专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120049788A1 CHARGE MODULE 审中-公开
标题翻译：充电模块
公开(公告)号：US20120049788A1
公开(公告)日：2012-03-01
申请号：US13018806
申请日：2011-02-01
申请人： Jong Man KIM , Seog Moon CHOI , Kyu Bum HAN
发明人： Jong Man KIM , Seog Moon CHOI , Kyu Bum HAN
IPC分类号： H02J7/00
CPC分类号： H05K7/20918
摘要： Disclosed herein is a charge module for charging a high-capacity battery.The charge module according to the exemplary embodiment of the present invention includes: a heat sink; a fan cover covering the top of the heat sink; a fan mounted on the upper center of the fan cover; and a heat pipe inserted into the side wall of the heat sink to dissipate heat from the side wall of the heat sink through the circulation of refrigerants.
摘要翻译：这里公开了一种用于对高容量电池进行充电的充电模块。根据本发明的示例性实施例的充电模块包括：散热器; 覆盖散热器顶部的风扇盖; 风扇安装在风扇罩的上部中心; 以及插入散热器的侧壁中的热管，以通过制冷剂的循环从散热器的侧壁散发热量。

2. 发明申请

US20120127681A1 SOLDERING CONNECTING PIN, SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MOUNTING SEMICONDUCTOR CHIP USING THE SAME 审中-公开
标题翻译：焊接连接引线，半导体封装基板及使用其安装半导体芯片的方法
公开(公告)号：US20120127681A1
公开(公告)日：2012-05-24
申请号：US13010709
申请日：2011-01-20
申请人： Ji Man RYU , Kwan Ho LEE , Kyu Bum HAN , Seog Moon CHOI , Jin Su KIM
发明人： Ji Man RYU , Kwan Ho LEE , Kyu Bum HAN , Seog Moon CHOI , Jin Su KIM
IPC分类号： H01R9/00 , H05K3/00 , H01B5/00
CPC分类号： H05K3/306 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/13017 , H01L2224/1601 , H01L2224/16057 , H01L2224/16058 , H01L2224/16059 , H01L2224/1607 , H01L2224/16235 , H01L2224/16501 , H01L2224/811 , H01L2224/81193 , H01L2224/81385 , H01L2224/81447 , H01L2224/81815 , H01L2224/81899 , H01L2224/81906 , H01L2224/8192 , H01L2224/81951 , H01L2224/81986 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01082 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/351 , H05K3/3447 , H05K2201/10166 , H05K2201/10401 , Y10T29/49155 , H01L2924/00014 , H01L2924/00
摘要： Disclosed herein are a soldering connecting pin, a semiconductor package substrate and a method of mounting a semiconductor chip using the same. A semiconductor chip is mounted on the printed circuit board using the soldering connecting pin inserted into a through-hole of the printed circuit board, thereby preventing deformation of the semiconductor package substrate and fatigue failure due to external shocks.
摘要翻译：这里公开了一种焊接连接引脚，半导体封装基板和使用该半导体封装基板的半导体芯片的安装方法。使用插入印刷电路板的通孔中的焊接连接销将半导体芯片安装在印刷电路板上，从而防止半导体封装基板的变形和由于外部冲击引起的疲劳失效。

3. 发明申请

US20120121361A1 LOOSE PREVENTING ASSEMBLY 审中-公开
标题翻译：松动防止装配
公开(公告)号：US20120121361A1
公开(公告)日：2012-05-17
申请号：US13091058
申请日：2011-04-20
申请人： Kwan Ho LEE , Kyu Bum HAN , Young Ho SOHN , Seog Moon CHOI
发明人： Kwan Ho LEE , Kyu Bum HAN , Young Ho SOHN , Seog Moon CHOI
IPC分类号： F16B39/04
CPC分类号： F16B39/06 , F16B39/282
摘要： Disclosed herein is a loose preventing assembly including a bolt, a fastening member, and a pin-spring washer coupled between the bolt and the fastening member. The pin-spring washer includes a spring washer portion, a curved portion of which one end is connected to the spring washer portion to be curved upward and the other end is positioned in an inward direction of the spring washer portion, and a pin portion which extends in one direction from the other end of the curved portion tightens the bolt to couple the pin portion to an insertion groove formed in the bolt, thereby preventing the bolt and the fastening member from being loosened from each other.
摘要翻译：本文公开了一种松散防止组件，其包括螺栓，紧固构件和联接在螺栓和紧固构件之间的销弹簧垫圈。销弹簧垫圈包括弹簧垫圈部分，弯曲部分的一端连接到弹簧垫圈部分以向上弯曲，另一端位于弹簧垫圈部分的向内方向上，销部分从弯曲部分的另一端沿一个方向延伸，将螺栓拧紧以将销部分联接到形成在螺栓中的插入槽，从而防止螺栓和紧固构件彼此松动。

