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1. 发明授权

US07563068B2 Low cost high throughput processing platform 有权
标题翻译：低成本高吞吐量处理平台
公开(公告)号：US07563068B2
公开(公告)日：2009-07-21
申请号：US11622361
申请日：2007-01-11
申请人： Leszek Niewmierzycki , David Barker , Daniel J. Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Daniel J. Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： B65H1/00
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.
摘要翻译：作为用于处理工件的系统的一部分，与处理室装置分开的工件支撑装置至少大体上以堆叠的关系支撑至少两个工件以形成工件柱。传送装置通过同时移动两个工件至少大致沿着分别在工件柱和第一和第二过程之间的第一和第二传送路径移动工件柱和处理室装置之间的至少两个工件车站。传送装置可以同时移动未经处理和处理的工件。描述了垂直运动摆臂和同轴摆臂。一对间隔开的摆臂，工件列和加工台可以协调地限定五边形形状。还描述了同步带齿隙消除，双自由度槽阀和低点室泵送，用于去除室污染物。

2. 发明授权

US06315512B1 Systems and methods for robotic transfer of workpieces between a storage area and a processing chamber 失效
标题翻译：在存储区域和处理室之间机械传送工件的系统和方法
公开(公告)号：US06315512B1
公开(公告)日：2001-11-13
申请号：US09200660
申请日：1998-11-25
申请人： Farzad Tabrizi , Barry Kitazumi , David A. Barker , David A. Setton , Leszek Niewmierzycki , Michael J. Kuhlman
发明人： Farzad Tabrizi , Barry Kitazumi , David A. Barker , David A. Setton , Leszek Niewmierzycki , Michael J. Kuhlman
IPC分类号： B65G4907
CPC分类号： H01L21/67196 , H01L21/67126 , H01L21/67178 , H01L21/67201 , H01L21/67742 , H01L21/67745 , H01L21/67754 , H01L21/67781 , Y10S414/135 , Y10S414/139
摘要： A workpiece handling system with dual load locks, a transport chamber and a process chamber. Workpieces may be retrieved from one load lock for processing at vacuum pressure, while workpieces are unloaded from the other load lock at the pressure of the surrounding envirornment. The transport chamber has a transport robot with two arms. Processed workpieces and new workpieces may be exchanged by a simple under/over motion of the two robot arms. The transport robot rotates about a central shaft to align with the load locks or the process chamber. The robot may also be raised or lowered to align the arms with the desired location to which workpieces are deposited or from which workpieces are retrieved. The two load locks may be positioned one above the other such that a simple vertical motion of the robot can be used to select between the two load locks. The two load locks and transport robot allow almost continuous processing. Additional process chambers may be added to the transport chamber to further increase throughput. Each stage of the workpiece handling system may also be designed to handle multiple workpieces, such as two side by side workpieces. Throughput is increased while allowing shared machinery to be used. Linear and rotational doors may be used for the load locks to provide a simple, compact design.
摘要翻译：具有双重加载锁的工件处理系统，运输室和处理室。工件可以从一个装载锁中取出，以在真空压力下进行处理，而工件在周围环境的压力下从另一个装载锁卸载。运输室具有两臂的运输机器人。加工的工件和新的工件可以通过两个机器人臂的简单的不足/过运动来交换。运输机器人围绕中心轴旋转以与负载锁或处理室对准。机器人也可以被升高或降低以将臂与所要求的工件的沉积位置对齐，或者从哪个工件被取回。两个加载锁定可以一个位于另一个之上，使得机器人的简单的垂直运动可以用于在两个加载锁之间进行选择。两个加载锁和运输机器人允许几乎连续的处理。可以将另外的处理室添加到传送室中以进一步提高生产量。工件处理系统的每个阶段也可以设计成处理多个工件，例如两个并排工件。吞吐量增加，同时允许使用共享机器。线性和旋转门可用于装载锁，以提供简单，紧凑的设计。

