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    • 1. 发明授权
    • Flip-chip bonding structure and method for making the same
    • 倒装片结合结构及其制造方法
    • US06841860B2
    • 2005-01-11
    • US10244196
    • 2002-09-16
    • Joo-Hoon LeeDuk-Yong ChoiDong-Su Kim
    • Joo-Hoon LeeDuk-Yong ChoiDong-Su Kim
    • G02B6/122G02B6/42H01L21/60H01S5/02H01L23/02
    • G02B6/423G02B6/4232H01S5/02
    • Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.
    • 公开了一种用于改善光学器件相对于PLC的垂直取向的倒装芯片接合结构和用于实现该结构的倒装芯片接合方法。 倒装芯片接合结构包括:半导体衬底; 形成在所述半导体衬底的上表面上的下包层,其中所述下包覆层被压在用于安装光学器件的指定区域上; 垂直取向结构形成在下包层的凹陷区域的上表面的一部分上,并确定半导体衬底上的光学器件的垂直取向位置; 形成在下包层的凹陷区域的上表面的另一部分上的电极; 形成在电极的上表面上的焊料凸块; 以及通过使用焊料凸块的倒装芯片接合方法结合到基板的光学器件。
    • 2. 发明授权
    • Flip-chip bonding structure and method for making the same
    • 倒装片结合结构及其制造方法
    • US06799713B2
    • 2004-10-05
    • US10654111
    • 2003-09-03
    • Joo-Hoon LeeDuk-Yong ChoiDong-Su Kim
    • Joo-Hoon LeeDuk-Yong ChoiDong-Su Kim
    • B23K3102
    • G02B6/423G02B6/4232H01S5/02
    • Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.
    • 公开了一种用于改善光学器件相对于PLC的垂直取向的倒装芯片接合结构和用于实现该结构的倒装芯片接合方法。 倒装芯片接合结构包括:半导体衬底; 形成在所述半导体衬底的上表面上的下包层,其中所述下包覆层被压在用于安装光学器件的指定区域上; 垂直取向结构形成在下包层的凹陷区域的上表面的一部分上,并确定半导体衬底上的光学器件的垂直取向位置; 形成在下包层的凹陷区域的上表面的另一部分上的电极; 形成在电极的上表面上的焊料凸块; 以及通过使用焊料凸块的倒装芯片接合方法结合到基板的光学器件。
    • 10. 发明授权
    • Vehicle lamp with a shield having a double directional illumination structure
    • US06957902B2
    • 2005-10-25
    • US10739945
    • 2003-12-19
    • Dong-Su Kim
    • Dong-Su Kim
    • F21V7/00F21V11/16
    • F21V11/16F21S41/43F21S43/30F21V7/0025
    • The present invention pertains to a vehicle lamp, comprising: a lamp body in which a first illuminating direction and a second illuminating direction perpendicular to the first illuminating direction are open; an illumination lens for forming a lamp by closing the lamp body and having a first illumination surface through which the light from the light source outgoes to the first illuminating direction, and a second illumination surface through which the light from the light source outgoes to the second illuminating direction; a first reflecting surface for reflecting the light from the light source into the first illuminating direction; a shield for shielding a part of the light proceeded from the light source to the first illuminating direction; and a second reflecting surface formed on the surface facing the light source of the shield, wherein the second reflecting surface reflects and directs the light shielded by the shield into the second illuminating direction. Accordingly, it is possible to provide a vehicle lamp with a shield of a double directional illumination structure that can emit light into a lateral direction without interfering with forward illumination by means of one light source, achieving high light efficiency and maximized spatial utilization.