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    • 3. 发明授权
    • 2T2C signal margin test mode using resistive element
    • 2T2C信号余量测试模式使用电阻元件
    • US06731554B1
    • 2004-05-04
    • US10301546
    • 2002-11-20
    • Michael JacobJoerg WohlfahrtThomas RoehrNobert Rehm
    • Michael JacobJoerg WohlfahrtThomas RoehrNobert Rehm
    • G11C2900
    • G11C29/50G11C11/22
    • The present invention provides a test mode section for facilitating a worst case product test sequence for signal margin to ensure full product functionality over the entire component lifetime taking all aging effects into account. A semiconductor memory test mode configuration includes a first capacitor for storing digital data connecting a cell plate line to a first bit line through a first select transistor. The first select transistor is activated through a connection to a word line. A second capacitor stores digital data and connects the cell plate line to a second bit line through a second select transistor. The second select transistor is activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines for measuring a differential read signal on the first and second bit lines A resistor is connected to one or both of the bit lines through transistors for adding or reducing the amount of charge on the first bit line when the third transistor is turned on to reduce the differential read signal.
    • 本发明提供了一种测试模式部分,用于促进针对信号余量的最坏情况产品测试序列,以确保在整个组件寿命期间的全部产品功能,同时考虑所有的老化效应。 半导体存储器测试模式配置包括:第一电容器,用于存储通过第一选择晶体管将单元板线连接到第一位线的数字数据。 第一个选择晶体管通过与字线的连接来激活。 第二电容器存储数字数据,并通过第二选择晶体管将单元板线连接到第二位线。 通过与字线的连接激活第二选择晶体管。 读出放大器连接到第一和第二位线,用于测量第一和第二位线上的差分读取信号。电阻器通过晶体管连接到一个或两个位线,用于增加或减少第一和第二位线上的电荷量 当第三晶体管导通时减小差分读取信号的位线。
    • 7. 发明授权
    • 2T2C signal margin test mode using a defined charge and discharge of BL and /BL
    • 2T2C信号余量测试模式使用BL和/ BL定义充放电
    • US06826099B2
    • 2004-11-30
    • US10301529
    • 2002-11-20
    • Hans-Oliver JoachimThomas RoehrJoerg Wohlfahrt
    • Hans-Oliver JoachimThomas RoehrJoerg Wohlfahrt
    • G11C700
    • G11C29/50G11C11/22
    • A semiconductor memory test mode configuration includes a first capacitor for storing digital data. The first capacitor connects a cell plate line to a first bit line through a first select transistor which is activated through a connection to a word line. A second capacitor for storing digital data connects the cell plate line to a second bit line through a second select transistor which is also activated through a connection to the word line. A sense amplifier is connected to the first and second bit lines for measuring a differential read signal on the first and second bit lines. A constant current mover, for example a constant current sink or source, is connected to the first bit line through a third transistor for changing the amount of charge on the first bit line when the third transistor is turned on to reduce the differential read signal.
    • 半导体存储器测试模式配置包括用于存储数字数据的第一电容器。 第一电容器通过第一选择晶体管将单元板线连接到第一位线,该第一选择晶体管通过与字线的连接被激活。 用于存储数字数据的第二电容器通过第二选择晶体管将单元板线连接到第二位线,第二选择晶体管也通过与字线的连接而被激活。 感测放大器连接到第一和第二位线,用于测量第一和第二位线上的差分读取信号。 恒定电流移动器,例如恒定电流吸收器或源极,通过第三晶体管连接到第一位线,用于当第三晶体管导通时改变第一位线上的电荷量,以减小差分读取信号。
    • 8. 发明授权
    • Flexible redundancy for memories
    • 灵活的存储冗余
    • US06687171B2
    • 2004-02-03
    • US10133919
    • 2002-04-26
    • Norbert RehmThomas Roehr
    • Norbert RehmThomas Roehr
    • G11C700
    • G11C29/808G11C11/22
    • An improved redundancy scheme for a memory matrix is disclosed. The memory matrix a plurality of memory cells interconnected in first and second directions. The memory cells are grouped into memory elements. A redundant memory element having a plurality of redundant memory cells is provided. The redundant memory element is segmented into R sections in the first direction, wherein R is a whole number greater to or equal to 2. By segmenting the redundant element into R sections, it can be used to repair defects in up to R different memory elements.
    • 公开了一种用于存储器矩阵的改进的冗余方案。 所述存储矩阵是在第一和第二方向上互连的多个存储单元。 存储单元被分组成存储元件。 提供具有多个冗余存储单元的冗余存储元件。 冗余存储器元件在第一方向被分割成R部分,其中R是大于或等于2的整数。通过将冗余元件分割成R部分,其可用于修复多达R个不同存储元件的缺陷 。