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1. 发明授权

US07975379B2 Method of making a land-grid-array (LGA) interposer 失效
标题翻译：制作平面阵列（LGA）插入器的方法
公开(公告)号：US07975379B2
公开(公告)日：2011-07-12
申请号：US12462985
申请日：2009-08-11
申请人： Gareth G. Hougham , Brian S. Beaman , John S. Corbin , Paul Coteus , Shawn A. Hall , Kathleen C. Hinge , Theron L. Lewis , Frank R. Libsch , Amanda E. E. Mikhail
发明人： Gareth G. Hougham , Brian S. Beaman , John S. Corbin , Paul Coteus , Shawn A. Hall , Kathleen C. Hinge , Theron L. Lewis , Frank R. Libsch , Amanda E. E. Mikhail
IPC分类号： H01R9/00
CPC分类号： H05K3/368 , H01R12/52 , H01R12/714 , H05K1/0269 , H05K3/325 , H05K2201/10378 , Y10T29/49117 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149
摘要： LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces.
摘要翻译： LGA连接器采用预制到不同高度的按钮或弹簧触点制成，以适应特定产品类型的典型模块或PCB的初始形貌。这是通过测量第一电子装置和第二电子装置的配合表面的形貌来制造的; 制造内插器触点以形成具有用于接触配合表面的相应反向形状的相对非平面侧; 并且将所述插入件夹在所述第一和第二电子设备之间，所述相对侧与相应的配合表面相接触。

2. 发明申请

US20100173505A1 Topography compensating land grid array interposer 失效
标题翻译：地形补偿地面阵列插值器
公开(公告)号：US20100173505A1
公开(公告)日：2010-07-08
申请号：US12462985
申请日：2009-08-11
申请人： Gareth G. Hougham , Brian S. Beaman , John S. Corbin , Paul Coteus , Shawn A. Hall , Kathleen C. Hinge , Theron L. Lewis , Frank R. Libsch , Amanda E. E. Mikhail
发明人： Gareth G. Hougham , Brian S. Beaman , John S. Corbin , Paul Coteus , Shawn A. Hall , Kathleen C. Hinge , Theron L. Lewis , Frank R. Libsch , Amanda E. E. Mikhail
IPC分类号： H01R12/14 , H01R13/22 , H01R43/00
CPC分类号： H05K3/368 , H01R12/52 , H01R12/714 , H05K1/0269 , H05K3/325 , H05K2201/10378 , Y10T29/49117 , Y10T29/49144 , Y10T29/49147 , Y10T29/49149
摘要： LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating surfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography. For those LGAs made of metal springs, cantilevers, armatures and the like, the desired topography is imposed by shaping of the buttons during or after fabrication using a sizing die with the desired topography.
摘要翻译： LGA连接器采用预制到不同高度的按钮或弹簧触点制成，以适应特定产品类型的典型模块或PCB的初始形貌。这是通过测量第一电子装置和第二电子装置的配合表面的形貌来制造的; 制造内插器触点以形成具有用于接触配合表面的相应反向形状的相对非平面侧; 并且将所述插入件夹在所述第一和第二电子设备之间，所述相对侧与相应的配合表面相接触。对于通过成型技术（例如，Tyco Electronics MPI或Shin Etsu RP）或Metal-on-Elastomer型（IBM）的成型技术制造的LGA类型，使用具有所需形貌的模具提供所需的 LGA地形。对于由金属弹簧，悬臂，电枢等制成的那些LGAs，通过使用具有所需形状的尺寸模具在制造期间或之后使按钮成形来施加所需的形状。

3. 发明授权

US08278745B2 Through board stacking of multiple LGA-connected components 有权
标题翻译：通过板堆叠多个LGA连接的组件
公开(公告)号：US08278745B2
公开(公告)日：2012-10-02
申请号：US12543104
申请日：2009-08-18
申请人： Paul W. Coteus , Shawn A. Hall , Gareth G. Hougham , Alphonso P. Lanzetta , Rick A. Rand
发明人： Paul W. Coteus , Shawn A. Hall , Gareth G. Hougham , Alphonso P. Lanzetta , Rick A. Rand
IPC分类号： H01L23/52
CPC分类号： H05K3/325 , H05K2201/0314 , H05K2201/10545 , H05K2201/10719 , H05K2201/2018
摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
摘要翻译：提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

4. 发明申请

US20080054430A1 Through board stacking of multiple LGA-connected components 有权
标题翻译：通过板堆叠多个LGA连接的组件
公开(公告)号：US20080054430A1
公开(公告)日：2008-03-06
申请号：US11511815
申请日：2006-08-29
申请人： Paul W. Coteus , Shawn A. Hall , Gareth G. Hougham , Alphonso P. Lanzetta , Rick A. Rand
发明人： Paul W. Coteus , Shawn A. Hall , Gareth G. Hougham , Alphonso P. Lanzetta , Rick A. Rand
IPC分类号： H01L23/02
CPC分类号： H05K3/325 , H05K2201/0314 , H05K2201/10545 , H05K2201/10719 , H05K2201/2018
摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
摘要翻译：提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

