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    • 5. 发明申请
    • Thin-layer light-emitting diode chip and method for the production thereof
    • 薄层发光二极管芯片及其制造方法
    • US20060237734A1
    • 2006-10-26
    • US10567935
    • 2004-08-19
    • Johannes BaurBerthold HahnVolker Harle
    • Johannes BaurBerthold HahnVolker Harle
    • H01L33/00
    • H01L33/44H01L33/22H01L33/405H01L2933/0083H01L2933/0091
    • A thin-layer LED chip (5) is claimed, comprising an epitaxial layer sequence (6) that is disposed on a carrier element (2) and contains an electromagnetic-radiation-generating active region (8), and a reflective layer (3) that is disposed on a principal surface of the epitaxial layer sequence (6) facing toward the carrier element (2) and reflects at least a portion of the electromagnetic radiation generated in the epitaxial layer sequence (6) back thereinto, in which a structured layer (1) containing a glass material is applied to a radiation extraction surface (7) of the epitaxial layer sequence (6) facing away from said carrier element (2) and has a structure that includes mutually adjacent protuberances (5) that taper in the direction away from the radiation extraction surface (7) and have a lateral grid size that is smaller than one wavelength of an electromagnetic radiation emitted from the epitaxial layer sequence (6). The structured layer (1) is advantageously applied as spin-on glass and structured by grayscale lithography.
    • 要求保护薄层LED芯片(5),其包括设置在载体元件(2)上并包含电磁辐射生成有源区(8)的外延层序列(6)和反射层 ),其设置在面向载体元件(2)的外延层序列(6)的主表面上,并将在外延层序列(6)中产生的电磁辐射的至少一部分反射回到其中,其中结构化 将包含玻璃材料的层(1)施加到外延层序列(6)的远离所述载体元件(2)的辐射提取表面(7)上,并且具有包括彼此相邻的突起(5)的结构, 离开辐射提取表面(7)的方向并且具有小于从外延层序列(6)发射的电磁辐射的一个波长的横向网格尺寸。 结构化层(1)有利地作为旋涂玻璃施加,并通过灰度平版印刷法构成。
    • 9. 发明授权
    • Method for fabricating at least one mesa or ridge structure or at least one electrically pumped region in a layer or layer sequence
    • 用于在层或层序列中制造至少一个台面或脊结构或至少一个电泵浦区域的方法
    • US07008810B2
    • 2006-03-07
    • US10804514
    • 2004-03-19
    • Christine HössAndreas WeimarAndreas LeberAlfred LellHelmut FischerVolker Harle
    • Christine HössAndreas WeimarAndreas LeberAlfred LellHelmut FischerVolker Harle
    • H01L21/00
    • H01L33/005H01S5/021H01S5/2081H01S5/22H01S5/2214H01S5/32341Y10S438/951
    • A method for fabricating at least one mesa or ridge structure in a layer or layer sequence, in which a sacrificial layer (4) is applied and patterned above the layer or layer sequence. A mask layer is applied and patterned above the sacrificial layer for definition of the mesa or ridge dimensions. The sacrificial layer (4) and of the layer or layer sequence are removed so that the mesa or ridge structure is formed in the layer or layer sequence. A part of the sacrificial layer (4) is selectively removed from the side areas thereof which have been uncovered in the previous step, so that a sacrificial layer remains which is narrower in comparison with a layer that has remained above the sacrificial layer as seen from the layer or layer sequence. A coating is applied at least to the sidewalls of the structure produced in the previous steps so that the side areas of the residual sacrificial layer are not completely overformed by the coating material. The sacrificial layer (4) is removed so that the layer that has remained above the sacrificial layer as seen from the layer or layer sequence is lifted off. A method is also disclosed for fabricating at least one gain-controlled laser diode in a layer sequence, in which method steps analogous to those described above are employed.
    • 一种用于在层或层序列中制造至少一个台面或脊状结构的方法,其中牺牲层(4)被施加并在层或层序列上形成图案。 掩模层被施加和图案化在牺牲层上方以定义台面或脊尺寸。 去除牺牲层(4)和层或层序列,使得台层或脊结构以层或层序列形成。 牺牲层(4)的一部分从其前面的步骤中未被覆盖的侧面区域选择性地去除,从而与牺牲层上方的层相比较,牺牲层保持较窄,如从 层或层序列。 至少将涂层施加到在前述步骤中制造的结构的侧壁上,使得残余牺牲层的侧面区域不会被涂层材料完全覆盖。 去除牺牲层(4),使得从层或层序列看到的保留在牺牲层上方的层被提升。 还公开了一种用于在层序列中制造至少一个增益控制的激光二极管的方法,其中采用与上述类似的方法步骤。
    • 10. 发明申请
    • Method for Production of a Radiation-Emitting Semiconductor Chip
    • 辐射发射半导体芯片的制造方法
    • US20080093611A1
    • 2008-04-24
    • US11579194
    • 2004-04-29
    • Berthold HahnStephan KaiserVolker Harle
    • Berthold HahnStephan KaiserVolker Harle
    • H01L21/04H01L33/00
    • H01L33/22H01L33/0079
    • A method for micropatterning a radiation-emitting surface of a semiconductor layer sequence for a thin-film light-emitting diode chip. The semiconductor layer sequence is grown on a substrate. A mirror layer is formed or applied on the semiconductor layer sequence, which reflects back into the semiconductor layer sequence at least part of a radiation that is generated in the semiconductor layer sequence during the operation thereof and is directed toward the mirror layer. The semiconductor layer sequence is separated from the substrate by means of a lift-off method, in which a separation zone in the semiconductor layer sequence is at least partly decomposed in such a way that anisotropic residues of a constituent of the separation zone, in particular a metallic constituent of the separation layer, remain at the separation surface of the semiconductor layer sequence, from which the substrate is separated. The separation surface—provided with the residues—of the semiconductor layer sequence with a dry etching method, a gaseous etchant or a wet-chemical etchant, wherein the anisotropic residues are at least temporarily used as an etching mask. A semiconductor chip is produced according to such a method.
    • 一种用于对薄膜发​​光二极管芯片的半导体层序列的辐射发射表面进行微图形化的方法。 半导体层序列在衬底上生长。 在半导体层序列上形成或施加镜层,其反射回到半导体层序列中,半导体层序列在其操作期间在半导体层序列中产生的辐射的至少一部分并且被指向镜层。 通过剥离方法将半导体层序列与衬底分离,其中半导体层序列中的分离区域至少部分地被分解,使得分离区的成分的各向异性残留物 分离层的金属成分保留在半导体层序列的分离表面,基板从该分离表面分离。 具有干蚀刻方法的半导体层序列的残留物的分离表面,气体蚀刻剂或湿化学蚀刻剂,其中各向异性残余物至少暂时用作蚀刻掩模。 根据这种方法制造半导体芯片。