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1. 发明授权

US09678020B2 Apparatus and method for inspection of substrate defect 有权
公开(公告)号：US09678020B2
公开(公告)日：2017-06-13
申请号：US14795396
申请日：2015-07-09
申请人： Joon-Seo Song , Woo-seok Ko , Ji-Young Shin , Seong-Jin Yun , Yu-Sin Yang , Sang-Kil Lee , Chung-Sam Jun
发明人： Joon-Seo Song , Woo-seok Ko , Ji-Young Shin , Seong-Jin Yun , Yu-Sin Yang , Sang-Kil Lee , Chung-Sam Jun
IPC分类号： G01N21/95 , G01N21/88 , G01N21/956
CPC分类号： G01N21/9505 , G01N21/8806 , G01N21/9501 , G01N21/95692 , G01N2201/061
摘要： Example embodiments relate to an apparatus and method for inspecting a substrate defect. The substrate defect inspecting apparatus includes a substrate, a light source emitting an infrared beam to the substrate, a detector detecting the infrared beam reflected from the substrate, and a defect analyzer receiving first information and second information from the detector and analyzing defects existing in the substrate. According to at least one example embodiment, the second information is acquired during a later process than the first information.

2. 发明授权

US08034641B2 Method for inspection of defects on a substrate 有权
标题翻译：检查基板上的缺陷的方法
公开(公告)号：US08034641B2
公开(公告)日：2011-10-11
申请号：US12911190
申请日：2010-10-25
申请人： Woo-seok Ko , Chung-sam Jun , Hyung-su Son , Yu-sin Yang
发明人： Woo-seok Ko , Chung-sam Jun , Hyung-su Son , Yu-sin Yang
IPC分类号： H01L21/66
CPC分类号： G01Q60/30 , H01L22/12 , H01L22/14
摘要： A method for inspection of defects on a substrate includes positioning a probe of a scanning probe microscopy (SPM) over and spaced apart from a substrate, includes scanning the substrate by changing a relative position of the probe with respect to the substrate on a plane spaced apart from and parallel to the substrate, and includes measuring a value of an induced current generated via the probe in at least two different regions of the substrate. The value of the induced current is variable according to at least a shape and a material of the substrate. The method further includes determining whether a defect exists by comparing the values of the induced currents measured in the at least two different regions of the substrate.
摘要翻译：一种用于检查衬底上的缺陷的方法，包括将扫描探针显微镜（SPM）的探针定位在衬底之上并与衬底间隔开的步骤，包括通过在相隔的平面上改变探针相对于衬底的相对位置来扫描衬底除了并且平行于衬底，并且包括测量在衬底的至少两个不同区域中经由探针产生的感应电流的值。感应电流的值根据至少衬底的形状和材料是可变的。该方法还包括通过比较在衬底的至少两个不同区域中测量的感应电流的值来确定是否存在缺陷。

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