5. 发明申请

US20090315168A1 THROUGH BOARD STACKING OF MULTIPLE LGA-CONNECTED COMPONENTS 有权
标题翻译：通过多个LGA连接组件的板堆栈
公开(公告)号：US20090315168A1
公开(公告)日：2009-12-24
申请号：US12543104
申请日：2009-08-18
申请人： Paul W. Coteus , Shawn A. Hall , Gareth G. Hougham , Alphonso P. Lanzetta , Rick A. Rand
发明人： Paul W. Coteus , Shawn A. Hall , Gareth G. Hougham , Alphonso P. Lanzetta , Rick A. Rand
IPC分类号： H01L23/52 , H01L21/50
CPC分类号： H05K3/325 , H05K2201/0314 , H05K2201/10545 , H05K2201/10719 , H05K2201/2018
摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.
摘要翻译：提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

6. 发明授权

US08174106B2 Through board stacking of multiple LGA-connected components 有权
公开(公告)号：US08174106B2
公开(公告)日：2012-05-08
申请号：US11511815
申请日：2006-08-29
申请人： Paul W. Coteus , Shawn A. Hall , Gareth G. Hougham , Alphonso P. Lanzetta , Rick A. Rand
发明人： Paul W. Coteus , Shawn A. Hall , Gareth G. Hougham , Alphonso P. Lanzetta , Rick A. Rand
IPC分类号： H01L23/02
CPC分类号： H05K3/325 , H05K2201/0314 , H05K2201/10545 , H05K2201/10719 , H05K2201/2018
摘要： A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

7. 发明申请

US20100314094A1 METHOD AND APPARATUS FOR SINGLE-LOOP TEMPERATURE CONTROL OF A COOLING METHOD 审中-公开
标题翻译：冷却方式单环温度控制方法与装置
公开(公告)号：US20100314094A1
公开(公告)日：2010-12-16
申请号：US12483542
申请日：2009-06-12
申请人： Shawn A. Hall
发明人： Shawn A. Hall
IPC分类号： G05D23/00 , F28F13/06 , F28F13/00 , G05D7/00
CPC分类号： G05D23/19 , F28D2021/0019 , F28F27/00
摘要： An apparatus for cooling N heat-producing devices, where AT is an integer no smaller than one, using a cooling fluid that may be supplied at a temperature below the dew-point temperature of ambient air. To avoid condensation on the heat-producing devices, the cold fluid is warmed, upstream of the heat-producing devices, to a temperature T0 that is above the dew-point. The warming is accomplished, in a heat exchanger, by the warm fluid returning from the heat-producing devices. The amount of warming is controlled by periodically measuring T0 as well as the N temperatures downstream of the N heat-producing devices, and sending these N+1 temperature measurements to a control element that implements a control algorithm whose purpose is to achieve a set-point value of T0 by regulating, via N control valves, the flow of fluid to the N heat-producing devices. Also provided is a method for cooling the N heat-pro during devices pursuant to the inventive apparatus by a temperature control over the cooling fluid.
摘要翻译：使用可以在低于环境空气的露点温度的温度下供给的冷却流体来冷却N为不小于1的整数的N个发热装置的装置。为了避免发热装置上的冷凝，将冷流体在发热装置的上游加热到高于露点的温度T0。在热交换器中，通过从发热装置返回的温热流体来实现升温。通过周期性地测量N个发热装置的T0和N温度来控制加热量，并且将这些N + 1温度测量值发送到实现控制算法的控制元件，该控制元件的目的是实现设定值，通过N个控制阀通过调节流向N个发热装置的流体的流量来调节T0的点值。还提供了一种通过对冷却流体进行温度控制来根据本发明的装置来冷却N热源的方法。

