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    • 4. 发明申请
    • PIXEL SENSOR CELL FOR COLLECTING ELECTRONS AND HOLES
    • 用于收集电子和孔的像素传感器单元
    • US20070029581A1
    • 2007-02-08
    • US11161535
    • 2005-08-08
    • James AdkissonAndres BryantJohn Ellis-MonaghanMark JaffeJeffrey JohnsonAlain Loiseau
    • James AdkissonAndres BryantJohn Ellis-MonaghanMark JaffeJeffrey JohnsonAlain Loiseau
    • H01L27/148
    • H01L27/14603H01L27/14609H01L27/14689H01L31/035281
    • The present invention is a pixel sensor cell and method of making the same. The pixel sensor cell approximately doubles the available signal for a given quanta of light. The device of the present invention utilizes the holes produced by impinging photons in a pixel sensor cell circuit. A pixel sensor cell having reduced complexity includes an n-type collection well region formed beneath a surface of a substrate for collecting electrons generated by electromagnetic radiation impinging on the pixel sensor cell and a p-type collection well region formed beneath the surface of the substrate for collecting holes generated by the impinging photons. A circuit structure having a first input is coupled to the n-type collection well region and a second input is coupled to the p-type collection well region, wherein an output signal of the pixel sensor cell is the magnitude of the difference of a signal of the first input and a signal of the second input.
    • 本发明是像素传感器单元及其制造方法。 像素传感器单元对于给定的光量大约使可用信号加倍。 本发明的器件利用通过在像素传感器单元电路中照射光子而产生的空穴。 具有降低的复杂度的像素传感器单元包括形成在基板的表面下面的n型收集阱区域,用于收集由电子辐射照射在像素传感器单元上​​产生的电子以及形成在基板表面下方的p型收集阱区域 用于收集由撞击光子产生的孔。 具有第一输入的电路结构耦合到n型收集阱区域,而第二输入端耦合到p型收集阱区域,其中像素传感器单元的输出信号是信号的差值的大小 的第一输入和第二输入的信号。
    • 6. 发明申请
    • METHOD OF MANUFACTURING DUAL ORIENTATION WAFERS
    • 制造双取向波的方法
    • US20060286778A1
    • 2006-12-21
    • US11160365
    • 2005-06-21
    • Brent AndersonJohn Ellis-MonaghanAlain LoiseauKirk Peterson
    • Brent AndersonJohn Ellis-MonaghanAlain LoiseauKirk Peterson
    • H01L21/20
    • H01L21/823807H01L21/823878H01L21/8252
    • Disclosed is a method of manufacturing dual orientation wafers. A trench is formed in a multi-layer wafer to a silicon substrate with a first crystalline orientation. The trench is filled with a silicon material (e.g., amorphous silicon or polysilicon trench). Isolation structures are formed to isolate the silicon material in the trench from a semiconductor layer with a second crystalline orientation. Additional isolation structures are formed within the silicon material in the trench and within the semiconductor layer. A patterned amorphization process is performed on the silicon material in the trench and followed by a recrystallization anneal such that the silicon material in the trench recrystallizes with the same crystalline orientation as the silicon substrate. The resulting structure is a semiconductor wafer with isolated semiconductor areas on the same plane having different crystalline orientations as well as isolated sections within each semiconductor area for device formation.
    • 公开了制造双取向晶片的方法。 在多层晶片中形成具有第一晶体取向的硅衬底的沟槽。 沟槽填充有硅材料(例如,非晶硅或多晶硅沟槽)。 形成隔离结构以将沟槽中的硅材料与具有第二晶体取向的半导体层隔离。 另外的隔离结构形成在沟槽内和半导体层内的硅材料内。 对沟槽中的硅材料进行图案化非晶化处理,然后进行再结晶退火,使得沟槽中的硅材料以与硅衬底相同的结晶取向重结晶。 所得到的结构是在具有不同晶体取向的同一平面上的隔离半导体区域以及用于器件形成的每个半导体区域内的隔离部分的半导体晶片。
    • 7. 发明申请
    • METHOD OF MANUFACTURING DUAL ORIENTATION WAFERS
    • 制造双取向波的方法
    • US20080096370A1
    • 2008-04-24
    • US11955436
    • 2007-12-13
    • Brent AndersonJohn Ellis-MonaghanAlain LoiseauKirk Peterson
    • Brent AndersonJohn Ellis-MonaghanAlain LoiseauKirk Peterson
    • H01L21/20
    • H01L21/823807H01L21/823878H01L21/8252
    • Disclosed is a method of manufacturing dual orientation wafers. A trench is formed in a multi-layer wafer to a silicon substrate with a first crystalline orientation. The trench is filled with a silicon material (e.g., amorphous silicon or polysilicon trench). Isolation structures are formed to isolate the silicon material in the trench from a semiconductor layer with a second crystalline orientation. Additional isolation structures are formed within the silicon material in the trench and within the semiconductor layer. A patterned amorphization process is performed on the silicon material in the trench and followed by a recrystallization anneal such that the silicon material in the trench recrystallizes with the same crystalline orientation as the silicon substrate. The resulting structure is a semiconductor wafer with isolated semiconductor areas on the same plane having different crystalline orientations as well as isolated sections within each semiconductor area for device formation.
    • 公开了制造双取向晶片的方法。 在多层晶片中形成具有第一晶体取向的硅衬底的沟槽。 沟槽填充有硅材料(例如,非晶硅或多晶硅沟槽)。 形成隔离结构以将沟槽中的硅材料与具有第二晶体取向的半导体层隔离。 另外的隔离结构形成在沟槽内和半导体层内的硅材料内。 对沟槽中的硅材料进行图案化非晶化处理,然后进行再结晶退火,使得沟槽中的硅材料以与硅衬底相同的结晶取向重结晶。 所得到的结构是在具有不同晶体取向的同一平面上的隔离半导体区域以及用于器件形成的每个半导体区域内的隔离部分的半导体晶片。