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    • 10. 发明授权
    • Method of manufacturing an organic electroluminescent device with an encapsulating substrate
    • 制造具有封装基板的有机电致发光器件的方法
    • US07648405B2
    • 2010-01-19
    • US11109684
    • 2005-04-20
    • Dong-Soo ChoiSeung-Yong SongJin-Woo Park
    • Dong-Soo ChoiSeung-Yong SongJin-Woo Park
    • H01J9/24
    • H01L51/5259H01L51/5246
    • A method of manufacturing an organic electroluminescence device whereby an encapsulating layer is formed by coating an encapsulating substrate with an encapsulating layer-forming composition and thermally processing the encapsulating substrate. A plasma treatment is performed on the encapsulating substrate having the encapsulating layer. A sealant is applied to at least one of the plasma treated encapsulating substrate and a substrate on which an organic electroluminescent unit including a first electrode, an organic layer, and a second electrode, which are sequentially stacked, is deposited. The sealing substrate and the substrate on which the organic electroluminescent unit is deposited are combined. Contaminants generated around the encapsulating layer and generated in the thermal process can be effectively removed by the cleaning process using plasma. Therefore, the interfacial adhesion between the sealant and the substrate is greatly improved, thereby preventing permeation of external air, moisture, etc., into the device.
    • 一种制造有机电致发光器件的方法,其中通过用封装层形成组合物涂覆封装衬底并热封处理封装衬底而形成封装层。 对具有封装层的封装基板进行等离子体处理。 将密封剂施加到等离子体处理的封装基板和依次堆叠有包括第一电极,有机层和第二电极的有机电致发光单元的基板上的至少一个。 密封基板和其上沉积有机电致发光单元的基板组合。 通过使用等离子体的清洗处理可以有效地去除在封装层周围产生的并且在热处理中产生的污染物。 因此,密封剂和基材之间的界面粘合性大大提高,从而防止外部空气,水分等渗透到装置中。