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    • 4. 发明申请
    • Electronic System With Lead Free Interconnections And Method of Fabrication
    • 无铅互连电子系统及其制造方法
    • US20080116552A1
    • 2008-05-22
    • US11560867
    • 2006-11-17
    • James RoseRobert LewandowskiThomas GorczycaKevin DurocherJonathan ShortDonna Sherman
    • James RoseRobert LewandowskiThomas GorczycaKevin DurocherJonathan ShortDonna Sherman
    • H01L23/02
    • H05K3/361H01L2224/16225H01L2224/32225H01L2224/73204H05K3/244H05K3/305H05K3/328H05K2201/10734H05K2201/10977H05K2203/0495H01L2924/00
    • An electronic system (1) having an interconnect structure (30, 45). In one embodiment a system (1) includes a first electronic device (2) with a first plurality of contact pads (15) each having a noble metal (18) formed along a first surface (19), and a second electronic device (3) with a second plurality of contact pads (29) each having a noble metal (18) formed along a first surface (19). The noble metal (18) of one of the contact pads (15) of the first device (2) is bonded to the noble metal (18) of one of the contact pads (29) of the second device (3). In one embodiment of an associated method of forming an interconnect structure (45), a first electronic device (2) is provided with a first plurality of contact pads (15) each having a noble metal (18) along a first surface (19), and a second electronic device (3) is provided with a plurality of contact pads (29) each having a noble metal (18) along a first surface (19). One or more of the contact pads (15) on the first device (2) is aligned with one or more of the contact pads (29) on the second device (3) to form pairs of pads (45) for electrical contact with one another. The first surface (19) of a contact pad (15) of the first device (2) is pressed against the first surface (19) of a contact pad (29) on the second device (3) to make contact between the two first surfaces (19).
    • 一种具有互连结构(30,45)的电子系统(1)。 在一个实施例中,系统(1)包括具有第一多个接触焊盘(15)的第一电子设备(2),每个接触焊盘具有沿着第一表面(19)形成的贵金属(18)和第二电子设备(3) )与具有沿着第一表面(19)形成的贵金属(18)的第二多个接触焊盘(29)连接。 第一装置(2)的接触焊盘(15)之一的贵金属(18)被接合到第二装置(3)的接触焊盘(29)之一的贵金属(18)上。 在形成互连结构(45)的相关联的方法的一个实施例中,第一电子器件(2)设置有第一多个接触焊盘(15),每个接触焊盘沿着第一表面(19)具有贵金属(18) ,并且第二电子设备(3)设置有多个接触焊盘(29),每个接触焊盘(29)沿着第一表面(19)具有贵金属(18)。 第一装置(2)上的接触焊盘(15)中的一个或多个与第二装置(3)上的一个或多个接触焊盘(29)对准以形成一对焊盘(45),用于与一个 另一个。 第一装置(2)的接触垫(15)的第一表面(19)被压靠在第二装置(3)上的接触垫(29)的第一表面(19)上,以使第一装置 表面(19)。
    • 9. 发明申请
    • CT DETECTOR PHOTODIODE HAVING MULTIPLE CHARGE STORAGE DEVICES
    • 具有多个充电储存装置的CT检测器光电二极管
    • US20080013677A1
    • 2008-01-17
    • US11780972
    • 2007-07-20
    • George PossinJonathan ShortWen Li
    • George PossinJonathan ShortWen Li
    • G01N23/083
    • G01T1/2018A61B6/032
    • A CT detector includes a pixel having a single photodiode and multiple charge storage devices that are alternately stored and read out. The photodiode is a frontlit diode with a pair of capacitors that alternately store charge generated during data acquisition. Multiple pixels are connected to a single readout amplifier. Charge is continuously acquired from each photodiode and stored on the charge storage devices, but such readout is from a single charge storage device at a time. As such, each charge storage device is read out independently, but the charge storage devices are connected to a common readout channel or port.
    • CT检测器包括具有单个光电二极管的像素和交替存储和读出的多个电荷存储装置。 光电二极管是具有一对电容器的前照明二极管,其交替地存储在数据采集期间产生的电荷。 多个像素连接到单个读出放大器。 从每个光电二极管连续获取电荷并将其存储在电荷存储装置上,但这样的读出是从一个电荷存储装置一次。 因此,每个电荷存储装置被独立地读出,但是电荷存储装置连接到公共读出通道或端口。