8. 发明申请

US20090173017A1 FIRE-CODE-COMPATIBLE, COLLAPSIBLE PARTITIONS TO PREVENT UNWANTED AIRFLOW BETWEEN COMPUTER-ROOM COLD AISLES AND HOT AISLES 有权
标题翻译：防火方法，可避免的分类，以防止计算机冷藏和热水之间的无人空气流
公开(公告)号：US20090173017A1
公开(公告)日：2009-07-09
申请号：US11969999
申请日：2008-01-07
申请人： Shawn A. Hall
发明人： Shawn A. Hall
IPC分类号： E04C2/00
CPC分类号： H05K7/20745 , A62C2/241 , A62C3/16
摘要： An arrangement for the cooling of computer data centers. More particularly, the arrangement eliminates the problems present in the uneven or inadequate cooling of computer racks due to unwanted airflows, which are encountered between so-called hot aisles and cold aisles present in a computer data center. Specifically, this problem is solved through the provision of partitions which, under normal circumstances, prevent the unwanted airflows by standing in a vertical orientation, yet which, in the event of a fire, collapse from the vertical orientation to a horizontal orientation, thereby avoiding interference with water sprays from sprinkler heads, and thus complying with fire codes and ordinances. Moreover, also employed is a method of preventing the unwanted air flows by utilization of the novel arrangement comprising the fire-code-compatible, collapsible partitions.
摘要翻译：一个用于冷却计算机数据中心的安排。更具体地，该布置消除了由于在计算机数据中心中存在的所谓热通道和冷通道之间遇到的不期望的气流而导致计算机机架的不均匀或不充分的冷却中存在的问题。具体地说，这个问题是通过提供这样的隔板得以解决的：在正常情况下，通过垂直方向站立来防止不需要的气流，而在发生火灾的情况下，从垂直方向到水平方向就会崩溃，从而避免干扰洒水头喷水，从而符合消防法规。此外，还采用了通过利用包括防火码兼容的可折叠隔板的新颖装置来防止不想要的空气流动的方法。

9. 发明申请

US20080123300A1 FOLDED-SHEET-METAL HEATSINKS FOR CLOSELY PACKAGED HEAT-PRODUCING DEVICES 失效
标题翻译：用于封闭热封装置的折叠式金属热源
公开(公告)号：US20080123300A1
公开(公告)日：2008-05-29
申请号：US11564353
申请日：2006-11-29
申请人： Shurong Tian , Shawn A. Hall , Paul W. Coteus
发明人： Shurong Tian , Shawn A. Hall , Paul W. Coteus
IPC分类号： H05K7/20
CPC分类号： H01L23/3672 , G11C5/04 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A folded heatsink for cooling heat-producing devices. The folded heatsink includes a substantially planar base having a first end and a second end. The base is intended to be affixed in thermal contact to an exposed, substantially planar surface of one or more heat-producing devices. The folded heatsink also includes two shoulders each having a proximal end and a distal end. The proximal ends of the shoulders project substantially at right angles from the first and second ends of the base. The folded heatsink also includes two arms each having a proximal end and a distal end. The proximal ends of the arms project substantially at right angles from the distal ends of the shoulders such that the base, shoulders and arms from a nearly closed rectangular tube formed from a continuous sheet of metal.
摘要翻译：用于冷却发热装置的折叠式散热器。折叠式散热器包括具有第一端和第二端的基本平坦的基座。底座旨在与一个或多个发热装置的暴露的，基本平坦的表面热接触地固定。折叠的散热器还包括两个肩部，每个肩部具有近端和远端。肩部的近端从基座的第一端和第二端基本成直角地突出。折叠的散热器还包括两个臂，每个臂具有近端和远端。臂的近端从肩部的远端基本上以直角突出，使得基部，肩部和臂从近似接近的矩形管由连续的金属片形成。

10. 发明授权

US5312224A Conical logarithmic spiral viscosity pump 失效
标题翻译：锥形对数螺旋粘度泵
公开(公告)号：US5312224A
公开(公告)日：1994-05-17
申请号：US30984
申请日：1993-03-12
申请人： John S. Batchelder , Shawn A. Hall , Robert R. Jackson
发明人： John S. Batchelder , Shawn A. Hall , Robert R. Jackson
IPC分类号： F04C2/00 , B29C47/38 , B29C47/60 , F04D3/02 , F04D29/18 , F04D3/00 , B23P15/00
CPC分类号： B29C47/6012 , B29C47/38 , F04D29/183 , F04D3/02 , B29C2045/465 , B29C47/0014 , B29C47/0023 , B29C47/60 , Y10T29/49236 , Y10T29/49245
摘要： A rotary viscosity pump is provided that has a housing and an impeller. The housing has a conical chamber with an outlet at a narrow end of the chamber. The impeller has a conical section with a logarithmic spiral groove along its exterior. The spacing between the housing and the impeller can have either a constant gap or a gap that decreases along the length of the impeller. The depth of the groove can be constant, increase, or decrease in depth along the length of the impeller.
摘要翻译：提供一种具有壳体和叶轮的旋转粘度泵。壳体具有在腔室的窄端处具有出口的锥形室。叶轮具有沿其外部的对数螺旋槽的圆锥形截面。壳体和叶轮之间的间隔可以具有沿叶轮的长度减小的恒定间隙或间隙。槽的深度可以沿叶轮的长度恒定，增加或减小。

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