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1. 发明申请

US20050220437A1 Optical connection block, optical module, and optical axis alignment method using the same 失效
标题翻译：光连接块，光模块和光轴对准方法使用
公开(公告)号：US20050220437A1
公开(公告)日：2005-10-06
申请号：US10959884
申请日：2004-10-06
申请人： Dong-Su Kim , Hyo-Hun Park , Byung-Sup Rho , Han-Seo Cho , Sun-Tae Jung
发明人： Dong-Su Kim , Hyo-Hun Park , Byung-Sup Rho , Han-Seo Cho , Sun-Tae Jung
IPC分类号： G02B6/26 , G02B6/30 , G02B6/36 , G02B6/42 , G02B6/43
CPC分类号： G02B6/4214 , G02B6/30 , G02B6/3636 , G02B6/3652 , G02B6/3676 , G02B6/3692 , G02B6/421 , G02B6/43
摘要： An optical module is disclosed. The optical module includes a substrate, and at least one planar optical waveguide that includes a plurality of waveguides and at least one groove vertically penetrating the upper surface of the substrate and which is successively laminated on the substrate. The optical module also includes at least one PCB having at least one integrated photoelectric conversion device that is positioned on the planar optical waveguide facing a corresponding groove, and at least one optical connection block including a body and optical fibers embedded in the body in such a manner that both ends thereof are exposed to the lateral and upper surfaces of the body. The optical connection block is inserted into the corresponding groove of the planar optical waveguide in such a manner that both ends of the optical fibers, which have been exposed, face the waveguides and the PCBs, respectively.
摘要翻译：公开了一种光学模块。光学模块包括基板和至少一个平面光波导，其包括多个波导和至少一个垂直地穿过基板的上表面并且依次层压在基板上的凹槽。该光学模块还包括至少一个PCB，其具有位于面对相应凹槽的平面光波导上的至少一个集成光电转换装置，以及包括主体的至少一个光学连接块和嵌入在主体中的光纤使其两端暴露于身体的侧表面和上表面。将光连接块插入到平面光波导的相应凹槽中，使得已经暴露的光纤的两端分别面对波导和PCB。

2. 发明授权

US07263256B2 Optical connection block, optical module, and optical axis alignment method using the same 失效
标题翻译：光连接块，光模块和光轴对准方法使用
公开(公告)号：US07263256B2
公开(公告)日：2007-08-28
申请号：US10959884
申请日：2004-10-06
申请人： Dong-Su Kim , Hyo-Hun Park , Byung-Sup Rho , Han-Seo Cho , Sun-Tae Jung
发明人： Dong-Su Kim , Hyo-Hun Park , Byung-Sup Rho , Han-Seo Cho , Sun-Tae Jung
IPC分类号： G02B6/26 , G02B6/42
CPC分类号： G02B6/4214 , G02B6/30 , G02B6/3636 , G02B6/3652 , G02B6/3676 , G02B6/3692 , G02B6/421 , G02B6/43
摘要： An optical module is disclosed. The optical module includes a substrate, and at least one planar optical waveguide that includes a plurality of waveguides and at least one groove vertically penetrating the upper surface of the substrate and which is successively laminated on the substrate. The optical module also includes at least one PCB having at least one integrated photoelectric conversion device that is positioned on the planar optical waveguide facing a corresponding groove, and at least one optical connection block including a body and optical fibers embedded in the body in such a manner that both ends thereof are exposed to the lateral and upper surfaces of the body. The optical connection block is inserted into the corresponding groove of the planar optical waveguide in such a manner that both ends of the optical fibers, which have been exposed, face the waveguides and the PCBs, respectively.
摘要翻译：公开了一种光学模块。光学模块包括基板和至少一个平面光波导，其包括多个波导和至少一个垂直地穿过基板的上表面并且依次层压在基板上的凹槽。该光学模块还包括至少一个PCB，其具有位于面对相应凹槽的平面光波导上的至少一个集成光电转换装置，以及包括主体的至少一个光学连接块和嵌入在主体中的光纤使其两端暴露于身体的侧表面和上表面。将光连接块插入到平面光波导的相应凹槽中，使得已经暴露的光纤的两端分别面对波导和PCB。

