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1. 发明授权

US07537952B2 Method of manufacturing MEMS device package 有权
标题翻译：制造MEMS器件封装的方法
公开(公告)号：US07537952B2
公开(公告)日：2009-05-26
申请号：US11802231
申请日：2007-05-21
申请人： Jong-seok Kim , Yun-kwon Park , In-sang Song , Duck-hwan Kim , Kuang-woo Nam , Seok-chul Yun
发明人： Jong-seok Kim , Yun-kwon Park , In-sang Song , Duck-hwan Kim , Kuang-woo Nam , Seok-chul Yun
IPC分类号： H01L21/00
CPC分类号： B81B7/007
摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device and electrically connected to the MEMS active device; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are electrically connected to the internal electrode pads through the via holes. The internal electrode pads and the sealing pads are formed from an identical material such as Au and thus the device substrate and the closure substrate are bonded to each other with direct bonding such as Au—Au direct bonding via the sealing pads.
摘要翻译：提供了微机电系统（MEMS）装置封装及其制造方法。 MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧并电连接到MEMS有源器件; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 以及形成在封闭基板的顶表面上的外部电极焊盘，使得外部电极焊盘通过通孔电连接到内部电极焊盘。内部电极焊盘和密封焊盘由相同的材料例如Au形成，因此器件基板和封闭基板通过诸如通过密封焊盘的Au-Au直接接合的直接接合彼此接合。

2. 发明申请

US20070012654A1 MEMS switch and method for manufacturing the same 失效
标题翻译： MEMS开关及其制造方法
公开(公告)号：US20070012654A1
公开(公告)日：2007-01-18
申请号：US11472312
申请日：2006-06-22
申请人： Jong-seok Kim , In-sang Song , Sang-hun Lee , Sang-wook Kwon , Duck-hwan Kim , Yun-kwon Park , Hee-moon Jeong , Young-tack Hong , Che-heung Kim , Seok-chul Yun , Kuang-woo Nam
发明人： Jong-seok Kim , In-sang Song , Sang-hun Lee , Sang-wook Kwon , Duck-hwan Kim , Yun-kwon Park , Hee-moon Jeong , Young-tack Hong , Che-heung Kim , Seok-chul Yun , Kuang-woo Nam
IPC分类号： C23F1/00 , H01B13/00
CPC分类号： H01H61/02 , H01H61/063 , H01H2061/006
摘要： A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the lower substrate by a distance, and having a membrane layer on a lower surface of the upper substrate; a bimetal layer formed in the cavity of the upper substrate on the membrane layer; a heating layer formed on a lower surface of the membrane layer; and a contact member formed on a lower surface of the heating layer. The contact member can come into contact with or separate from the signal line. A method for manufacturing the MEMS switch includes preparing the upper and lower substrates and combining them so that a surface having the signal line faces a surface having the contact member and the upper and lower substrates are disposed apart by a distance.
摘要翻译： MEMS开关包括在下基板的上表面上具有信号线的下基板; 在其上具有空腔的上基板，与下基板的上表面隔开一段距离，并且在上基板的下表面上具有膜层; 形成在膜层上的上基板的空腔中的双金属层; 形成在所述膜层的下表面上的加热层; 以及形成在所述加热层的下表面上的接触构件。接触构件可以与信号线接触或分离。制造MEMS开关的方法包括制备上基板和下基板并将其组合，使得具有信号线的表面面向具有接触构件的表面，并且上下基板分开一定距离。

3. 发明授权

US07535322B2 Monolithic RF filter 有权
标题翻译：单片RF滤波器
公开(公告)号：US07535322B2
公开(公告)日：2009-05-19
申请号：US11269844
申请日：2005-11-09
申请人： Yun-kwon Park , Duck-hwan Kim , Kuang-woo Nam , In-sang Song , Seok-chul Yun , Byeoung-ju Ha , Jong-seok Kim
发明人： Yun-kwon Park , Duck-hwan Kim , Kuang-woo Nam , In-sang Song , Seok-chul Yun , Byeoung-ju Ha , Jong-seok Kim
IPC分类号： H03H9/54 , H03H9/56
CPC分类号： H03H9/0542 , H03H9/542 , H03H9/564 , H03H9/566
摘要： A filter formed of film bulk acoustic resonators has a topology that enables a trimming inductor to be fabricated on the same substrate as the resonator arrays. The entire filter can be fabricated on a single chip, utilizing only integrated circuit processes. In an exemplary embodiment, a pair of shunt resonators each have one electrode connected to series-connected resonators. The other electrodes of the two shunt resonators are connected in common to one another. The trimming inductor is connected between the common electrode and ground potential. A third shunt resonator is connected between the series-connected resonators and ground potential.
摘要翻译：由膜体声波谐振器形成的滤波器具有能够将调谐电感器制造在与谐振器阵列相同的衬底上的拓扑结构。整个滤波器可以在单个芯片上制造，仅利用集成电路工艺。在示例性实施例中，一对并联谐振器各自具有连接到串联谐振器的一个电极。两个并联谐振器的其他电极彼此共同连接。微调电感连接在公共电极和地电位之间。第三并联谐振器连接在串联谐振器和地电位之间。

