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1. 发明申请

US20110161478A1 SOCIAL WEB OF OBJECTS 有权
标题翻译：社会网络对象
公开(公告)号：US20110161478A1
公开(公告)日：2011-06-30
申请号：US12782134
申请日：2010-05-18
申请人： Joakim Formo , Andreas Fasbender , Marcus Gårdman , Takeshi Matsumura
发明人： Joakim Formo , Andreas Fasbender , Marcus Gårdman , Takeshi Matsumura
IPC分类号： G06F15/173
CPC分类号： H04L63/105 , H04L67/12 , H04L67/30 , H04L67/303 , H04L67/306 , H04L67/327 , H04W4/08 , H04W4/21 , H04W4/70
摘要： According to exemplary embodiments, networked object management software, devices, systems and methods are described which use social mapping principles to streamline interactions between users and their networked objects, as well as between the networked objects themselves. Friendship relationships are established, by a network management system, between a plurality of the networked objects, each of the plurality of networked objects being associated with a use. When the network management system receives a task request, it can then assign the requested task to one of the plurality of networked objects which has a capability to perform the requested task and which also has an established friendship relationship with the user.
摘要翻译：根据示例性实施例，描述了网络对象管理软件，设备，系统和方法，其使用社交映射原理来简化用户及其联网对象之间以及网络对象本身之间的交互。通过网络管理系统在多个网络对象之间建立友谊关系，所述多个联网对象中的每一个与使用相关联。当网络管理系统接收到任务请求时，它可以将所请求的任务分配给具有执行请求的任务的能力的多个联网对象中的一个，并且还具有与用户建立的友谊关系。

2. 发明授权

US09491181B2 Social web of objects 有权
标题翻译：物体的社交网
公开(公告)号：US09491181B2
公开(公告)日：2016-11-08
申请号：US12782134
申请日：2010-05-18
申请人： Joakim Formo , Andreas Fasbender , Marcus Gårdman , Takeshi Matsumura
发明人： Joakim Formo , Andreas Fasbender , Marcus Gårdman , Takeshi Matsumura
IPC分类号： G06F15/173 , H04L29/06 , H04L29/08 , H04W4/00 , H04W4/08 , H04W4/20
CPC分类号： H04L63/105 , H04L67/12 , H04L67/30 , H04L67/303 , H04L67/306 , H04L67/327 , H04W4/08 , H04W4/21 , H04W4/70
摘要： According to exemplary embodiments, networked object management software, devices, systems and methods are described which use social mapping principles to streamline interactions between users and their networked objects, as well as between the networked objects themselves. Friendship relationships are established, by a network management system, between a plurality of the networked objects, each of the plurality of networked objects being associated with a use. When the network management system receives a task request, it can then assign the requested task to one of the plurality of networked objects which has a capability to perform the requested task and which also has an established friendship relationship with the user.
摘要翻译：根据示例性实施例，描述了网络对象管理软件，设备，系统和方法，其使用社交映射原理来简化用户及其联网对象之间以及网络对象本身之间的交互。通过网络管理系统在多个网络对象之间建立友谊关系，所述多个联网对象中的每一个与使用相关联。当网络管理系统接收到任务请求时，它可以将所请求的任务分配给具有执行请求的任务的能力的多个联网对象中的一个，并且还具有与用户建立的友谊关系。

3. 发明授权

US09177425B2 Vehicle data analysis apparatus, vehicle data analysis method, and defect diagnosis apparatus 有权
标题翻译：车辆数据分析装置，车辆数据分析方法和缺陷诊断装置
公开(公告)号：US09177425B2
公开(公告)日：2015-11-03
申请号：US14005838
申请日：2012-03-19
申请人： Hideaki Suganuma , Takeshi Matsumura , Toshiro Hikita
发明人： Hideaki Suganuma , Takeshi Matsumura , Toshiro Hikita
IPC分类号： G07C5/00 , G06F15/00 , G05B23/02
CPC分类号： G07C5/00 , G05B23/0221 , G06F15/00
摘要： A vehicle data analysis apparatus analyzes vehicle data that indicates chronological change of a vehicle state. The vehicle data analysis apparatus is provided with a computing unit and a recognition unit. The computing unit is configured to make obvious data fluctuation accompanying the development, in the vehicle data, of mechanical or control-related fault in a vehicle control system. The recognition unit is configured to recognize the vehicle data to be considered during vehicle fault diagnosis on the basis of a result of computation by the computing unit.
摘要翻译：车辆数据分析装置分析指示车辆状态的时间变化的车辆数据。车辆数据分析装置具有计算单元和识别单元。计算单元被配置为伴随车辆控制系统中的机械或控制相关故障的车辆数据的开发中的明显的数据波动。识别单元被配置为基于计算单元的计算结果来识别在车辆故障诊断期间要考虑的车辆数据。