4. 发明申请

US20120049993A1 TRANSFORMER INTEGRATED WITH INDUCTOR 审中-公开
标题翻译：变压器与电感器集成
公开(公告)号：US20120049993A1
公开(公告)日：2012-03-01
申请号：US13219800
申请日：2011-08-29
申请人： Kyu Bum HAN , Seog Moon CHOI , Young Ho SON
发明人： Kyu Bum HAN , Seog Moon CHOI , Young Ho SON
IPC分类号： H01F27/28
CPC分类号： H01F27/38
摘要： Disclosed herein is a transformer integrated with an inductor. The transformer includes a transformer unit configured to perform voltage transformation by mutual induction between first and second cores connected opposite to each other and primary and secondary coils included in a space between the first core and the second core; and an inductor unit having a third core connected to the second core and an inductor included in a space between the second core and the third core. The transformer is fabricated by physically integrating two elements having different functions into one element, thereby simplifying the configuration of a system.
摘要翻译：本文公开了与电感器集成的变压器。变压器包括变压器单元，其被配置为通过在彼此相对连接的第一和第二芯之间的相互感应和包括在第一芯和第二芯之间的空间中的初级和次级线圈进行电压变换; 以及电感器单元，其具有连接到第二芯的第三芯和包括在第二芯和第三芯之间的空间中的电感器。通过将具有不同功能的两个元件物理地集成到一个元件中来制造变压器，从而简化了系统的配置。

5. 发明申请

US20130037967A1 SEMICONDUCTOR PACKAGE SUBSTRATE 有权
标题翻译：半导体封装基板
公开(公告)号：US20130037967A1
公开(公告)日：2013-02-14
申请号：US13308441
申请日：2011-11-30
申请人： Jong Man KIM , Young Hoon KWAK , Kyu Hwan OH , Seog Moon CHOI , Tae Hoon KIM
发明人： Jong Man KIM , Young Hoon KWAK , Kyu Hwan OH , Seog Moon CHOI , Tae Hoon KIM
IPC分类号： H01L23/488
CPC分类号： H01L23/36 , H01L21/563 , H01L23/562 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/26145 , H01L2224/26175 , H01L2224/29076 , H01L2224/291 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/83385 , H01L2224/834 , H01L2224/83411 , H01L2224/83418 , H01L2224/83447 , H01L2224/83455 , H01L2224/83464 , H01L2224/83466 , H01L2224/83471 , H01L2224/8348 , H01L2224/83484 , H01L2924/15787 , H01L2924/00014 , H01L2924/01014 , H01L2924/014 , H01L2924/0665 , H01L2924/00
摘要： Disclosed herein is a semiconductor package substrate including a base substrate, a mounting member mounted on an upper portion of the base substrate, and an adhesive layer formed between the base substrate and the mounting member, wherein the adhesive layer includes a thermally conductive adhesive and a ductile adhesive formed at the outer circumference of the thermally conductive adhesive.
摘要翻译：本发明公开了一种半导体封装基板，其包括基底基板，安装在基底基板的上部的安装部件和形成在基底基板与安装部件之间的粘合层，其中粘合层包括导热粘合剂和在导热粘合剂的外周形成的韧性粘合剂。

6. 发明申请

US20120073863A1 ANODIZED HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME 审中-公开
标题翻译：阳极加热基板及其制造方法
公开(公告)号：US20120073863A1
公开(公告)日：2012-03-29
申请号：US13007464
申请日：2011-01-14
申请人： Jung Eun KANG , Kwang Soo KIM , Seog Moon CHOI , Sung Keun PARK , Chang Hyun LIM
发明人： Jung Eun KANG , Kwang Soo KIM , Seog Moon CHOI , Sung Keun PARK , Chang Hyun LIM
IPC分类号： H05K1/00 , H05K3/44
CPC分类号： H05K1/053 , H05K3/445 , Y10T29/49147
摘要： Disclosed herein is an anodized heat-radiating substrate. The anodized heat-radiating substrate is advantageous in that it has good radiation characteristics because an anodized oxide layer is formed on the entire surface of a metal layer. And, the anodized heat-radiating substrate is advantageous in that it has high-density/high accumulation characteristics because it forms multi-layered structure by using the connecting member.
摘要翻译：本文公开了一种阳极氧化散热基板。阳极氧化的散热基板的优点在于它具有良好的辐射特性，因为在金属层的整个表面上形成阳极氧化的氧化物层。并且，阳极氧化散热基板的优点在于它具有高密度/高的积聚特性，因为它通过使用连接件形成多层结构。

7. 发明申请

US20110312109A1 LIGHT EMITTING DIODE PACKAGE HAVING ANODIZED INSULATION LAYER AND FABRICATION METHOD THEREFOR 有权
标题翻译：具有阳离子绝缘层的发光二极管封装及其制造方法
公开(公告)号：US20110312109A1
公开(公告)日：2011-12-22
申请号：US13220258
申请日：2011-08-29
申请人： Young Ki LEE , Seog Moon CHOI , Sang Hyun SHIN
发明人： Young Ki LEE , Seog Moon CHOI , Sang Hyun SHIN
IPC分类号： H01L33/48
CPC分类号： H01L33/483 , H01L25/0753 , H01L33/58 , H01L33/62 , H01L33/641 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2924/00014 , H01L2924/00
摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.
摘要翻译：一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