4. 发明授权

US07619289B2 MEMS switch and method for manufacturing the same 失效
标题翻译： MEMS开关及其制造方法
公开(公告)号：US07619289B2
公开(公告)日：2009-11-17
申请号：US11472312
申请日：2006-06-22
申请人： Jong-seok Kim , In-sang Song , Sang-hun Lee , Sang-wook Kwon , Duck-hwan Kim , Yun-kwon Park , Hee-moon Jeong , Young-tack Hong , Che-heung Kim , Seok-chul Yun , Kuang-woo Nam
发明人： Jong-seok Kim , In-sang Song , Sang-hun Lee , Sang-wook Kwon , Duck-hwan Kim , Yun-kwon Park , Hee-moon Jeong , Young-tack Hong , Che-heung Kim , Seok-chul Yun , Kuang-woo Nam
IPC分类号： H01L29/78
CPC分类号： H01H61/02 , H01H61/063 , H01H2061/006
摘要： A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the lower substrate by a distance, and having a membrane layer on a lower surface of the upper substrate; a bimetal layer formed in the cavity of the upper substrate on the membrane layer; a heating layer formed on a lower surface of the membrane layer; and a contact member formed on a lower surface of the heating layer. The contact member can come into contact with or separate from the signal line. A method for manufacturing the MEMS switch includes preparing the upper and lower substrates and combining them so that a surface having the signal line faces a surface having the contact member and the upper and lower substrates are disposed apart by a distance.
摘要翻译： MEMS开关包括在下基板的上表面上具有信号线的下基板; 在其上具有空腔的上基板，与下基板的上表面隔开一段距离，并且在上基板的下表面上具有膜层; 形成在膜层上的上基板的空腔中的双金属层; 形成在所述膜层的下表面上的加热层; 以及形成在所述加热层的下表面上的接触构件。接触构件可以与信号线接触或分离。制造MEMS开关的方法包括制备上基板和下基板并将其组合，使得具有信号线的表面面向具有接触构件的表面，并且上下基板分开一定距离。

5. 发明授权

US07439825B2 Integrated filter including FBAR and saw resonator and fabrication method therefor 有权
标题翻译：集成滤波器，包括FBAR和锯片谐振器及其制造方法
公开(公告)号：US07439825B2
公开(公告)日：2008-10-21
申请号：US11448707
申请日：2006-06-08
申请人： Kuang-woo Nam , Kook-hyun Sunwoo , In-sang Song , Sang-wook Kwon , Duck-hwan Kim , Chul-soo Kim , Sang-chul Sul , Yun-kwon Park , Hae-seok Park , Jea-shik Shin , Dong-ha Shim , Young-tack Hong , Jong-seok Kim , Seok-mo Chang , Seok-chul Yun
发明人： Kuang-woo Nam , Kook-hyun Sunwoo , In-sang Song , Sang-wook Kwon , Duck-hwan Kim , Chul-soo Kim , Sang-chul Sul , Yun-kwon Park , Hae-seok Park , Jea-shik Shin , Dong-ha Shim , Young-tack Hong , Jong-seok Kim , Seok-mo Chang , Seok-chul Yun
IPC分类号： H03H9/56 , H03H9/54
CPC分类号： H03H9/588 , H03H3/02 , H03H9/02228 , H03H2003/0071
摘要： An integrated filter including a film bulk acoustic resonator (FBAR) and a surface acoustic wave (SAW) resonator and a method of fabricating the integrated filter. The integrated filter includes: a substrate; a first electrode positioned in a predetermined first area on an upper surface of the substrate; a first piezoelectric layer positioned on the first electrode; a second electrode positioned on the first piezoelectric layer; a second piezoelectric layer positioned in a predetermined second area on the upper surface of the substrate; and at least one inter-digital transducer (IDT) electrode positioned on the second piezoelectric layer. The IDT electrode includes: a first IDT electrode formed in a comb structure on the second piezoelectric layer; and a second IDT electrode formed in a comb structure on the second piezoelectric layer so as to mesh with the first IDT electrode. The first and second piezoelectric layers are formed of an identical material. Thus, an integrated filter which operates in various frequency bands can be made compact.
摘要翻译：一种包括膜体声波谐振器（FBAR）和表面声波（SAW）谐振器的集成滤波器以及一体化滤波器的制造方法。集成滤波器包括：基板; 位于所述基板的上表面上的预定第一区域中的第一电极; 位于所述第一电极上的第一压电层; 位于所述第一压电层上的第二电极; 位于所述基板的上表面上的预定的第二区域中的第二压电层; 和位于第二压电层上的至少一个数字间换能器（IDT）电极。 IDT电极包括：在第二压电层上形成为梳状结构的第一IDT电极; 以及在第二压电层上形成为梳状结构的第二IDT电极，以便与第一IDT电极啮合。第一和第二压电层由相同的材料形成。因此，可以使在各种频带中工作的集成滤波器紧凑。

