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1. 发明申请

US20150004902A1 DIE-TO-DIE INDUCTIVE COMMUNICATION DEVICES AND METHODS 审中-公开
标题翻译： DIE-TO-DIE电感通信设备和方法
公开(公告)号：US20150004902A1
公开(公告)日：2015-01-01
申请号：US13930250
申请日：2013-06-28
申请人： John M. Pigott , Fred T. Brauchler , Darrel R. Frear , Vivek Gupta , Randall C. Gray , Norman L. Owens , Carl E. D'Acosta
发明人： John M. Pigott , Fred T. Brauchler , Darrel R. Frear , Vivek Gupta , Randall C. Gray , Norman L. Owens , Carl E. D'Acosta
IPC分类号： H04B5/00 , H01L49/02
CPC分类号： H04B5/0031 , H01F19/08 , H01L23/3107 , H01L23/48 , H01L23/49575 , H01L23/5227 , H01L24/05 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/92 , H01L28/10 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/0557 , H01L2224/131 , H01L2224/16245 , H01L2224/27334 , H01L2224/29034 , H01L2224/2919 , H01L2224/32013 , H01L2224/32014 , H01L2224/32145 , H01L2224/32245 , H01L2224/33181 , H01L2224/48247 , H01L2224/4826 , H01L2224/48464 , H01L2224/73203 , H01L2224/73215 , H01L2224/73265 , H01L2224/92147 , H01L2224/92247 , H01L2924/00014 , H01L2924/10252 , H01L2924/10253 , H01L2924/10329 , H01L2924/1033 , H01L2924/1305 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H01L2924/19042 , H01L2924/19104 , H04B5/0093 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/05552 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of inductive communication devices include first and second galvanically isolated IC die. The first IC die has a first coil proximate to a first surface of the first IC die, and the second IC die has a second coil proximate to a first surface of the second IC die. The first and second IC die are arranged so that the first surfaces of the first and second IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. One or more dielectric components are positioned within the gap directly between the first and second coils. During operation, a first signal is provided to the first coil, and the first coil converts the signal into a time-varying magnetic field. The magnetic field couples with the second coil, which produces a corresponding second signal.
摘要翻译：感应通信设备的实施例包括第一和第二电隔离IC芯片。第一IC管芯具有靠近第一IC管芯的第一表面的第一线圈，并且第二IC管芯具有靠近第二IC管芯的第一表面的第二线圈。第一IC芯片和第二IC芯片被布置成使得第一和第二IC芯片的第一表面彼此面对，并且第一线圈和第二线圈跨越第一和第二IC芯片之间的间隙排列。一个或多个电介质部件直接位于第一和第二线圈之间的间隙内。在操作期间，向第一线圈提供第一信号，并且第一线圈将该信号转换成时变磁场。磁场与第二线圈耦合，产生相应的第二信号。

2. 发明授权

US09466413B2 Die-to-die inductive communication devices and methods 有权
标题翻译：模 - 模感应通信设备和方法
公开(公告)号：US09466413B2
公开(公告)日：2016-10-11
申请号：US13930236
申请日：2013-06-28
申请人： Fred T. Brauchler , John M. Pigott , Darrel R. Frear , Vivek Gupta , Randall C. Gray , Norman L. Owens , Carl E. D'Acosta
发明人： Fred T. Brauchler , John M. Pigott , Darrel R. Frear , Vivek Gupta , Randall C. Gray , Norman L. Owens , Carl E. D'Acosta
IPC分类号： H01L25/00 , H01L25/065 , H02J5/00 , H01F19/08 , H01L23/522 , H01L23/64 , H01L23/495
CPC分类号： H01F19/08 , H01F2019/085 , H01L23/49575 , H01L23/5227 , H01L23/645 , H01L2224/0401 , H01L2224/04042 , H01L2224/131 , H01L2224/16245 , H01L2224/32145 , H01L2224/48247 , H01L2224/48464 , H01L2224/73215 , H01L2924/13055 , H01L2924/14 , H01L2924/00 , H01L2924/014
摘要： Embodiments of inductive communication devices include first and second galvanically isolated IC die and a dielectric structure. Each IC die has a coil proximate to a first surface of the IC die. The IC die are arranged so that the first surfaces of the IC die face each other, and the first coil and the second coil are aligned across a gap between the first and second IC die. The dielectric structure is positioned within the gap directly between the first and second coils, and a plurality of conductive structures are positioned in or on the dielectric structure and electrically coupled with the second IC die. The conductive structures include portions configured to function as bond pads, and the bond pads may be coupled to package leads using wirebonds. During operation, signals are conveyed between the IC die through inductive coupling between the coils.
摘要翻译：感应通信设备的实施例包括第一和第二电隔离IC芯片和电介质结构。每个IC管芯具有靠近IC管芯的第一表面的线圈。 IC芯片被布置成使得IC管芯的第一表面彼此面对，并且第一线圈和第二线圈跨越第一和第二IC管芯之间的间隙排列。电介质结构直接位于第一和第二线圈之间的间隙内，并且多个导电结构位于电介质结构中或电介质结构上并与第二IC芯片电耦合。导电结构包括被配置为用作接合焊盘的部分，并且接合焊盘可以使用引线键耦合到封装引线。在操作期间，通过线圈之间的感应耦合在IC芯片之间传送信号。