8. 发明申请

US20110075374A1 RIGID-FLEXIBLE CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 失效
标题翻译：刚性柔性电路板及其制造方法
公开(公告)号：US20110075374A1
公开(公告)日：2011-03-31
申请号：US12618726
申请日：2009-11-14
申请人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
发明人： Jung Eun KANG , Seog Moon CHOI , Tae Hoon KIM , Young Ki LEE , Hye Sook SHIN , Chang Hyun LIM
IPC分类号： H05K7/20 , H05K1/00 , H05K3/10
CPC分类号： H05K3/4641 , H05K1/0203 , H05K1/053 , H05K1/189 , H05K3/462 , H05K3/4691 , H05K2203/0315 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165
摘要： Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.
摘要翻译：公开了一种刚性柔性电路板，其包括刚性区域和柔性区域，所述刚性区域包括在其两个表面上具有第一电路层的柔性基板，形成在柔性基板上的金属芯基板，并具有第二电路并且设置在柔性基板和金属芯基板之间的粘合层，其中金属芯基板包括具有通孔的金属芯和形成在金属芯的表面上的绝缘层，使得刚性区域和柔性区域彼此热分离，改善了刚性区域的散热性能。还提供了制造刚性柔性电路板的方法。

9. 发明申请

US20110067902A1 HEAT DISSIPATING CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：散热电路板及其制造方法
公开(公告)号：US20110067902A1
公开(公告)日：2011-03-24
申请号：US12614405
申请日：2009-11-07
申请人： Hye Sook SHIN , Seog Moon CHOI , Shan GAO , Chang Hyun LIM , Tae Hyun KIM , Young Ki LEE
发明人： Hye Sook SHIN , Seog Moon CHOI , Shan GAO , Chang Hyun LIM , Tae Hyun KIM , Young Ki LEE
IPC分类号： H05K1/00 , H05K7/20
CPC分类号： H05K7/205 , H05K1/0209 , H05K1/0263 , H05K1/053 , H05K3/202 , H05K3/24 , H05K3/341 , H05K2201/066 , Y10T29/49124 , Y10T29/49126 , Y10T29/49155
摘要： Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.
摘要翻译：公开了一种散热电路板，其包括金属芯，该金属芯包括在其表面上形成的绝缘层，形成在绝缘层上的电路层，包括种子层和第一电路图案，以及散热框架层，使用焊料并具有第二电路图案的电路层，其中散热框架层不是通过电镀工艺而是通过使用焊料结合到电路层上，因此降低了电镀工艺的成本和时间并减轻了施加的应力由于电镀过程而导致散热电路板。还提供了制造散热电路板的方法。

10. 发明申请

US20120122278A1 Method Of Manufacturing Semiconductor Package Board 审中-公开
标题翻译：半导体封装板制造方法
公开(公告)号：US20120122278A1
公开(公告)日：2012-05-17
申请号：US13007530
申请日：2011-01-14
申请人： Kwan Ho LEE , Yong Hui Joo , Tae Hyun KIM , Seog Moon CHOI
发明人： Kwan Ho LEE , Yong Hui Joo , Tae Hyun KIM , Seog Moon CHOI
IPC分类号： H01L21/98
CPC分类号： H01L24/83 , H01L24/05 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/73 , H01L2224/0401 , H01L2224/04026 , H01L2224/04042 , H01L2224/05001 , H01L2224/0554 , H01L2224/29111 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/82801 , H01L2224/83192 , H01L2224/83238 , H01L2224/83385 , H01L2224/838 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/1579 , H01L2924/351 , H05K3/3494 , H05K2201/09681 , H05K2203/1115 , H05K2203/1121 , H01L2924/00014 , H01L2924/00 , H01L2924/01083 , H01L2924/00012
摘要： Disclosed herein is a method of method of manufacturing a semiconductor package board, including: providing a substrate including a connection part formed on one side thereof, the connection part being provided thereon with a solder layer; disposing a conductive heat generator equipped with current wiring on the solder layer; applying current to the current wiring and thus heating the solder layer to attach a semiconductor chip to the connection part; and removing the current wiring from the conductive heat generator. The method is advantageous in that the semiconductor chip is attached to the substrate by applying current to the current wiring of the conductive heat generator to locally heat only the solder layer, thus reducing thermal stress and preventing the deformation of the substrate.
摘要翻译：本发明公开了一种制造半导体封装板的方法，包括：提供包括形成在其一侧上的连接部分的基板，所述连接部分设置有焊料层; 在焊料层上配置配有电流布线的导电发热体; 向当前布线施加电流，从而加热焊料层以将半导体芯片附接到连接部分; 并从导电热发生器去除当前布线。该方法的优点在于，通过向导电发热体的电流布线施加电流而将半导体芯片附接到基板，以仅局部加热焊料层，从而降低热应力并防止基板的变形。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式