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    • 6. 发明授权
    • ZnO film with C-axis orientation
    • 具有C轴取向的ZnO膜
    • US07597757B2
    • 2009-10-06
    • US11281033
    • 2005-11-17
    • John F. Conley, Jr.Yoshi Ono
    • John F. Conley, Jr.Yoshi Ono
    • C30B21/02
    • C30B25/02C30B29/16H01L41/0815H01L41/316H01L41/319
    • A ZnO film with a C-axis preference is provided with a corresponding fabrication method. The method includes: forming a substrate; forming an amorphous Al2O3 film overlying the substrate; and, forming a ZnO film overlying the Al2O3 film at a substrate temperature of about 170° C., having a C-axis preference responsive to the adjacent Al2O3 film. The substrate can be a material such as Silicon (Si) (100), Si (111), Si (110), quartz, glass, plastic, or zirconia. The Al2O3 film can be deposited using a chemical vapor deposition (CVD), atomic layer deposition (ALD), or sputtering process. Typically, the Al2O3 layer has a thickness in the range of about 3 to 15 nanometers (nm). The step of forming the ZnO film having a C-axis preference typically means that the ZnO film has a (002) peak at least 5 times greater than the (100) peak, as measured by X-ray diffraction (XRD).
    • 具有C轴偏好的ZnO膜具有相应的制造方法。 该方法包括:形成衬底; 在衬底上形成非晶Al2O3膜; 并且在约170℃的衬底温度下形成覆盖Al 2 O 3膜的ZnO膜,具有响应于相邻Al 2 O 3膜的C轴偏好。 衬底可以是诸如硅(Si)(100),Si(111),Si(110),石英,玻璃,塑料或氧化锆的材料。 可以使用化学气相沉积(CVD),原子层沉积(ALD)或溅射工艺来沉积Al 2 O 3膜。 通常,Al 2 O 3层的厚度在约3至15纳米(nm)的范围内。 形成具有C轴偏好的ZnO膜的步骤通常意味着通过X射线衍射(XRD)测量,ZnO膜具有比(100)峰的至少5倍的(002)峰。
    • 7. 发明授权
    • Nanotip electrode electroluminescence device with contoured phosphor layer
    • 具有成像荧光粉层的纳米技术电极电致发光器件
    • US07589464B2
    • 2009-09-15
    • US11070051
    • 2005-03-01
    • John F. Conley, Jr.David R. EvansWei GaoYoshi Ono
    • John F. Conley, Jr.David R. EvansWei GaoYoshi Ono
    • H05B33/26
    • H05B33/10B82Y20/00C09K11/54C09K11/642H01L33/18H05B33/14
    • A device and a fabrication method are provided for an EL device with a nanotip-contoured phosphor layer. The method comprises: forming a bottom electrode with nanotips; forming a phosphor layer overlying the bottom electrode, having irregularly-shaped top and bottom surfaces; and, forming a top electrode overlying the phosphor layer. The bottom electrode top surface has a nanotip contour, and the phosphor layer irregularly-shaped top and bottom surfaces have contours approximately matching the bottom electrode top surface nanotip contour. In one aspect, a contoured bottom dielectric is interposed between the bottom electrode and the phosphor layer, having top and bottoms surfaces with contours approximately matching the nanotip contour. Likewise, a top dielectric may be interposed between the top electrode and the phosphor layer, having a bottom surface with a contour approximately matching the contour of phosphor layer top surface.
    • 提供了一种具有纳米尺度荧光体层的EL器件的器件和制造方法。 该方法包括:形成具有纳米尖端的底部电极; 形成覆盖在底部电极上的荧光体层,具有不规则形状的顶部和底部表面; 并且形成覆盖磷光体层的顶部电极。 底部电极顶表面具有纳米尖端轮廓,并且荧光体层不规则形状的顶表面和底表面具有与底部电极顶表面纳米尖端轮廓近似匹配的轮廓。 在一个方面,在底部电极和荧光体层之间插入有轮廓的底部电介质,其具有顶部和底部表面,轮廓几乎与纳米尖端轮廓相匹配。 类似地,顶部电介质可以插入在顶部电极和荧光体层之间,具有大致与荧光体层顶表面的轮廓相匹配的轮廓的底面。
    • 9. 发明授权
    • Methods of forming a microlens array over a substrate employing a CMP stop
    • 在使用CMP停止的衬底上形成微透镜阵列的方法
    • US07029944B1
    • 2006-04-18
    • US10956789
    • 2004-09-30
    • John F. Conley, Jr.Yoshi OnoWei GaoDavid R. Evans
    • John F. Conley, Jr.Yoshi OnoWei GaoDavid R. Evans
    • H01L21/00
    • H01L21/31053H01L21/31133H01L27/14627H01L27/14685
    • A method of forming a microlens structure is provided along with a CCD array structure employing a microlens array. An embodiment of the method comprises providing a substrate having a surface with photo-elements on the surface; depositing a transparent material overlying the surface of the substrate; depositing a CMP stop overlying the transparent material; depositing a lens-shaping layer overlying the CMP stop layer; depositing and patterning a photoresist layer overlying the lens-shaping layer to form openings to expose the lens-shaping layer; introducing a first isotropic etchant into the openings and etching the lens-shaping layer where exposed to form initial lens shapes having a radius; stripping the photoresist; exposing the lens-shaping layer to a second isotropic etchant to increase the radius of the lens shapes; transferring the lens shape through the CMP stop layer into the transparent material using an anisotropic etch; and depositing a lens material overlying the transparent material, whereby the lens shapes are at least partially filled with lens material. Planarizing the lens material using CMP and stopping at the CMP stop layer.
    • 提供一种形成微透镜结构的方法以及采用微透镜阵列的CCD阵列结构。 该方法的一个实施例包括提供具有在表面上具有光元件的表面的基底; 沉积覆盖衬底表面的透明材料; 沉积覆盖透明材料的CMP停止点; 沉积覆盖CMP停止层的透镜成形层; 沉积和图案化覆盖透镜成形层的光致抗蚀剂层以形成露出透镜成形层的开口; 在开口中引入第一各向同性蚀刻剂并蚀刻暴露于其中形成具有半径的初始透镜形状的透镜成形层; 剥离光刻胶; 将透镜成形层暴露于第二各向同性蚀刻剂以增加透镜形状的半径; 使用各向异性蚀刻将透镜形状通过CMP停止层转移到透明材料中; 以及沉积覆盖透明材料的透镜材料,由此透镜形状至少部分地被透镜材料填充。 使用CMP对透镜材料进行平面化,并在CMP停止层处停止。