3. 发明授权

US07239767B2 Packaging apparatus for optical interconnection on optical printed circuit board 有权
标题翻译：光学印刷电路板上光学互连的包装设备
公开(公告)号：US07239767B2
公开(公告)日：2007-07-03
申请号：US10795612
申请日：2004-03-08
申请人： Dong-Su Kim , Hyo-Hoon Park , Han-Seo Cho , Byung-Sup Rho , Sun-Tae Jung
发明人： Dong-Su Kim , Hyo-Hoon Park , Han-Seo Cho , Byung-Sup Rho , Sun-Tae Jung
IPC分类号： G02B6/12
CPC分类号： G02B6/42 , G02B6/4214 , H05K1/0274
摘要： A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.
摘要翻译：一种用于光学PCB上的光学互连的封装装置，包括：第一基板，其具有形成在其中的通孔，并且其中形成有光波导;光学互连块，其下端插入通孔的反射平面;第二基板翻转接合到第一基板的上表面，以及光学活性元件，其被翻转接合到第二基板的下表面并对准以进行光通信。

4. 发明申请

US20050100264A1 Packaging apparatus for optical interconnection on optical printed circuit board 有权
标题翻译：光学印刷电路板上光学互连的包装设备
公开(公告)号：US20050100264A1
公开(公告)日：2005-05-12
申请号：US10795612
申请日：2004-03-08
申请人： Dong-Su Kim , Hyo-Hoon Park , Han-Seo Cho , Byung-Sup Rho , Sun-Tae Jung
发明人： Dong-Su Kim , Hyo-Hoon Park , Han-Seo Cho , Byung-Sup Rho , Sun-Tae Jung
IPC分类号： G02B6/12 , G02B6/42 , H05K1/02
CPC分类号： G02B6/42 , G02B6/4214 , H05K1/0274
摘要： A packaging apparatus for optical interconnection on an optical PCB includes a first substrate with a via hole formed therethrough and in which an optical waveguide is formed, an optical interconnection block having a reflective plane on its lower end inserted into the via hole, a second substrate flip-bonded to an upper surface of the first substrate, and an optically active element flip-bonded to a lower surface of the second substrate and aligned for optical communication.
摘要翻译：一种用于光学PCB上的光学互连的封装装置，包括：第一基板，其具有形成在其中的通孔，并且其中形成有光波导;光学互连块，其下端插入通孔的反射平面;第二基板翻转接合到第一基板的上表面，以及光学活性元件，其被翻转接合到第二基板的下表面并对准以进行光通信。

5. 发明授权

US06841860B2 Flip-chip bonding structure and method for making the same 有权
标题翻译：倒装片结合结构及其制造方法
公开(公告)号：US06841860B2
公开(公告)日：2005-01-11
申请号：US10244196
申请日：2002-09-16
申请人： Joo-Hoon Lee , Duk-Yong Choi , Dong-Su Kim
发明人： Joo-Hoon Lee , Duk-Yong Choi , Dong-Su Kim
IPC分类号： G02B6/122 , G02B6/42 , H01L21/60 , H01S5/02 , H01L23/02
CPC分类号： G02B6/423 , G02B6/4232 , H01S5/02
摘要： Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.
摘要翻译：公开了一种用于改善光学器件相对于PLC的垂直取向的倒装芯片接合结构和用于实现该结构的倒装芯片接合方法。倒装芯片接合结构包括：半导体衬底; 形成在所述半导体衬底的上表面上的下包层，其中所述下包覆层被压在用于安装光学器件的指定区域上; 垂直取向结构形成在下包层的凹陷区域的上表面的一部分上，并确定半导体衬底上的光学器件的垂直取向位置; 形成在下包层的凹陷区域的上表面的另一部分上的电极; 形成在电极的上表面上的焊料凸块; 以及通过使用焊料凸块的倒装芯片接合方法结合到基板的光学器件。