3. 发明申请

US20060039781A1 Advanced low cost high throughput processing platform 有权
标题翻译：先进的低成本高吞吐量处理平台
公开(公告)号：US20060039781A1
公开(公告)日：2006-02-23
申请号：US11097412
申请日：2005-04-01
申请人： Leszek Niewmierzycki , David Barker , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： H01L21/677
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： A wafer processing system and method in which a wafer, having a diameter, is movable between a loadlock and a processing chamber. A transfer chamber is arranged for selective pressure communication with the loadlock and the processing chamber. The transfer chamber having a configuration of lateral extents such that the wafer is movable through the transfer chamber between the loadlock and processing chamber along a wafer transfer path and the configuration of lateral extents causes the wafer, having the wafer diameter and moving along the wafer transfer path, to interfere with at least one of the loadlock and the processing chamber for any position along the wafer transfer path. The wafer includes a center and the wafer transfer path cab be defined by movement of the center through the transfer chamber. Swing arms are described that can independently move by different angles in opposing directions from a home position.
摘要翻译：一种晶片处理系统和方法，其中具有直径的晶片可在负载锁和处理室之间移动。传送室被布置成用于与装载锁和处理室的选择性压力连通。传送室具有横向范围的构造，使得晶片可沿着晶片传送路径移动通过负载锁和处理室之间的传送室，并且横向范围的配置导致具有晶片直径并沿着晶片传送移动的晶片路径，以便沿着晶片传送路径的任何位置干扰负载锁和处理室中的至少一个。晶片包括中心，并且晶片传送路径驾驶室由中心通过传送室的运动限定。描述了可以从起始位置以相反方向独立地移动不同角度的摆动臂。

4. 发明授权

US06647665B1 Door systems for low contamination, high throughput handling of workpieces for vacuum processing 有权
标题翻译：用于低污染的门系统，用于真空处理的工件的高通量处理
公开(公告)号：US06647665B1
公开(公告)日：2003-11-18
申请号：US09651453
申请日：2000-08-30
申请人： Farzad Tabrizi , Barry Kitazumi , David A. Barker , David A. Setton , Leszek Niewmierzycki , Michael J. Kuhlman
发明人： Farzad Tabrizi , Barry Kitazumi , David A. Barker , David A. Setton , Leszek Niewmierzycki , Michael J. Kuhlman
IPC分类号： E05F1124
CPC分类号： H01L21/67196 , H01L21/67126 , H01L21/67178 , H01L21/67201 , H01L21/67742 , H01L21/67745 , H01L21/67754 , H01L21/67781 , Y10S414/135 , Y10S414/139
摘要： A workpiece handling system with dual load locks, a transport chamber and a process chamber. Workpieces may be retrieved from one load lock for processing at vacuum pressure, while workpieces are unloaded from the other load lock at the pressure of the surrounding environment. The transport chamber has a transport robot with two arms. Processed workpieces and new workpieces may be exchanged by a simple under/over motion of the two robot arms. The transport robot rotates about a central shaft to align with the load locks or the process chamber. The robot may also be raised or lowered to align the arms with the desired location to which workpieces are deposited or from which workpieces are retrieved. The two load locks may be positioned one above the other such that a simple vertical motion of the robot can be used to select between the two load locks. The two load locks and transport robot allow almost continuous processing. Additional process chambers may be added to the transport chamber to further increase throughput. Each stage of the workpiece handling system may also be designed to handle multiple workpieces, such as two side by side workpieces. Throughput is increased while allowing shared machinery to be used. Linear and rotational doors may be used for the load locks to provide a simple, compact design.
摘要翻译：具有双重加载锁的工件处理系统，运输室和处理室。可以从一个装载锁中取出工件，以在真空压力下进行处理，同时工件在周围环境的压力下从另一个装载锁卸载。运输室具有两臂的运输机器人。加工的工件和新的工件可以通过两个机器人臂的简单的不足/过运动来交换。运输机器人围绕中心轴旋转以与负载锁或处理室对准。机器人也可以被升高或降低以将臂与所要求的工件的沉积位置对齐，或者从哪个工件被取回。两个加载锁定可以一个位于另一个之上，使得机器人的简单的垂直运动可以用于在两个加载锁之间进行选择。两个加载锁和运输机器人允许几乎连续的处理。可以将另外的处理室添加到传送室中以进一步提高生产量。工件处理系统的每个阶段也可以设计成处理多个工件，例如两个并排工件。吞吐量增加，同时允许使用共享机器。线性和旋转门可用于装载锁，以提供简单，紧凑的设计。

5. 发明授权

US08668422B2 Low cost high throughput processing platform 有权
标题翻译：低成本高吞吐量处理平台
公开(公告)号：US08668422B2
公开(公告)日：2014-03-11
申请号：US10919582
申请日：2004-08-17
申请人： Leszek Niewmierzycki , David Barker , Daniel J. Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Daniel J. Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： H01L21/677
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.
摘要翻译：作为用于处理工件的系统的一部分，与处理室装置分离的工件支撑装置至少大体上以堆叠关系支撑至少两个工件以形成工件柱。传送装置通过同时移动两个工件至少大致沿着分别在工件柱和第一和第二过程之间的第一和第二传送路径移动工件柱和处理室装置之间的至少两个工件车站。传送装置可以同时移动未经处理和处理的工件。描述了垂直运动摆臂和同轴摆臂。一对间隔开的摆臂，工件列和加工台可以协调地限定五边形形状。还描述了同步带齿隙消除，双自由度槽阀和低点室泵送，用于去除室污染物。

