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1. 发明申请

US20070070109A1 Methods and systems for calibration of inkjet drop positioning 审中-公开
标题翻译：用于校准喷墨滴定位的方法和系统
公开(公告)号：US20070070109A1
公开(公告)日：2007-03-29
申请号：US11238832
申请日：2005-09-29
申请人： John White , Emanuel Beer , Hongbin Ji , Chang Lin , Shinichi Kurita
发明人： John White , Emanuel Beer , Hongbin Ji , Chang Lin , Shinichi Kurita
IPC分类号： B41J29/393
CPC分类号： B41J29/393
摘要： Methods and apparatus for inkjet inkjet drop positioning are provided. A first method includes determining an intended deposition location of an ink drop on a substrate, depositing the ink drop on the substrate using an inkjet printing system, detecting a deposited location of the deposited ink drop on the substrate, comparing the deposited location to the intended location, determining a difference between the deposited location and the intended location, and compensating for the difference between the deposited location and the intended location by adjusting a parameter of an inkjet printing system. Numerous other aspects are provided.
摘要翻译：提供喷墨喷墨滴定位的方法和装置。第一种方法包括确定墨滴在基底上的预期沉积位置，使用喷墨印刷系统将墨滴沉积在基底上，检测沉积的墨滴在基底上的沉积位置，将沉积位置与预期的位置进行比较确定存放位置与预期位置之间的差异，以及通过调整喷墨打印系统的参数来补偿存放位置与预期位置之间的差异。提供了许多其他方面。

2. 发明申请

US20070070099A1 METHODS AND APPARATUS FOR INKJET PRINTING ON NON-PLANAR SUBSTRATES 审中-公开
标题翻译：用于印刷非平板基板的方法和装置
公开(公告)号：US20070070099A1
公开(公告)日：2007-03-29
申请号：US11536533
申请日：2006-09-28
申请人： Emanuel Beer , Chang Lin , Shinichi Kurita , Quanyuan Shang , Benjamin Johnston
发明人： Emanuel Beer , Chang Lin , Shinichi Kurita , Quanyuan Shang , Benjamin Johnston
IPC分类号： B41J25/308
CPC分类号： B41J2/0456 , B41J2/0458 , B41J2/04588 , B41J3/28 , B41J3/4073 , B41J11/0035 , B41J25/308 , G02F1/1303 , G02F1/133516
摘要： A sensor apparatus for an inkjet printing device is provided. The sensor apparatus may include 1) at least one print head adapted to deposit ink on a top surface of a substrate, wherein the substrate is in motion relative to the print head, 2) at least one sensor adapted to detect the distance of the at least one sensor from the top surface of the substrate, and 3) a controller adapted to determine the substrate to nozzle distance based on the distance of the sensor to the top surface of the substrate, and adjust the trajectory of the ink being deposited on the substrate based on the substrate to nozzle distance. Numerous other aspects are provided.
摘要翻译：提供了一种用于喷墨打印装置的传感器装置。所述传感器装置可以包括：1）适于将墨水沉积在基底的顶表面上的至少一个打印头，其中所述基底相对于所述打印头运动; 2）至少一个传感器，适于检测所述at 至少一个传感器，以及3）控制器，其适于基于所述传感器与所述基板顶表面的距离来确定所述基板与喷嘴的距离，并且调整沉积在所述基板上的所述油墨的轨迹基板基于基板与喷嘴的距离。提供了许多其他方面。

3. 发明授权

US09613933B2 Package structure to enhance yield of TMI interconnections 有权
公开(公告)号：US09613933B2
公开(公告)日：2017-04-04
申请号：US14198479
申请日：2014-03-05
申请人： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, Jr. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
发明人： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, Jr. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
IPC分类号： H01L23/12 , H01L25/065 , H01L25/10 , H01L23/31 , H01L23/498 , H01L23/00
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/565 , H01L21/76802 , H01L23/3128 , H01L23/49822 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/13023 , H01L2224/16227 , H01L2224/16238 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06548 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/37001 , H01L2924/00
摘要： An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.