6. 发明授权

US06799713B2 Flip-chip bonding structure and method for making the same 失效
标题翻译：倒装片结合结构及其制造方法
公开(公告)号：US06799713B2
公开(公告)日：2004-10-05
申请号：US10654111
申请日：2003-09-03
申请人： Joo-Hoon Lee , Duk-Yong Choi , Dong-Su Kim
发明人： Joo-Hoon Lee , Duk-Yong Choi , Dong-Su Kim
IPC分类号： B23K3102
CPC分类号： G02B6/423 , G02B6/4232 , H01S5/02
摘要： Disclosed are a flip-chip bonding structure for improving the vertical alignment of an optical device relative to a PLC and a flip-chip bonding method for achieving this structure. The flip-chip bonding structure includes: a semiconductor substrate; a lower-clad layer formed on the upper surface of the semiconductor substrate, wherein the lower-clad layer is depressed on a designated area for mounting an optical device; vertical alignment structures formed on a part of the upper surface of the depressed area of the lower-clad layer and determining a vertical alignment position of the optical device on the semiconductor substrate; electrodes formed on another part of the upper surface of the depressed area of the lower-clad layer; a solder bump formed on the upper surfaces of the electrodes; and, an optical device bonded to the substrate by a flip-chip bonding method using the solder bump.
摘要翻译：公开了一种用于改善光学器件相对于PLC的垂直取向的倒装芯片接合结构和用于实现该结构的倒装芯片接合方法。倒装芯片接合结构包括：半导体衬底; 形成在所述半导体衬底的上表面上的下包层，其中所述下包覆层被压在用于安装光学器件的指定区域上; 垂直取向结构形成在下包层的凹陷区域的上表面的一部分上，并确定半导体衬底上的光学器件的垂直取向位置; 形成在下包层的凹陷区域的上表面的另一部分上的电极; 形成在电极的上表面上的焊料凸块; 以及通过使用焊料凸块的倒装芯片接合方法结合到基板的光学器件。

7. 发明授权

US08703345B2 Electrolyte including amide compound and electrochemical device including the same 有权
标题翻译：电解质包括酰胺化合物和包括其的电化学装置
公开(公告)号：US08703345B2
公开(公告)日：2014-04-22
申请号：US13243178
申请日：2011-09-23
申请人： Byoung-Bae Lee , Jae-Seung Oh , Sang-Hyun Lee , Kwon-Young Choi , Dong-Su Kim , Yeon-Suk Hong , Hyo-Jin Lee
发明人： Byoung-Bae Lee , Jae-Seung Oh , Sang-Hyun Lee , Kwon-Young Choi , Dong-Su Kim , Yeon-Suk Hong , Hyo-Jin Lee
IPC分类号： H01M6/16
CPC分类号： C07C271/00 , C07C275/00 , H01G11/06 , H01G11/56 , H01M10/052 , H01M10/0565 , H01M10/0569 , H01M2300/0034 , H01M2300/0037 , H01M2300/004 , H01M2300/0082 , H01M2300/0085 , Y02E60/13
摘要： Disclosed is an electrolyte. The electrolyte includes an amide compound and an ionizable lithium salt. The amide compound has a specific structure in which an amine group is substituted with at least one alkoxyalkyl group and at least one halogen atom is present. The electrolyte has good thermal and chemical stability, a low resistance and a high ionic conductivity. In addition, the electrolyte has a high upper limit of electrochemical window due to its improved oxidation stability. Therefore, the electrolyte can be useful for the fabrication of an electrochemical device. Further disclosed is an electrochemical device including the electrolyte.
摘要翻译：公开了电解质。电解质包括酰胺化合物和可电离的锂盐。酰胺化合物具有其中胺基被至少一个烷氧基烷基取代并且存在至少一个卤素原子的特定结构。电解质具有良好的热和化学稳定性，低电阻和高离子电导率。此外，由于其改善的氧化稳定性，电解质具有高的电化学窗口上限。因此，电解质可用于制造电化学装置。还公开了包括电解质的电化学装置。

8. 发明授权

US08481215B2 Electrolyte having eutectic mixture and electrochemical device containing the same 有权
标题翻译：具有共晶混合物的电解质和含有该共晶混合物的电化学装置
公开(公告)号：US08481215B2
公开(公告)日：2013-07-09
申请号：US13055520
申请日：2009-07-24
申请人： Byoung-Bae Lee , Jae-Seung Oh , Ji-Won Park , Dong-Su Kim , Hyo-Jin Lee , Yeon-Suk Hong
发明人： Byoung-Bae Lee , Jae-Seung Oh , Ji-Won Park , Dong-Su Kim , Hyo-Jin Lee , Yeon-Suk Hong
IPC分类号： H01M6/14
CPC分类号： H01M10/0566 , C07F1/005 , H01G11/56 , H01M10/052 , Y02E60/13
摘要： An electrolyte includes (a) a eutectic mixture of an alkoxy alkyl group-containing amide compound and an ionizable lithium salt; and (b) a carbonate-based compound. The electrolyte has excellent thermal and chemical stability and exhibits a low lowest limit of electrochemical window. Also, the electrolyte shows low viscosity and high ion conductivity, so it may be usefully applied as an electrolyte of electrochemical devices using various anode materials.
摘要翻译：电解质包括（a）含烷氧基烷基的酰胺化合物和可电离的锂盐的共晶混合物; 和（b）碳酸酯类化合物。电解质具有优异的热稳定性和化学稳定性，电化学窗口的最低限度为低。此外，电解质显示出低粘度和高离子传导性，因此可以有用地用作使用各种阳极材料的电化学装置的电解质。