6. 发明申请

US20070175864A1 Low Cost High Throughput Processing Platform 有权
标题翻译：低成本高吞吐量处理平台
公开(公告)号：US20070175864A1
公开(公告)日：2007-08-02
申请号：US11622361
申请日：2007-01-11
申请人： Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： C03C15/00 , B44C1/22 , H01L21/306
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.
摘要翻译：作为用于处理工件的系统的一部分，与处理室装置分离的工件支撑装置至少大体上以堆叠关系支撑至少两个工件以形成工件柱。传送装置通过同时移动两个工件至少大致沿着分别在工件柱和第一和第二过程之间的第一和第二传送路径移动工件柱和处理室装置之间的至少两个工件车站。传送装置可以同时移动未经处理和处理的工件。描述了垂直运动摆臂和同轴摆臂。一对间隔开的摆臂，工件列和加工台可以协调地限定五边形形状。还描述了同步带齿隙消除，双自由度槽阀和低点室泵送，用于去除室污染物。

7. 发明授权

US07658586B2 Advanced low cost high throughput processing platform 有权
标题翻译：先进的低成本高吞吐量处理平台
公开(公告)号：US07658586B2
公开(公告)日：2010-02-09
申请号：US11097412
申请日：2005-04-01
申请人： Leszek Niewmierzycki , David Barker , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： H01L21/67
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： A wafer processing system and method in which a wafer, having a diameter, is movable between a loadlock and a processing chamber. A transfer chamber is arranged for selective pressure communication with the loadlock and the processing chamber. The transfer chamber having a configuration of lateral extents such that the wafer is movable through the transfer chamber between the loadlock and processing chamber along a wafer transfer path and the configuration of lateral extents causes the wafer, having the wafer diameter and moving along the wafer transfer path, to interfere with at least one of the loadlock and the processing chamber for any position along the wafer transfer path. The wafer includes a center and the wafer transfer path cab be defined by movement of the center through the transfer chamber. Swing arms are described that can independently move by different angles in opposing directions from a home position.
摘要翻译：一种晶片处理系统和方法，其中具有直径的晶片可在负载锁和处理室之间移动。传送室被布置成用于与装载锁和处理室的选择性压力连通。传送室具有横向范围的构造，使得晶片可沿着晶片传送路径移动通过负载锁和处理室之间的传送室，并且横向范围的配置导致具有晶片直径并沿着晶片传送移动的晶片路径，以便沿着晶片传送路径的任何位置干扰负载锁和处理室中的至少一个。晶片包括中心，并且晶片传送路径驾驶室由中心通过传送室的运动限定。描述了可以从起始位置以相反方向独立地移动不同角度的摆动臂。

8. 发明申请

US20060045664A1 Low cost high throughput processing platform 有权
公开(公告)号：US20060045664A1
公开(公告)日：2006-03-02
申请号：US10919582
申请日：2004-08-17
申请人： Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
发明人： Leszek Niewmierzycki , David Barker , Daniel Devine , Michael Kuhlman , Ryan Pakulski , Hongqing Shan , Martin Zucker
IPC分类号： H01L21/677
CPC分类号： B65G15/12 , H01L21/67742 , H01L21/67766 , H01L21/68707 , Y10S414/135 , Y10S414/139
摘要： As part of a system for processing workpieces, a workpiece support arrangement, separate from a process chamber arrangement supports at least two workpieces at least generally in a stacked relationship to form a workpiece column. A transfer arrangement transports at least two of the workpieces between the workpiece column and the process chamber arrangement by simultaneously moving the two workpieces at least generally along first and second transfer paths, respectively, that are defined between the workpiece column and the first and second process stations. The transfer arrangement can simultaneously move untreated and treated workpieces. Vertical motion swing arms and coaxial swing arms are described. A pair of spaced apart swing arms, the workpiece column and the processing stations can cooperatively define a pentagonal shape. Timing belt backlash elimination, a dual degree of freedom slot valve and low point chamber pumping, for removing chamber contaminants, are also described.

