专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080024991A1 Heatsink Apparatus for Applying a Specified Compressive Force to an Integrated Circuit Device 有权
标题翻译：用于将特定压缩力应用于集成电路装置的散热装置
公开(公告)号：US20080024991A1
公开(公告)日：2008-01-31
申请号：US11460334
申请日：2006-07-27
申请人： John L. Colbert , John S. Corbin , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
发明人： John L. Colbert , John S. Corbin , Jason R. Eagle , Roger Duane Hamilton , Amanda E. Mikhail , Arvind K. Sinha , Terry L. Sobotta
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A method and apparatus for applying a specified compressive force by a heat dissipation device for an integrated circuit are given, including placing the integrated circuit device onto a printed circuit board and then placing the heat dissipation device onto the integrated circuit device. The method includes tightening an actuation screw in a spring plate against a portion of the heat dissipation device. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, the specific compressive force may be less than or equal to a maximum pressure which may be exerted on the integrated circuit device.
摘要翻译：给出了一种通过用于集成电路的散热装置施加特定压缩力的方法和装置，包括将集成电路装置放置在印刷电路板上，然后将散热装置放置在集成电路装置上。该方法包括将弹簧板中的致动螺钉紧固在散热装置的一部分上。可以防止致动螺钉被紧固超过对应于对于特定压缩力的预设校准的机械约束，其可以大于或等于对应于较小的最小热界面压力的最小压缩力，并且最小接触界面压力。此外，比压缩力可以小于或等于可以施加在集成电路装置上的最大压力。

2. 发明申请

US20100173505A1 Topography compensating land grid array interposer 失效
标题翻译：地形补偿地面阵列插值器
公开(公告)号：US20100173505A1
公开(公告)日：2010-07-08
申请号：US12462985
申请日：2009-08-11
申请人： Gareth G. Hougham , Brian S. Beaman , John S. Corbin , Paul Coteus , Shawn A. Hall , Kathleen C. Hinge , Theron L. Lewis , Frank R. Libsch , Amanda E. E. Mikhail
发明人： Gareth G. Hougham , Brian S. Beaman , John S. Corbin , Paul Coteus , Shawn A. Hall , Kathleen C. Hinge , Theron L. Lewis , Frank R. Libsch , Amanda E. E. Mikhail
IPC分类号： H01R12/14 , H01R13/22 , H01R43/00
CPC分类号： H05K3/368 , H01R12/52 , H01R12/714 , H05K1/0269 , H05K3/325 , H05K2201/10378 , Y10T29/49117 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149
摘要： LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography. For those LGAs made of metal springs, cantilevers, armatures and the like, the desired topography is imposed by shaping of the buttons during or after fabrication using a sizing die with the desired topography.
摘要翻译： LGA连接器采用预制到不同高度的按钮或弹簧触点制成，以适应特定产品类型的典型模块或PCB的初始形貌。这是通过测量第一电子装置和第二电子装置的配合表面的形貌来制造的; 制造内插器触点以形成具有用于接触配合表面的相应反向形状的相对非平面侧; 并且将所述插入件夹在所述第一和第二电子设备之间，所述相对侧与相应的配合表面相接触。对于通过成型技术（例如，Tyco Electronics MPI或Shin Etsu RP）或Metal-on-Elastomer型（IBM）的成型技术制造的LGA类型，使用具有所需形貌的模具提供所需的 LGA地形。对于由金属弹簧，悬臂，电枢等制成的那些LGAs，通过使用具有所需形状的尺寸模具在制造期间或之后使按钮成形来施加所需的形状。