4. 发明授权

US09154487B2 Registration server, gateway apparatus and method for providing a secret value to devices 有权
标题翻译：注册服务器，网关设备和用于向设备提供秘密值的方法
公开(公告)号：US09154487B2
公开(公告)日：2015-10-06
申请号：US13883233
申请日：2010-11-05
申请人： Shingo Murakami , Johan Hjelm , Takeshi Matsumura , Toshikane Oda , Kenta Yasukawa
发明人： Shingo Murakami , Johan Hjelm , Takeshi Matsumura , Toshikane Oda , Kenta Yasukawa
IPC分类号： H04L29/06
CPC分类号： H04L63/08 , H04L63/0281 , H04L63/062 , H04L63/0807 , H04W12/04
摘要： The present invention relates to auto-provisioning of authentication data for client devices. A registration server includes a gateway determination unit, which is configured to determine a gateway apparatus transferring a request signal from a device, and a processing unit. The processing unit is configured to transmit a first signal including a token and first access information of the gateway apparatus to the device if an identifier of the gateway apparatus is stored on the server, and to transmit a second signal indicating a positive response to the gateway apparatus when it obtains the token and the identifier based on a third signal received in response to the first signal. The gateway apparatus sends the secret value to the device when it receives the second signal.
摘要翻译：本发明涉及自动提供客户端设备的认证数据。注册服务器包括网关确定单元，其被配置为确定从设备传送请求信号的网关装置和处理单元。处理单元被配置为如果网关装置的标识符存储在服务器上，则将包括令牌的第一信号和网关装置的第一访问信息发送到设备，并且向网关发送指示肯定响应的第二信号当其基于响应于第一信号接收的第三信号获得令牌和标识符时的装置。当接收到第二信号时，网关装置向设备发送秘密值。

5. 发明授权

US09153556B2 Adhesive sheet for manufacturing semiconductor device, manufacturing method of semiconductor device using the sheet, and semiconductor device obtained by the method 有权
标题翻译：用于制造半导体器件的粘合片，使用该片的半导体器件的制造方法以及通过该方法获得的半导体器件
公开(公告)号：US09153556B2
公开(公告)日：2015-10-06
申请号：US12759470
申请日：2010-04-13
申请人： Takeshi Matsumura , Sadahito Misumi , Kazuhito Hosokawa , Hiroyuki Kondo
发明人： Takeshi Matsumura , Sadahito Misumi , Kazuhito Hosokawa , Hiroyuki Kondo
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50 , H01L21/00 , H01L23/00 , H01L23/31 , H01L25/065 , H01L25/00
CPC分类号： H01L24/83 , H01L23/3121 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/98 , H01L25/0657 , H01L25/50 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29318 , H01L2224/29324 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29371 , H01L2224/29386 , H01L2224/29393 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/73265 , H01L2224/83191 , H01L2224/83192 , H01L2224/83855 , H01L2224/8388 , H01L2224/83885 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L2225/0651 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/3011 , H01L2924/0635 , H01L2924/066 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2924/05442 , H01L2924/05432 , H01L2924/0532 , H01L2924/04642 , H01L2924/05042 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The adhesive sheet for manufacturing a semiconductor device is an adhesive sheet for manufacturing a semiconductor device used when a semiconductor element is adhered to an adherend and the semiconductor element is wire-bonded, and is a peelable adhesive sheet in which the 180 degree peeling adhesive strength against a silicon wafer is 5 (N/25 mm width) or less.
摘要翻译：用于制造半导体器件的粘合片是用于制造半导体器件的粘合片，当将半导体元件粘合到被粘物并且半导体元件被引线接合时使用，并且是可剥离的粘合片，其中180度剥离粘合强度相对于硅晶片为5（N / 25mm宽）或更小。

