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    • 3. 发明授权
    • Doubly graded junction termination extension for edge passivation of semiconductor devices
    • 用于半导体器件边缘钝化的双重分级结终止扩展
    • US06215168B1
    • 2001-04-10
    • US09358625
    • 1999-07-21
    • Linda Susan BrushJohn Mannine Savidge Neilson
    • Linda Susan BrushJohn Mannine Savidge Neilson
    • H01L2358
    • H01L29/0615H01L2924/0002H01L2924/00
    • A silicon semiconductor die comprises a heavily doped silicon substrate and an upper layer comprising doped silicon of a first conductivity type disposed on the substrate. The upper layer includes an active region that comprises a well region of a second, opposite conductivity type and an edge passivation zone comprising a junction termination extension (JTE) JTE region that includes portions extending away from and extending beneath the well region. The JTE region is of varying dopant density, the dopant density being maximum at a point substantially directly beneath the junction at the upper surface of the upper layer of the JTE region with the well region. The dopant density of the JTE region decreases in both lateral directions from its maximum point, becoming less in both the portions extending away from and beneath the well region.
    • 硅半导体管芯包括重掺杂的硅衬底和设置在衬底上的包括第一导电类型的掺杂硅的上层。 上层包括有源区,其包括第二相反导电类型的阱区和包括连接终止延伸(JTE)JTE区的边缘钝化区,该区域包括在阱区域之外延伸并在其下延伸的部分。 JTE区域具有不同的掺杂剂密度,掺杂剂密度在基本上直接位于具有阱区域的JTE区域的上层的上表面的接合处的点处最大。 JTE区域的掺杂剂密度在两个横向方向上从其最大点减小,在两个延伸远离井下区域的部分中变小。