9. 发明授权

US06568552B1 Systems and methods for low contamination, high throughput handling of workpieces for vacuum processing 失效
标题翻译：用于真空处理的工件的低污染，高产量处理的系统和方法
公开(公告)号：US06568552B1
公开(公告)日：2003-05-27
申请号：US09651512
申请日：2000-08-30
申请人： Farzad Tabrizi , Barry Kitazumi , David A. Barker , David A. Setton , Leszek Niewmierzycki , Michael J. Kuhlman
发明人： Farzad Tabrizi , Barry Kitazumi , David A. Barker , David A. Setton , Leszek Niewmierzycki , Michael J. Kuhlman
IPC分类号： B65D4102
CPC分类号： H01L21/67196 , H01L21/67126 , H01L21/67178 , H01L21/67201 , H01L21/67742 , H01L21/67745 , H01L21/67754 , H01L21/67781 , Y10S414/135 , Y10S414/139
摘要： A workpiece handling system with dual load locks, a transport chamber and a process chamber. Workpieces may be retrieved from one load lock for processing at vacuum pressure, while workpieces are unloaded from the other load lock at the pressure of the surrounding environment. The transport chamber has a transport robot with two arms. Processed workpieces and new workpieces may be exchanged by a simple under/over motion of the two robot arms. The transport robot rotates about a central shaft to align with the load locks or the process chamber. The robot may also be raised or lowered to align the arms with the desired location to which workpieces are deposited or from which workpieces are retrieved. The two load locks may be positioned one above the other such that a simple vertical motion of the robot can be used to select between the two load locks. The two load locks and transport robot allow almost continuous processing. Additional process chambers may be added to the transport chamber to further increase throughput. Each stage of the workpiece handling system may also be designed to handle multiple workpieces, such as two side by side workpieces. Throughput is increased while allowing shared machinery to be used. Linear and rotational doors may be used for the load locks to provide a simple, compact design.
摘要翻译：具有双重加载锁的工件处理系统，运输室和处理室。可以从一个装载锁中取出工件，以在真空压力下进行处理，同时工件在周围环境的压力下从另一个装载锁卸载。运输室具有两臂的运输机器人。加工的工件和新的工件可以通过两个机器人臂的简单的不足/过运动来交换。运输机器人围绕中心轴旋转以与负载锁或处理室对准。机器人也可以被升高或降低以将臂与所要求的工件的沉积位置对齐，或者从哪个工件被取回。两个加载锁定可以一个位于另一个之上，使得机器人的简单的垂直运动可以用于在两个加载锁之间进行选择。两个加载锁和运输机器人允许几乎连续的处理。可以将另外的处理室添加到传送室中以进一步提高生产量。工件处理系统的每个阶段也可以设计成处理多个工件，例如两个并排工件。吞吐量增加，同时允许使用共享机器。线性和旋转门可用于装载锁，以提供简单，紧凑的设计。

10. 发明授权

US5452521A Workpiece alignment structure and method 失效
标题翻译：工件对齐结构及方法
公开(公告)号：US5452521A
公开(公告)日：1995-09-26
申请号：US209753
申请日：1994-03-09
申请人： Leszek Niewmierzycki
发明人： Leszek Niewmierzycki
IPC分类号： G01B11/27 , G03F7/20 , G03F9/00 , H01L21/68 , G01D21/00
CPC分类号： G03F7/70691 , G01B11/272 , G03F9/70 , H01L21/68 , Y10S414/136
摘要： This invention teaches an apparatus and method for detection and correction of eccentricity and angular misalignment of a wafer. The position of a wafer is determined while the wafer is stationary on a robot arm by position sensors that locate four points on the periphery of the wafer. A microprocessor selects and uses a specific combination of three of the four points to calculate the actual location of the center of the wafer. The microprocessor produces signals which are used to correct the wafer's eccentricity using two rotatable shafts, an inner shaft mounted inside an outer shaft. The outer shaft is rotated prior to arrival of the wafer, in order to position the inner shaft at a pre-determined location depending on the eccentricity to be corrected. After the wafer is placed on a turntable mounted on and rotatable by the inner shaft, the inner shaft is rotated by the requisite angle to eliminate the wafer's eccentricity in a single movement. Optionally, to correct angular misalignment of the wafer, the outer shaft is rotated by the desired angle simultaneous with the inner shaft rotation. For process shifts, both eccentricity and angular misalignment are corrected in a single movement of the wafer.
摘要翻译：本发明教导了用于检测和校正晶片偏心度和角度偏移的装置和方法。当晶片在机器人臂上静止时，通过位于晶片周边上的四个位置的位置传感器来确定晶片的位置。微处理器选择并使用四个点中的三个的特定组合来计算晶片中心的实际位置。微处理器产生用于使用两个可旋转轴校正晶片的偏心的信号，内轴安装在外轴内。外轴在晶片到达之前旋转，以便根据待校正的偏心率将内轴定位在预定位置。在将晶片放置在安装在内轴上并由内轴旋转的转台之后，内轴旋转所需的角度，以消除晶片在单次运动中的偏心度。可选地，为了校正晶片的角度偏移，外轴与内轴旋转同时旋转所需的角度。对于过程偏移，在晶片的单个运动中校正偏心度和角度偏移。

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