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    • 3. 发明授权
    • High density FET with integrated Schottky
    • 集成肖特基的高密度FET
    • US08686493B2
    • 2014-04-01
    • US12242633
    • 2008-09-30
    • Paul ThorupChristopher Lawrence Rexer
    • Paul ThorupChristopher Lawrence Rexer
    • H01L29/66
    • H01L29/66734H01L29/0696H01L29/1095H01L29/407H01L29/41766H01L29/47H01L29/66727H01L29/7806
    • A semiconductor structure includes a monolithically integrated trench FET and Schottky diode. The semiconductor structure further includes a plurality of trenches extending into a semiconductor region. A stack of gate and shield electrodes are disposed in each trench. Body regions extend over the semiconductor region between adjacent trenches, with a source region extending over each body region. A recess having tapered edges extends between every two adjacent trenches from upper corners of the two adjacent trenches through the body region and terminating in the semiconductor region below the body region. An interconnect layer extends into each recess to electrically contact tapered sidewalls of the source regions and the body regions, and to contact the semiconductor region along a bottom of each recess to form a Schottky contact therebetween.
    • 半导体结构包括单片集成沟槽FET和肖特基二极管。 半导体结构还包括延伸到半导体区域中的多个沟槽。 在每个沟槽中设置一叠栅极和屏蔽电极。 主体区域在相邻沟槽之间的半导体区域上延伸,源区域在每个主体区域上延伸。 具有锥形边缘的凹槽在两个相邻沟槽的每两个相邻的沟槽之间延伸穿过本体区域的两个相邻沟槽的上角,并终止在身体区域下方的半导体区域中。 互连层延伸到每个凹部中以电接触源区域和主体区域的锥​​形侧壁,并且沿着每个凹部的底部接触半导体区域以在它们之间形成肖特基接触。
    • 10. 发明申请
    • HIGH DENSITY FET WITH INTEGRATED SCHOTTKY
    • 具有集成肖特基的高密度FET
    • US20090090966A1
    • 2009-04-09
    • US12242633
    • 2008-09-30
    • PAUL THORUPChristopher Lawrence Rexer
    • PAUL THORUPChristopher Lawrence Rexer
    • H01L27/06H01L21/8234
    • H01L29/66734H01L29/0696H01L29/1095H01L29/407H01L29/41766H01L29/47H01L29/66727H01L29/7806
    • A semiconductor structure includes a monolithically integrated trench FET and Schottky diode. The semiconductor structure further includes a plurality of trenches extending into a semiconductor region. A stack of gate and shield electrodes are disposed in each trench. Body regions extend over the semiconductor region between adjacent trenches, with a source region extending over each body region. A recess having tapered edges extends between every two adjacent trenches from upper corners of the two adjacent trenches through the body region and terminating in the semiconductor region below the body region. An interconnect layer extends into each recess to electrically contact tapered sidewalls of the source regions and the body regions, and to contact the semiconductor region along a bottom of each recess to form a Schottky contact therebetween.
    • 半导体结构包括单片集成沟槽FET和肖特基二极管。 半导体结构还包括延伸到半导体区域中的多个沟槽。 在每个沟槽中设置一叠栅极和屏蔽电极。 主体区域在相邻沟槽之间的半导体区域上延伸,源区域在每个主体区域上延伸。 具有锥形边缘的凹槽在两个相邻沟槽的每两个相邻的沟槽之间延伸穿过本体区域的两个相邻沟槽的上角,并终止在身体区域下方的半导体区域中。 互连层延伸到每个凹部中以电接触源区域和主体区域的锥​​形侧壁,并且沿着每个凹部的底部接触半导体区域以在它们之间形成肖特基接触。