6. 发明授权

US08845538B2 Ultrasonic diagnostic apparatus 有权
标题翻译：超声波诊断仪
公开(公告)号：US08845538B2
公开(公告)日：2014-09-30
申请号：US12989546
申请日：2009-04-14
申请人： Takeshi Matsumura
发明人： Takeshi Matsumura
IPC分类号： A61B8/00 , A61B5/00 , A61B8/08 , A61B8/13 , A61B8/06
CPC分类号： A61B8/485 , A61B5/6843 , A61B8/06 , A61B8/13 , A61B8/4281 , A61B8/488
摘要： The invention was made to simplify the operation relating to the detection of an absolute pressure applied to a test body by an ultrasonic probe and thereby to enhance usability. The fact that an elastic coupler has been attached to the ultrasonic wave transmitter/receiver surface and the fact that the elastic coupler is in an initial state with no pressure are detected (S2, S3), an initial thickness of the elastic coupler in the initial state is obtained (S6), the fact that the elastic coupler is in the pressurized state is detected based on the disappearance of a multiple echo which is included in an RF signal and caused due to the elastic coupler, the thickness of the elastic coupler in the pressurized state is obtained by detecting the boundary between the test body and the elastic coupler in the pressurized state, the thickness change is obtained based on the thickness in the pressurized state and the initial thickness (S7), and the absolute pressure applied to the test object is evaluated based on the thickness change and the pre-set elasticity property of the elastic coupler (S8).
摘要翻译：本发明是为了简化与通过超声波探头对被检体施加的绝对压力的检测相关的操作，从而提高了可用性。检测到弹性耦合器已经附着到超声波发射器/接收器表面以及弹性耦合器处于初始状态而没有压力的事实（S2，S3），初始的弹性耦合器的初始厚度获得状态（S6），弹性耦合器处于加压状态的事实是基于包含在RF信号中并由弹性耦合器引起的多重回波的消失，弹性耦合器的厚度通过在加压状态下检测试验体与弹性联轴器之间的边界来获得加压状态，基于加压状态下的厚度和初始厚度（S7）获得厚度变化，并且施加到基于弹性联轴器的厚度变化和预设弹性特性来评价试验对象（S8）。

7. 发明授权

US08704382B2 Film for flip chip type semiconductor back surface 有权
标题翻译：倒装芯片型半导体背面薄膜
公开(公告)号：US08704382B2
公开(公告)日：2014-04-22
申请号：US12975893
申请日：2010-12-22
申请人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
发明人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L21/6836 , H01L21/561 , H01L23/3164 , H01L23/544 , H01L24/81 , H01L2221/68327 , H01L2221/68377 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/73204 , H01L2224/8101 , H01L2224/81193 , H01L2224/81203 , H01L2224/814 , H01L2224/831 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01079 , H01L2924/3025 , Y10T428/28 , H01L2924/014 , H01L2924/01082 , H01L2924/01047 , H01L2924/01029 , H01L2924/0103 , H01L2924/01083 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has a light transmittance of 40% or more in terms of a light having a wavelength of 532 nm and the laser marking layer has a light transmittance of less than 40% in terms of a light having a wavelength of 532 nm.
摘要翻译：本发明提供了一种用于倒装芯片型半导体背表面的薄膜，其将形成在连接在被粘物上的半导体元件倒装芯片的背面上，该薄膜包括晶片粘合层和激光标记层，其中晶片粘合层的波长为532nm的光的透光率为40％以上，激光标记层的波长为532nm的光的透光率为40％以下。

8. 发明授权

US08692389B2 Dicing tape-integrated film for semiconductor back surface 有权
标题翻译：用于半导体背面的切割胶带一体化膜
公开(公告)号：US08692389B2
公开(公告)日：2014-04-08
申请号：US12976112
申请日：2010-12-22
申请人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
发明人： Naohide Takamoto , Takeshi Matsumura , Goji Shiga
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L23/562 , H01L21/6836 , H01L21/78 , H01L23/3164 , H01L23/544 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/81 , H01L2221/68377 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16221 , H01L2224/274 , H01L2224/73204 , H01L2224/81007 , H01L2224/81097 , H01L2224/81193 , H01L2224/814 , H01L2224/81815 , H01L2224/831 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01029 , H01L2924/01046 , H01L2924/01079 , H01L2924/12042 , H01L2924/15787 , H01L2924/15788 , H01L2924/3025 , Y10T428/1476 , Y10T428/28 , H01L2924/01082 , H01L2924/01047 , H01L2924/0103 , H01L2924/01083 , H01L2924/00014 , H01L2924/014 , H01L2924/3512 , H01L2924/00
摘要： The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm.
摘要翻译：本发明提供一种半导体背面用切割带一体膜，其特征在于，包括：基材的切割带和设置在基材上的粘合剂层; 以及设置在压敏粘合剂层上的倒装芯片型半导体背面的膜，其中压敏粘合剂层之间的剥离力（温度：23℃，剥离角度：180°，拉伸速度：300mm / min）切割带的粘合剂层和倒装芯片型半导体背面的膜的厚度为0.05N / 20mm至1.5N / 20mm。