4. 发明授权

US07027412B2 System for dynamic provisioning of secure, scalable, and extensible networked computer environments 有权
公开(公告)号：US07027412B2
公开(公告)日：2006-04-11
申请号：US09860665
申请日：2001-05-18
申请人： Carleton Miyamoto , Chang Lin , William Blume , Jagadish Bandhole
发明人： Carleton Miyamoto , Chang Lin , William Blume , Jagadish Bandhole
IPC分类号： H04L12/28
CPC分类号： H04L63/0272 , H04L12/1886 , H04L63/10
摘要： A system and method for provisioning a virtual network is provided. Virtual networks can be automatically formed including switches in networks, such as local and private networks. Once the virtual networks are formed, virtual computing devices can be provisioned in place of physical computing devices that are connected to the switches. A system for provisioning a virtual network including a first virtual subnet and a second virtual subnet is provided. The system includes a first switch; a second switch; a first software process associated with first switch for provisioning the first virtual subnet; a second software process associated with the second switch for provisioning the second virtual subnet; and a communication link connecting the first switch and the second switch.

5. 外观设计

USD966545S1 Massager 有权
公开(公告)号：USD966545S1
公开(公告)日：2022-10-11
申请号：US29809156
申请日：2021-09-26
申请人： Chang Lin
设计人： Chang Lin

6. 发明授权

US07792125B2 System for dynamic provisioning for secure, scalable, and extensible networked computer environments 有权
标题翻译：用于动态配置的系统，用于安全，可扩展和可扩展的联网计算机环境
公开(公告)号：US07792125B2
公开(公告)日：2010-09-07
申请号：US11334012
申请日：2006-01-18
申请人： Carleton Miyamoto , Chang Lin , William Blume , Jagadish Bandhole
发明人： Carleton Miyamoto , Chang Lin , William Blume , Jagadish Bandhole
IPC分类号： H04L12/56
CPC分类号： H04L63/0272 , H04L12/1886 , H04L63/10
摘要： A system and method for provisioning a virtual network is provided. Virtual networks can be automatically formed including switches in networks, such as local and private networks. Once the virtual networks are formed, virtual computing devices can be provisioned in place of physical computing devices that are connected to the switches. A system for provisioning a virtual network including a first virtual subnet and a second virtual subnet is provided. The system includes a first switch; a second switch; a first software process associated with first switch for provisioning the first virtual subnet; a second software process associated with the second switch for provisioning the second virtual subnet; and a communication link connecting the first switch and the second switch.
摘要翻译：提供了用于配置虚拟网络的系统和方法。可以自动形成虚拟网络，包括网络中的交换机，例如本地和专用网络。一旦形成了虚拟网络，就可以配置虚拟计算设备来代替连接到交换机的物理计算设备。提供了一种用于配置包括第一虚拟子网和第二虚拟子网的虚拟网络的系统。该系统包括第一开关; 第二个开关与用于供应所述第一虚拟子网的第一交换机相关联的第一软件进程; 与所述第二交换机相关联的用于供应所述第二虚拟子网的第二软件进程; 以及连接第一开关和第二开关的通信链路。

7. 发明申请

US20060238007A1 CHAIR WITH AID IN LYING BACK AND GETTING UP 审中-公开
标题翻译：主持人回来并获得帮助
公开(公告)号：US20060238007A1
公开(公告)日：2006-10-26
申请号：US11114853
申请日：2005-04-26
申请人： Chang Lin
发明人： Chang Lin
IPC分类号： A47C1/00
CPC分类号： A61G5/14 , A47C1/0355
摘要： A chair includes a base, a seat, a backrest pivotally connected to a rear end of a seat frame of the seat, and a transmission mechanism including a motor, a telescopic rod actuated by the motor to move in a retracting direction and an extending direction, and a transmission plate. A connecting rod is pivotally connected between a lower end of the backrest frame and the transmission plate. The telescopic rod is directed to a position below a central portion of the seat. The transmission plate is pivoted to the central portion of the seat, the second end of the connecting rod, and the telescopic rod at different portions thereof. When the telescopic rod is retracted, the top support portion of the transmission plate presses against the seat frame to make the rear end of the seat frame move upward and forward.
摘要翻译：椅子包括基座，座椅，可枢转地连接到座椅的座椅框架的后端的靠背，以及包括马达的传动机构，由马达致动的伸缩杆，沿着缩回方向和延伸方向和透射板。连接杆可枢转地连接在靠背框架的下端和传动板之间。伸缩杆被引导到座椅中心部分下方的位置。传动板枢转到座椅的中心部分，连杆的第二端和伸缩杆的不同部分。当伸缩杆缩回时，传动板的顶部支撑部分压靠座椅框架，使得座椅框架的后端向上和向前移动。