3. 发明授权

US06497465B1 Anti-tilt mechanism for a drawer assembly 失效
标题翻译：抽屉组件的反倾斜机构
公开(公告)号：US06497465B1
公开(公告)日：2002-12-24
申请号：US09666276
申请日：2000-09-21
申请人： Bruce E. Baker , John S. Corbin , Philip W. Sobey
发明人： Bruce E. Baker , John S. Corbin , Philip W. Sobey
IPC分类号： A47B8804
CPC分类号： H05K7/1421
摘要： An anti-tilt mechanism for a drawer assembly, the drawer assembly being in a rack, is disclosed. The anti-tilt mechanism comprises two railing portions coupled to the rack and two brackets, each of the two brackets respectively coupled to one of the two railing portions. Each of the. two brackets comprises a first planar portion and a second planar portion, the second planar portion coupled to the top of the first planar portion and extending substantially perpendicular to the first planar portion, the second planar portion capable of preventing the drawer assembly from tilting during a slidable operation thereof. The anti-tilt mechanism in accordance with the present invention prevents the drawer assembly from tilting during the slidable operation of the assembly. This is desirable because if tilting occurs during the slidable operation of the assembly, the assembly could be damaged and/or a system operator could be injured.
摘要翻译：公开了一种用于抽屉组件的反倾斜机构，抽屉组件位于机架中。防倾斜机构包括联接到齿条和两个托架的两个栏杆部分，两个托架中的每一个分别联接到两个栏杆部分中的一个。每一个。两个支架包括第一平面部分和第二平面部分，第二平面部分联接到第一平面部分的顶部并且基本上垂直于第一平面部分延伸，第二平面部分能够防止抽屉组件在可滑动操作。根据本发明的防倾斜机构防止了在组件的可滑动操作期间抽屉组件倾斜。这是理想的，因为如果在组件的可滑动操作期间发生倾斜，则组件可能被损坏和/或系统操作者可能受伤。

4. 发明授权

US07975379B2 Method of making a land-grid-array (LGA) interposer 失效
标题翻译：制作平面阵列（LGA）插入器的方法
公开(公告)号：US07975379B2
公开(公告)日：2011-07-12
申请号：US12462985
申请日：2009-08-11
申请人： Gareth G. Hougham , Brian S. Beaman , John S. Corbin , Paul Coteus , Shawn A. Hall , Kathleen C. Hinge , Theron L. Lewis , Frank R. Libsch , Amanda E. E. Mikhail
发明人： Gareth G. Hougham , Brian S. Beaman , John S. Corbin , Paul Coteus , Shawn A. Hall , Kathleen C. Hinge , Theron L. Lewis , Frank R. Libsch , Amanda E. E. Mikhail
IPC分类号： H01R9/00
CPC分类号： H05K3/368 , H01R12/52 , H01R12/714 , H05K1/0269 , H05K3/325 , H05K2201/10378 , Y10T29/49117 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149
摘要： LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces.
摘要翻译： LGA连接器采用预制到不同高度的按钮或弹簧触点制成，以适应特定产品类型的典型模块或PCB的初始形貌。这是通过测量第一电子装置和第二电子装置的配合表面的形貌来制造的; 制造内插器触点以形成具有用于接触配合表面的相应反向形状的相对非平面侧; 并且将所述插入件夹在所述第一和第二电子设备之间，所述相对侧与相应的配合表面相接触。

5. 发明申请

US20080073765A1 IC CHIP PACKAGE HAVING AUTOMATED TOLERANCE COMPENSATION 有权
标题翻译：具有自动公差补偿的IC芯片包装
公开(公告)号：US20080073765A1
公开(公告)日：2008-03-27
申请号：US11535740
申请日：2006-09-27
申请人： John S. Corbin , David L. Edwards , David C. Long , Jason S. Miller
发明人： John S. Corbin , David L. Edwards , David C. Long , Jason S. Miller
IPC分类号： H01L23/02
CPC分类号： H05K3/325 , H05K1/0271 , H05K3/0058 , H05K2201/10719 , H05K2201/2009 , H05K2203/074
摘要： An IC chip package and related method are disclosed. The IC chip package may include a printed circuit board (PCB) coupled to a chip module by a land grid array (LGA) connector, a metal stiffener including a fluid-based pressure compensator contacting an underside of the PCB, and at least two couplers for coupling the metal stiffener to the chip module, with the PCB and the LGA connector therebetween. The fluid-based pressure compensator automatically compensates for natural and non-systematic out-of flatness tolerances of the PCB and the chip module, and non-uniform thickness of the PCB while creating a substantially uniform contact force on the LGA.
摘要翻译：公开了一种IC芯片封装及相关方法。 IC芯片封装可以包括通过平面栅格阵列（LGA）连接器耦合到芯片模块的印刷电路板（PCB），包括接触PCB底部的基于流体的压力补偿器的金属加强件和至少两个耦合器用于将金属加强件耦合到芯片模块，其中PCB和LGA连接器在其间。基于流体的压力补偿器自动补偿PCB和芯片模块的自然和非系统的平坦度公差以及PCB的不均匀厚度，同时在LGA上产生基本上均匀的接触力。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式