3. 发明授权

US06651666B1 Variable cuff pressure adapter 失效
标题翻译：可变袖口压力适配器
公开(公告)号：US06651666B1
公开(公告)日：2003-11-25
申请号：US10201031
申请日：2002-07-23
申请人： Norman L. Owens
发明人： Norman L. Owens
IPC分类号： A62B902
CPC分类号： A61M16/04 , A61M16/044 , A61M16/0452
摘要： Pressure in a cuff on an endotracheal tube is controlled by a fluid circuit that includes a port on the endotracheal tube, a moisture absorbent barrier covering that port, a one-way valve, a pressure manometer as well as a pilot balloon fluidically connected to the cuff. A thumb wheel is included in one form of the invention to control operation of the one-way valve.
摘要翻译：在气管插管上的袖带中的压力由流体回路控制，流体回路包括气管内管上的端口，覆盖该口的吸湿屏障，单向阀，压力压力计以及与流体连接至袖口。在本发明的一种形式中包括指轮以控制单向阀的操作。

4. 外观设计

USD345731S Semiconductor package 失效
公开(公告)号：USD345731S
公开(公告)日：1994-04-05
申请号：US2224
申请日：1992-12-03
申请人： Norman L. Owens , Timothy L. Olson
设计人： Norman L. Owens , Timothy L. Olson

5. 发明授权

US07114367B1 Pulmonary function test calibration system and method 有权
标题翻译：肺功能测试校准系统及方法
公开(公告)号：US07114367B1
公开(公告)日：2006-10-03
申请号：US10926414
申请日：2004-08-26
申请人： Norman L. Owens
发明人： Norman L. Owens
IPC分类号： G01F25/00
CPC分类号： G01F25/0084
摘要： A system for calibrating pulmonary function test equipment having syringe means, including a syringe having a cylindrically shaped sidewall, a proximal end with an centrally located orifice, a distal end with an output port, an interior cavity, and a plunger with a shaft slidably mounted through the orifice, a piston-type head mounted on one end of the shaft, and a handle mounted on an opposing end of the shaft; an FRC port; a rigid FRC bag connected in flow communication with the FRC port; control means having a plurality of stop mechanisms, including a first stop mechanism, a second stop mechanism structured to enable selective connection of the interior cavity in flow communication with the FRC port, and a third stop mechanism, and connection means structured to connect the syringe means to existing pulmonary function test equipment. A method of utilizing the system is also disclosed.
摘要翻译：一种用于校准具有注射器装置的肺功能测试设备的系统，包括具有圆柱形侧壁的注射器，具有中心定位的孔的近端，具有输出端口的远端，内部空腔和具有可滑动地安装的轴的柱塞通过孔口安装在轴的一端的活塞式头部和安装在轴的相对端上的手柄; 一个FRC港口; 与FRC端口流通连接的刚性FRC袋; 控制装置具有多个停止机构，包括第一止动机构，第二止动机构，其构造成使得能够与FRC端口流体连通的内部空腔的选择性连接，以及第三止动机构，以及连接装置，意味着现有的肺功能检测设备。还公开了利用该系统的方法。