6. 发明授权

US07719742B2 MEMS device package and method of manufacturing the same 有权
标题翻译： MEMS器件封装及其制造方法
公开(公告)号：US07719742B2
公开(公告)日：2010-05-18
申请号：US11368626
申请日：2006-03-07
申请人： Jong-seok Kim , Duck-hwan Kim , Kuang-woo Nam , Yun-kwon Park , Seok-chul Yun , Sung-hoon Choa , In-sang Song
发明人： Jong-seok Kim , Duck-hwan Kim , Kuang-woo Nam , Yun-kwon Park , Seok-chul Yun , Sung-hoon Choa , In-sang Song
IPC分类号： G02B26/00 , G02B26/08
CPC分类号： B81B7/0051 , B81B7/007
摘要： A MEMS device package and a method of manufacturing the same. The MEMS device package includes a device substrate having a surface on which a MEMS active device is formed, and multiple sealing pads arranged around the MEMS active device so that the sealing pads provide electric paths for the MEMS active device. In addition, the MEMS device package may include a cap substrate bonded to the device substrate through the multiple sealing pads, the cap substrate including a trench, within which the MEMS active device is positioned, and via holes. One or more outer electrode pads may be formed on one surface of the cap substrate to be electrically connected with the multiple sealing pads through the via holes. Because there are several bonding and sealing areas between the device substrate and the cap substrate, the sealing intensity is strengthened.
摘要翻译：一种MEMS器件封装及其制造方法。 MEMS器件封装包括具有其上形成有MEMS器件的表面的器件衬底以及围绕MEMS有源器件布置的多个密封焊盘，使得密封垫为MEMS有源器件提供电路径。此外，MEMS器件封装可以包括通过多个密封焊盘结合到器件衬底的帽衬底，帽衬底包括其中定位MEMS有源器件的沟槽和通孔。可以在盖基板的一个表面上形成一个或多个外电极焊盘，以通过通孔与多个密封垫电连接。由于在器件基板和盖基板之间存在多个接合和密封区域，所以密封强度得以加强。

7. 发明申请

US20070224719A1 Method of manufacturing MEMS device package 有权
标题翻译：制造MEMS器件封装的方法
公开(公告)号：US20070224719A1
公开(公告)日：2007-09-27
申请号：US11802231
申请日：2007-05-21
申请人： Jong-seok Kim , Yun-kwon Park , In-sang Song , Duck-hwan Kim , Kuang-woo Nam , Seok-chul Yun
发明人： Jong-seok Kim , Yun-kwon Park , In-sang Song , Duck-hwan Kim , Kuang-woo Nam , Seok-chul Yun
IPC分类号： H01L21/00
CPC分类号： B81B7/007
摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device and electrically connected to the MEMS active device; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are electrically connected to the internal electrode pads through the via holes. The internal electrode pads and the sealing pads are formed from an identical material such as Au and thus the device substrate and the closure substrate are bonded to each other with direct bonding such as Au—Au direct bonding via the sealing pads.
摘要翻译：提供了微机电系统（MEMS）装置封装及其制造方法。 MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧并电连接到MEMS有源器件; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 以及形成在封闭基板的顶表面上的外部电极焊盘，使得外部电极焊盘通过通孔电连接到内部电极焊盘。内部电极焊盘和密封焊盘由相同的材料例如Au形成，因此器件基板和封闭基板通过诸如通过密封焊盘的Au-Au直接接合的直接接合彼此接合。