9. 发明申请

US20120034533A1 NON-AQUEOUS ELECTROLYTE SOLUTION FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY INCLUDING THE SAME 有权
标题翻译：用于锂二次电池的非水电解质溶液和包括其的锂二次电池
公开(公告)号：US20120034533A1
公开(公告)日：2012-02-09
申请号：US13260485
申请日：2010-07-09
申请人： Yeon-Suk Hong , Jae-Seung Oh , Ji-Won Park , Byoung-Bae Lee , Dong-Su Kim , Hyo-Jin Lee
发明人： Yeon-Suk Hong , Jae-Seung Oh , Ji-Won Park , Byoung-Bae Lee , Dong-Su Kim , Hyo-Jin Lee
IPC分类号： H01M10/056
CPC分类号： H01M10/052 , H01M4/52 , H01M4/525 , H01M10/0567 , H01M10/0568 , H01M10/0569 , Y02E60/122
摘要： Disclosed is a non-aqueous electrolyte solution for a lithium secondary battery. The non-aqueous electrolyte solution includes a lithium salt, an organic solvent and additives. The additives include: 1 to 10% by weight of a mixture of a particular halogenated cyclic carbonate and a compound containing a vinylene or vinyl group; and 0.1 to 9% by weight of a nitrile compound having a C2-C12 alkoxyalkyl group. A lithium secondary battery including the non-aqueous electrolyte solution is also disclosed. The lithium secondary battery is protected from catching fire when overcharged and is prevented from swelling during storage at high temperature.
摘要翻译：公开了一种用于锂二次电池的非水电解质溶液。非水电解质溶液包括锂盐，有机溶剂和添加剂。添加剂包括：1至10重量％的特定卤代环状碳酸酯和含有亚乙烯基或乙烯基的化合物的混合物; 和0.1〜9重量％的具有C2-C12烷氧基烷基的腈化合物。还公开了包含非水电解质溶液的锂二次电池。锂二次电池在过充电时可防止火灾，并在高温储存期间防止其膨胀。

10. 发明申请

US20110318647A1 ELECTROLYTE COMPRISING AMIDE COMPOUND AND ELECTROCHEMICAL DEVICE CONTAINING THE SAME 有权
标题翻译：包含酰胺化合物的电解质和包含该化合物的电化学装置
公开(公告)号：US20110318647A1
公开(公告)日：2011-12-29
申请号：US13224603
申请日：2011-09-02
申请人： Byoung-Bae Lee , Jae-Seung Oh , Ji-Won Park , Hyo-Jin Lee , Dong-Su Kim , Yeon-Suk Hong
发明人： Byoung-Bae Lee , Jae-Seung Oh , Ji-Won Park , Hyo-Jin Lee , Dong-Su Kim , Yeon-Suk Hong
IPC分类号： H01M10/056 , H01M10/00
CPC分类号： H01M10/0569 , H01G9/035 , H01G9/038 , H01G11/58 , H01M10/0525 , H01M10/0564 , H01M10/0565 , H01M10/0567 , H01M10/4235 , H01M2300/0025 , H01M2300/0028 , H01M2300/0082 , Y02E60/122 , Y02E60/13
摘要： Provided are an electrolyte comprising an amide compound of a specific structure, in which an alkoxy group is substituted with an amine group, and an ionizable lithium salt, and an electrochemical device containing the same. The electrolyte may have excellent thermal and chemical stability and a wide electrochemical window. Also, the electrolyte may have a sufficiently low viscosity and a high ionic conductivity, and thus, may be usefully applied as an electrolyte of electrochemical devices using various anode materials.
摘要翻译：提供一种电解质，其包含其中烷氧基被胺基取代的特定结构的酰胺化合物和可离子化的锂盐，以及含有该酰胺化合物的电化学装置。电解质可能具有优异的热和化学稳定性和广泛的电化学窗口。此外，电解质可以具有足够低的粘度和高的离子导电性，因此可以有用地用作使用各种阳极材料的电化学装置的电解质。

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