6. 发明授权

US4816896A Compliant standoff for semiconductor packages 失效
标题翻译：符合半导体封装的对峙
公开(公告)号：US4816896A
公开(公告)日：1989-03-28
申请号：US150868
申请日：1988-02-01
申请人： Norman L. Owens
发明人： Norman L. Owens
IPC分类号： H01L21/00 , H04N7/01 , H05K7/02 , H01L23/12 , H01L23/14
CPC分类号： H01L21/67121 , H04N7/0125 , H05K7/02
摘要： Described herein is a standoff for use with semiconductor packages to prevent chipping. The standoff is designed to fit over a pin of the package and seat on the package surface with a portion extending over the corner of the package.
摘要翻译：这里描述了与半导体封装一起使用以防止碎裂的对立。隔离件被设计成装配在包装的销上并且位于包装表面上并且具有在包装角上延伸的部分。

7. 发明授权

US07074647B2 Semiconductor component comprising leadframe, semiconductor chip and integrated passive component in vertical relationship to each other 有权
标题翻译：半导体元件包括彼此垂直的引线框，半导体芯片和集成无源元件
公开(公告)号：US07074647B2
公开(公告)日：2006-07-11
申请号：US10615055
申请日：2003-07-07
申请人： Norman L. Owens , Darrel Frear
发明人： Norman L. Owens , Darrel Frear
IPC分类号： H01L21/44 , H01L21/48
CPC分类号： H01L23/3107 , H01L23/495 , H01L23/49548 , H01L23/49575 , H01L24/48 , H01L2224/16 , H01L2224/16245 , H01L2224/16265 , H01L2224/48091 , H01L2224/48247 , H01L2224/48265 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/19011 , H01L2924/19041 , H01L2924/19103 , H01L2924/19104 , H01L2924/19107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In one embodiment of the invention, a semiconductor component includes: a leadframe (110, 210, 310, 410) having a surface (111, 211, 311, 411); an integrated passive component (120, 220, 320, 420) located above the surface of the leadframe; a semiconductor chip (130, 230, 330, 430) electrically coupled to the integrated passive component and located above the surface of the leadframe; and a mold compound (140, 240, 340, 440) disposed around the semiconductor chip, the integrated passive component, and the leadframe. A portion (112, 212, 312, 412) of the leadframe is exposed outside of the mold compound. The integrated passive component comprises a passive device (121, 221, 321, 421). A direction (190, 290, 390, 490) perpendicular to the surface of the leadframe is a vertical direction, and the semiconductor chip, the integrated passive component, and the leadframe are arranged vertically with respect to each other.
摘要翻译：在本发明的一个实施例中，半导体部件包括：具有表面（111,211,311,411）的引线框架（110,210,310,410）; 位于引线框架表面上方的集成无源部件（120,220,320,420）; 电耦合到所述集成无源部件并且位于所述引线框架的表面上方的半导体芯片（130,230,330,430）; 以及设置在半导体芯片周围的模制化合物（140,240,340,440），集成无源部件和引线框架。引线框架的一部分（112,212,312,412）暴露在模具化合物的外部。集成无源部件包括无源器件（121,221,321,421）。垂直于引线框架表面的方向（190,290,390,490）是垂直方向，并且半导体芯片，集成无源部件和引线框架相对于彼此垂直布置。

8. 外观设计

USD462661S1 Programmable electrical outlet 失效
标题翻译：可编程电源插座
公开(公告)号：USD462661S1
公开(公告)日：2002-09-10
申请号：US29150897
申请日：2001-12-03
申请人： Norman L. Owens
设计人： Norman L. Owens

9. 外观设计

USD455404S1 Flexible cord 失效
标题翻译：软线
公开(公告)号：USD455404S1
公开(公告)日：2002-04-09
申请号：US29144830
申请日：2001-07-12
申请人： Norman L. Owens , John D. Milton
设计人： Norman L. Owens , John D. Milton

10. 发明授权

US4918512A Semiconductor package having an outwardly arced die cavity 失效
标题翻译：具有外弧模腔的半导体封装
公开(公告)号：US4918512A
公开(公告)日：1990-04-17
申请号：US286676
申请日：1988-12-19
申请人： Norman L. Owens
发明人： Norman L. Owens
IPC分类号： H01L23/02 , H01L23/13
CPC分类号： H01L23/13 , H01L2224/48091 , H01L2924/15312
摘要： A semiconductor package having a unique die cavity configuration wherein each side of the die cavity is arced outward from the center of the die cavity. This configuration is especially well suited for use in laminated multilayer ceramic packages.

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