8. 发明申请

US20060244552A1 Monolithic RF filter 有权
公开(公告)号：US20060244552A1
公开(公告)日：2006-11-02
申请号：US11269844
申请日：2005-11-09
申请人： Yun-kwon Park , Duck-hwan Kim , Kuang-woo Nam , In-sang Song , Seok-chul Yun , Byeoung-ju Ha , Jong-seok Kim
发明人： Yun-kwon Park , Duck-hwan Kim , Kuang-woo Nam , In-sang Song , Seok-chul Yun , Byeoung-ju Ha , Jong-seok Kim
IPC分类号： H03H9/58
CPC分类号： H03H9/0542 , H03H9/542 , H03H9/564 , H03H9/566
摘要： A filter formed of film bulk acoustic resonators has a topology that enables a trimming inductor to be fabricated on the same substrate as the resonator arrays. The entire filter can be fabricated on a single chip, utilizing only integrated circuit processes. In an exemplary embodiment, a pair of shunt resonators each have one electrode connected to series-connected resonators. The other electrodes of the two shunt resonators are connected in common to one another. The trimming inductor is connected between the common electrode and ground potential. A third shunt resonator is connected between the series-connected resonators and ground potential.

9. 发明申请

US20060199297A1 MEMS device package and method of manufacturing the same 有权
标题翻译： MEMS器件封装及其制造方法
公开(公告)号：US20060199297A1
公开(公告)日：2006-09-07
申请号：US11368626
申请日：2006-03-07
申请人： Jong-seok Kim , Duck-hwan Kim , Kuang-woo Nam , Yun-kwon Park , Seok-chul Yun , Sung-hoon Choa , In-sang Song
发明人： Jong-seok Kim , Duck-hwan Kim , Kuang-woo Nam , Yun-kwon Park , Seok-chul Yun , Sung-hoon Choa , In-sang Song
IPC分类号： H01L21/00
CPC分类号： B81B7/0051 , B81B7/007
摘要： A MEMS device package and a method of manufacturing the same. The MEMS device package includes a device substrate having a surface on which a MEMS active device is formed, and multiple sealing pads arranged around the MEMS active device so that the sealing pads provide electric paths for the MEMS active device. In addition, the MEMS device package may include a cap substrate bonded to the device substrate through the multiple sealing pads, the cap substrate including a trench, within which the MEMS active device is positioned, and via holes. One or more outer electrode pads may be formed on one surface of the cap substrate to be electrically connected with the multiple sealing pads through the via holes. Because there are several bonding and sealing areas between the device substrate and the cap substrate, the sealing intensity is strengthened.
摘要翻译：一种MEMS器件封装及其制造方法。 MEMS器件封装包括具有其上形成有MEMS器件的表面的器件衬底以及围绕MEMS有源器件布置的多个密封焊盘，使得密封垫为MEMS有源器件提供电路径。此外，MEMS器件封装可以包括通过多个密封焊盘结合到器件衬底的帽衬底，帽衬底包括其中定位MEMS有源器件的沟槽和通孔。可以在盖基板的一个表面上形成一个或多个外电极焊盘，以通过通孔与多个密封垫电连接。由于在器件基板和盖基板之间存在多个接合和密封区域，所以密封强度得以加强。

10. 发明申请

US20060141652A1 MEMS device package and method for manufacturing the same 审中-公开
标题翻译： MEMS器件封装及其制造方法
公开(公告)号：US20060141652A1
公开(公告)日：2006-06-29
申请号：US11260090
申请日：2005-10-28
申请人： Jong-seok Kim , Yun-kwon Park , In-sang Song , Duck-hwan Kim , Kuang-woo Nam , Seok-chul Yun
发明人： Jong-seok Kim , Yun-kwon Park , In-sang Song , Duck-hwan Kim , Kuang-woo Nam , Seok-chul Yun
IPC分类号： H01L21/00
CPC分类号： B81B7/007
摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device and electrically connected to the MEMS active device; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are electrically connected to the internal electrode pads through the via holes. The internal electrode pads and the sealing pads are formed from an identical material such as Au and thus the device substrate and the closure substrate are bonded to each other with direct bonding such as Au—Au direct bonding via the sealing pads.
摘要翻译：提供了微机电系统（MEMS）装置封装及其制造方法。 MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧并电连接到MEMS有源器件; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 以及形成在封闭基板的顶表面上的外部电极焊盘，使得外部电极焊盘通过通孔电连接到内部电极焊盘。内部电极焊盘和密封焊盘由相同的材料例如Au形成，因此器件基板和封闭基板通过诸如通过密封焊盘的Au-Au直接接合的直接接合彼此接合。

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