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    • 3. 发明授权
    • Trench-gate semiconductor devices having a channel-accommodating region and their methods of manufacture
    • 具有通道容纳区域的沟槽栅半导体器件及其制造方法
    • US06660591B2
    • 2003-12-09
    • US10134209
    • 2002-04-26
    • Steven T. PeakeGeorgios PetkosRobert J. FarrChristopher M. RogersRaymond J. GroverPeter J. Forbes
    • Steven T. PeakeGeorgios PetkosRobert J. FarrChristopher M. RogersRaymond J. GroverPeter J. Forbes
    • H01L21336
    • H01L29/66348H01L29/42368
    • Compact trench-gate semiconductor devices, for example a cellular power MOSFET with sub-micron pitch (Yc), are manufactured with self-aligned techniques that use sidewall spacers (52) in different ways. Thereby, the source region (13) and a contact window (18a) for a source electrode (33) can be self-aligned to a narrow trench (20) containing the trench-gate (11). Thereby, the channel-accommodating region (15) can also be provided after forming the trench-gate (11), and with very good control of its doping concentration (Na; p) adjacent to the trench (20). To achieve this control, its dopant is provided after removing the spacers (52) from the mask (51) so as to form a doping window (51b), which may also be used for the source dopant, adjacent to the trench-gate (11). A high energy dopant implant (61) or other doping process provides this channel dopant adjacent to the trench (20) and extending laterally below the mask (51,51n). A remarkably uniform doping profile can be achieved beneath the doping window (51b) and beneath the mask (51,51n). By using a high ion energy and high dose, the dopant ions (61) at the doping window (51b) can be laterally scattered below the mask (51) while those at the mask (51) penetrate there-through to be implanted in the underlying portion of the body (100).
    • 紧凑型沟槽栅极半导体器件(例如具有亚微米间距(Yc)的蜂窝功率MOSFET)以具有以不同方式使用侧壁间隔物(52)的自对准技术制造。 因此,用于源电极(33)的源区(13)和接触窗(18a)可以与包含沟槽栅极(11)的窄沟槽(20)自对准。 由此,也可以在形成沟槽栅极(11)之后提供沟道容纳区域(15),并且非常好地控制与沟槽(20)相邻的掺杂浓度(Na; p)。 为了实现该控制,在从掩模(51)去除间隔物(52)之后提供其掺杂剂,以形成邻近沟槽栅极(也可用于源极掺杂剂)的掺杂窗口(51b) 11)。 高能量掺杂剂注入(61)或其它掺杂工艺提供了与沟槽(20)相邻并且在掩模(51,51n)下方横向延伸的该沟道掺杂剂。 在掺杂窗口(51b)下面和掩模(51,51n)下面可以实现非常均匀的掺杂分布。 通过使用高离子能量和高剂量,掺杂窗口(51b)处的掺杂剂离子(61)可以横向散布在掩模(51)下方,而掩模(51)处的掺杂离子(61)穿过其中,以便被植入到 身体(100)的下部。