9. 发明授权

US08671178B2 Information processing system and method providing a remote access 有权
标题翻译：提供远程访问的信息处理系统和方法
公开(公告)号：US08671178B2
公开(公告)日：2014-03-11
申请号：US13380260
申请日：2009-06-30
申请人： Martin Gerdes , Takeshi Matsumura , Toshikane Oda , Kenta Yasukawa
发明人： Martin Gerdes , Takeshi Matsumura , Toshikane Oda , Kenta Yasukawa
IPC分类号： G06F15/173
CPC分类号： H04L61/2528 , G06F9/54 , H04L65/1016 , H04L67/2895
摘要： An information processing system for offering a remote access from a device to a virtual service provided in a local network is provided. The virtual service invokes native services provisioned by a service provider. The system comprising: a management unit managing service information specifying a shortcut component of the service; an obtaining unit obtaining a request for the virtual service from the device; a receiving unit receiving the service information from the management unit; a specification unit specifying a shortcut component for the requested virtual service based on the received service information; an invoking unit executing the specified shortcut component by invoking native services to the service provider, and transferring the other component of the requested virtual service to the local network; a combination unit combining results; and a response unit responding the combined result to the device.
摘要翻译：提供一种用于提供从设备到本地网络中提供的虚拟服务的远程访问的信息处理系统。虚拟服务调用由服务提供商提供的本机服务。该系统包括：管理单元，管理指定虚拟服务的快捷部件的服务信息; 获取单元，从所述设备获得对所述虚拟服务的请求; 从所述管理单元接收所述服务信息的接收单元; 指定单元，基于所接收的服务信息指定所请求的虚拟服务的快捷组件; 调用单元通过向服务提供者调用本地服务来执行指定的快捷方式组件，并将所请求的虚拟服务的其他组件传送到本地网络; 结合组合单位; 以及响应单元将组合的结果响应到设备。

10. 发明授权

US08617575B2 Methods for conferring immunity against protozoans in an animal 有权
标题翻译：赋予动物免疫原生动物的方法
公开(公告)号：US08617575B2
公开(公告)日：2013-12-31
申请号：US11597879
申请日：2005-05-30
申请人： Akira Ito , Toru Gotanda , Shigeki Kobayashi , Katsumi Kume , Takeshi Matsumura
发明人： Akira Ito , Toru Gotanda , Shigeki Kobayashi , Katsumi Kume , Takeshi Matsumura
IPC分类号： A61K39/00 , A61K39/002 , C12N1/20 , C12N15/00 , C12N15/82 , C12N15/30 , C07K14/00 , A01H5/00
CPC分类号： C07K14/44 , A61K39/015 , A61K2039/542 , C12N15/8258
摘要： Immunity against protozoan is conferred on an animal by a method comprising orally administering to an animal a transformed plant cell comprising a polynucleotide encoding a protective antigen against protozoiasis development, a transformed plant or its progeny or clone comprising the transformed cell, a propagation material of the plant or its progeny or clone, a processed material or extract of the above cell, plant, or its progeny or clone, or propagation material, or a protective antigen against protozoiasis development isolated from the transformed plant cell or the transformed plant or its progeny or clone.
摘要翻译：通过包括向动物口服施用包含编码抗原虫病发展的保护性抗原的多核苷酸的转化植物细胞，包含转化细胞的转化植物或其后代或克隆，包含转化细胞的繁殖材料的方法赋予动物免疫力植物或其后代或克隆，上述细胞，植物或其后代或克隆或繁殖材料的处理材料或提取物，或抗原原生动物发育的保护性抗原，其从转化的植物细胞或转化的植物或其后代分离，或克隆。

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