement includes an array of spaced apart heating elements for use in a confronting relationship with the workpiece to subject the workpiece to a direct radiation that is produced. A radiation shield includes a plurality of members supported for movement between (i) retracted positions, which allow the direct radiation to reach the workpiece, and (ii) extended positions, in which the plurality of members cooperate in way which serves to at least partially block the direct radiation from reaching the workpiece and to absorb radiation emitted and reflected by the workpiece and thereby achieve greater control of the time-temperature profile than previously obtainable. At least certain ones of the members move between adjacent ones of the heating elements in moving those certain members between the retracted and extended positions. Tubular, curved and plate-like member configurations can be used.
摘要翻译：作为通过向工件施加受控热来加工工件的系统的一部分，加热装置包括用于与工件面对关系的间隔开的加热元件的阵列，以使工件受到所产生的直接辐射。辐射屏蔽包括多个构件，所述多个构件被支撑用于在（i）缩回位置之间移动，所述缩回位置允许直接辐射到达工件;以及（ii）延伸位置，其中所述多个构件以其至少部分阻止直接辐射到达工件并吸收工件发射和反射的辐射，从而实现比以前可获得的时间 - 温度分布的更大控制。至少某些构件在相邻的加热元件之间移动，以在缩回位置和延伸位置之间移动那些特定构件。可以使用管状，弯曲和板状构件构造。

9. 发明申请

US20050023267A1 Selective reflectivity process chamber with customized wavelength response and method 有权
标题翻译：选择性反射处理室，具有定制的波长响应和方法
公开(公告)号：US20050023267A1
公开(公告)日：2005-02-03
申请号：US10629400
申请日：2003-07-28
申请人： Paul Timans , Daniel Devine , Young Lee , Yao Hu , Peter Bordiga
发明人： Paul Timans , Daniel Devine , Young Lee , Yao Hu , Peter Bordiga
IPC分类号： F27B5/14 , F27B17/00 , F27D11/00 , H01L20060101 , H01L21/00
CPC分类号： H01L21/67115 , F27B17/0025
摘要： A customizable chamber spectral response is described which can be used at least to tailor chamber performance for wafer heating, wafer cooling, temperature measurement, and stray light. In one aspect, a system is described for processing a treatment object having a given emission spectrum at a treatment object temperature which causes the treatment object to produce a treatment object radiated energy. The chamber responds in a first way to the heating arrangement radiated energy and in a second way to the treatment object radiated energy that is incident thereon. The chamber may respond in the first way by reflecting the majority of the heat source radiated energy and in the second way by absorbing the majority of the treatment object radiated energy. Different portions of the chamber may be treated with selectively reflectivity based on design considerations to achieve objectives with respect to a particular chamber performance parameter.
摘要翻译：描述了可定制的室光谱响应，其可以至少用于定制晶片加热，晶片冷却，温度测量和杂散光的室性能。在一个方面，描述了一种系统，用于处理在处理对象温度下具有给定发射光谱的治疗对象，其使得治疗对象产生治疗对象的辐射能。室以第一种方式响应于加热装置的辐射能量，并以第二种方式响应入射在其上的处理对象辐射能。通过反映大部分热源辐射能量，腔室可以以第一种方式作出反应，并且以第二种方式吸收大部分治疗对象的辐射能量。可以基于设计考虑来选择反射率来处理室的不同部分，以实现关于特定室性能参数的目标。

10. 发明申请

US20070113979A1 Slotted Electrostatic Shield Modification for Improved Etch and CVD Process Uniformity 有权
标题翻译：用于改进蚀刻和CVD工艺均匀性的开槽静电屏蔽修改
公开(公告)号：US20070113979A1
公开(公告)日：2007-05-24
申请号：US11564134
申请日：2006-11-28
申请人： Rene George , Andreas Kadavanich , Daniel Devine , Stephen Savas , John Zajac , Hongching Shan
发明人： Rene George , Andreas Kadavanich , Daniel Devine , Stephen Savas , John Zajac , Hongching Shan
IPC分类号： C23F1/00 , C23C16/00
CPC分类号： H01L21/67069 , H01J37/321 , H01J37/32431 , H01L21/02104 , H01L21/3065 , H01L21/6715 , H05H1/46
摘要： A more uniform plasma process is implemented for treating a treatment object using an inductively coupled plasma source which produces an asymmetric plasma density pattern at the treatment surface using a slotted electrostatic shield having uniformly spaced-apart slots. The slotted electrostatic shield is modified in a way which compensates for the asymmetric plasma density pattern to provide a modified plasma density pattern at the treatment surface. A more uniform radial plasma process is described in which an electrostatic shield arrangement is configured to replace a given electrostatic shield in a way which provides for producing a modified radial variation characteristic across the treatment surface. The inductively coupled plasma source defines an axis of symmetry and the electrostatic shield arrangement is configured to include a shape that extends through a range of radii relative to the axis of symmetry.
摘要翻译：实施了更均匀的等离子体处理，以使用电感耦合等离子体源来处理处理对象，该等离子体源使用具有均匀间隔开的狭缝的开槽静电屏蔽件在处理表面处产生不对称等离子体密度图案。槽式静电屏蔽以补偿不对称等离子体密度图案的方式进行修改，以在处理表面提供改良的等离子体密度图案。描述了更均匀的径向等离子体处理，其中静电屏蔽装置被配置为以提供在整个处理表面上产生修改的径向变化特征的方式来替换给定的静电屏蔽。电感耦合等离子体源限定对称轴，并且静电屏蔽装置被配置为包括相对于对称轴延伸穿过半径范围的形状。

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