8. 发明申请

US20060114842A1 System for dynamic provisioning of secure, scalable, and extensible networked computer environments 有权
公开(公告)号：US20060114842A1
公开(公告)日：2006-06-01
申请号：US11334012
申请日：2006-01-18
申请人： Carleton Miyamoto , Chang Lin , William Blume , Jagadish Bandhole
发明人： Carleton Miyamoto , Chang Lin , William Blume , Jagadish Bandhole
IPC分类号： H04L12/28
CPC分类号： H04L63/0272 , H04L12/1886 , H04L63/10
摘要： A system and method for provisioning a virtual network is provided. Virtual networks can be automatically formed including switches in networks, such as local and private networks. Once the virtual networks are formed, virtual computing devices can be provisioned in place of physical computing devices that are connected to the switches. A system for provisioning a virtual network including a first virtual subnet and a second virtual subnet is provided. The system includes a first switch; a second switch; a first software process associated with first switch for provisioning the first virtual subnet; a second software process associated with the second switch for provisioning the second virtual subnet; and a communication link connecting the first switch and the second switch.

9. 发明申请

US20150255415A1 Package Structure To Enhance Yield of TMI Interconnections 有权
标题翻译：包装结构以提高TMI互连的产量
公开(公告)号：US20150255415A1
公开(公告)日：2015-09-10
申请号：US14198479
申请日：2014-03-05
申请人： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, JR. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
发明人： Thomas J. De Bonis , Lilia May , Rajen S. Sidhu , Mukul P. Renavikar , Ashay A. Dani , Edward R. Prack , Carl L. Deppisch , Anna M. Prakash , James C. Matayabas, JR. , Jason Jieping Zhang , Srinivasa R. Aravamudhan , Chang Lin
IPC分类号： H01L23/00 , H01L25/065 , H01L23/498 , H01L23/31 , H01L21/56 , H01L21/768
CPC分类号： H01L23/49816 , H01L21/4853 , H01L21/565 , H01L21/76802 , H01L23/3128 , H01L23/49822 , H01L24/16 , H01L24/17 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/13023 , H01L2224/16227 , H01L2224/16238 , H01L2225/06513 , H01L2225/06517 , H01L2225/0652 , H01L2225/06548 , H01L2225/06586 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/1815 , H01L2924/37001 , H01L2924/00
摘要： An apparatus is described that includes a substrate and a mold compound disposed on the substrate. The semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate. Solder balls are disposed around the semiconductor die on the substrate. Each of the solder balls have a solid coating thereon. The solid coating contains a cleaning agent to promote its solder ball's coalescence with another solder ball. Respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings. In combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die. In combined or alternate embodiments micro-channels exist between the solder balls and the mold compound.
摘要翻译：描述了一种包括设置在基板上的基板和模具化合物的装置。半导体管芯被嵌入在模具化合物内并且电耦合到衬底上的焊盘。焊球围绕半导体管芯设置在基板上。每个焊球上都有一个固体涂层。固体涂层含有一种清洁剂，以促进其焊球与另一种焊球的聚结。在模具化合物中形成了暴露焊球及其各自固体涂层的通孔。在组合或替代实施例中，模具化合物的外边缘具有比通孔和半导体管芯之间的模具化合物区域更小的厚度。在组合或替代实施例中，焊料球与模具化合物之间存在微通道。

10. 发明申请

US20060288817A1 Crank for cycles 有权
公开(公告)号：US20060288817A1
公开(公告)日：2006-12-28
申请号：US11168900
申请日：2005-06-27
申请人： Chang Lin
发明人： Chang Lin
IPC分类号： G05G1/14
CPC分类号： B62M3/00 , Y10T74/2164
摘要： A crank for bicycles or other cycling facilities includes an elongate shank having an orifice formed in one end, and a chamber formed by an upper wall and a lower wall, a gasket is engaged into the chamber via the orifice of the shank. The gasket is engaged between the walls of the shank, and a fastener may be engaged through the orifice of the shank and may be engaged through a bore of the gasket. The shank includes an aperture having an inner diameter smaller than that of the orifice, a second gasket may be engaged into the chamber via the orifice of the shank and includes a bore aligned with the aperture of the shank.

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