会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 4. 发明授权
    • Press-fit shields for electronic assemblies, and methods for assembling
the same
    • 用于电子组件的压配屏蔽件及其组装方法
    • US5847938A
    • 1998-12-08
    • US770823
    • 1996-12-20
    • John Weldon Gammon
    • John Weldon Gammon
    • H05K9/00
    • H05K9/003
    • A shield including a cover and pins is inserted in a solder-free connection into an electronic substrate for shielding electronic components on the substrate in an electronic device. The shield has a conductive cover, preferably with an integrally formed roof and wall, which defines a cavity. The cavity is configured to receive an electronic component or components positioned therein. The shield also has a conductive mounting pins which extend from the cover. The cover and the pins are preferably formed as a single piece. The shield also preferably includes a conductive gasket connected in a groove in the cover between the cover and the electronic substrate. Methods of assembling the shield on an electronic substrate in forming an electronic package for an electronic device are also provided.
    • 将包括盖和销的屏蔽件插入到无电焊接的电子基板中,用于屏蔽电子设备中的基板上的电子部件。 屏蔽件具有导电盖,优选地具有一体形成的屋顶和壁,其限定空腔。 空腔被配置为接收定位在其中的电子部件或部件。 护罩还具有从盖延伸的导电安装销。 盖和销优选地形成为单件。 屏蔽还优选地包括连接在盖和电子基板之间的盖中的凹槽中的导电垫片。 还提供了在形成用于电子设备的电子封装件时在电子基板上组装屏蔽的方法。