专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20090202241A1 Optical Communication System And Method For Distributing Content Aboard A Mobile Platform During Travel 审中-公开
标题翻译：光通信系统及其在移动平台上分发内容的方法
公开(公告)号：US20090202241A1
公开(公告)日：2009-08-13
申请号：US12367406
申请日：2009-02-06
申请人： Jin Yu , Randy K. Schwarz
发明人： Jin Yu , Randy K. Schwarz
IPC分类号： H04J14/00
CPC分类号： H04J3/1694 , H04B10/27 , H04J14/0226 , H04J14/0238 , H04J14/0252 , H04J14/0279 , H04J14/028 , H04J14/0282 , H04J14/0283 , H04J14/0284 , H04J2203/0067
摘要： An optical distribution system for vehicle information systems installed aboard passenger vehicles, such as automobiles and aircraft, and methods for manufacturing and using same. Each system resource of the vehicle information system couples with the optical distribution system via an optical transceiver system. The optical transceiver systems provide a link interface between the system resources and the optical distribution system for supporting the transmission and reception of optical communication signals among the system resources via the optical distribution system. The optical distribution system couples the system resources via fiber optic communication connections that can support high data transfer rates. Being light weight, compact, and requiring little, if any, electrical power, the optical distribution system advantageously supports full communications among the system resources of the vehicle information system, while reducing the costs of operating and transporting the vehicle information system aboard the passenger vehicle.
摘要翻译：用于车载信息系统的光分配系统，其安装在诸如汽车和飞机的客车上，以及制造和使用它们的方法。车辆信息系统的每个系统资源经由光收发器系统与光分配系统耦合。光收发器系统在系统资源和光分配系统之间提供链路接口，用于经由光分配系统支持系统资源之间的光通信信号的发送和接收。光分配系统通过可支持高数据传输速率的光纤通信连接来耦合系统资源。光分配系统的重量轻，紧凑，并且需要很少（如果有的话）电力，有利地支持车辆信息系统的系统资源之间的完全通信，同时降低在乘客车辆上操作和运输车辆信息系统的成本。

2. 发明申请

US20100240174A1 Via Using Zn or Zn Alloys and Its Making Method, 3D Chip Stack Packages Using Thereof 审中-公开
标题翻译：通过使用Zn或Zn合金及其制备方法，使用它的3D芯片堆叠封装
公开(公告)号：US20100240174A1
公开(公告)日：2010-09-23
申请号：US12680760
申请日：2007-12-04
申请人： Jin Yu , Young-Kun Jee
发明人： Jin Yu , Young-Kun Jee
IPC分类号： H01L21/768 , H01L21/50
CPC分类号： H01L21/768 , H01L21/76898 , H01L24/11 , H01L24/12 , H01L25/0657 , H01L25/50 , H01L2224/05573 , H01L2224/13025 , H01L2224/16 , H01L2225/06513 , H01L2225/06541 , H01L2924/01078 , H01L2924/01079 , H01L2924/01327 , H01L2924/10253 , H01L2924/00
摘要： Disclosed are via, a method for formation of via using zinc and zinc alloys, and a process for fabrication of three-dimensional multiple chip stack packages by using the same. In lamination of three-dimensional chips, the chips with reduced defects are rapidly formed by the steps of: punching each of the chips to form a via hole used for a circuit wiring between the chips; depositing a seed layer on an inside of the via hole; forming a plated layer inside the via hole by using Zn and Zn alloys through an electroplating process; removing oxide film from surface of the plated layer; and heat treating the via hole at a temperature of more than melting point of the Zn and Zn alloys. Particularly, the chip having Zn via formed according to the present invention has an advantage of simultaneously overcoming problems in establishment of processing parameters caused by Cu via (e.g., plating mode, current density, influence of additives, pore formation, etc.), problems in successive processes caused by Sn (and other low melting point metals) via (e.g., soldering, chip stack, etc.) and difficulty in mechanical reliability of the process. Additionally, when stacking multiple chips with various functions in the three-dimensional chip stack package, the package can be simply fabricated by controlling contents of constitutional elements in Zn alloy via which has specific thermal properties (such as melting point, thermal expansion coefficient, etc.) suitable for processing temperature of each of the chips.
摘要翻译：公开了通过使用锌和锌合金形成通孔的方法，以及使用该方法制造三维多芯片堆叠封装的方法。在三维芯片的层叠中，通过以下步骤快速形成具有减少的缺陷的芯片：冲压每个芯片以形成用于芯片之间的电路布线的通孔; 在所述通孔的内部沉积种子层; 通过使用Zn和Zn合金通过电镀工艺在通孔内形成镀层; 从镀层的表面去除氧化膜; 并在Zn和Zn合金的熔点以上的温度下对通孔进行热处理。特别地，具有根据本发明形成的Zn通孔的芯片具有同时克服由Cu通孔（例如电镀模式，电流密度，添加剂的影响，孔形成等）引起的加工参数建立中的问题的优点，问题在由Sn（和其他低熔点金属）经由（例如，焊接，芯片堆叠等）引起的连续工艺中以及该工艺的机械可靠性困难。此外，当在三维芯片堆叠封装中堆叠具有各种功能的多个芯片时，可以通过控制具有特定热性能（如熔点，热膨胀系数等）的Zn合金中的组成元素的内容物来简单地制造封装。）适合每个芯片的处理温度。

3. 发明申请

US20070298620A1 SURFACE TREATMENT, SORTING AND ASSEMBLING METHODS OF MICROELECTRONIC DEVICES AND STORAGE STRUCTURE THEREOF 审中-公开
标题翻译：微电子器件的表面处理，分选和组装方法及其存储结构
公开(公告)号：US20070298620A1
公开(公告)日：2007-12-27
申请号：US11309142
申请日：2006-06-27
申请人： Kuang-Yeh Chang , Jin Yu
发明人： Kuang-Yeh Chang , Jin Yu
IPC分类号： H01L21/31
CPC分类号： H01L24/02 , H01L22/14 , H01L2924/01006 , H01L2924/01033 , H01L2924/3025
摘要： A storage structure for a microelectronic device including a chip which has completed all back-end-of-line (BEOL) processes and a solvent dissolvable polymer layer covering the surface of the chip. Since the surface of the chip is isolated from the external environment by the solvent dissolvable polymer layer, corrosion, discoloring or delamination of the chip can be avoided.
摘要翻译：一种微电子器件的存储结构，包括已经完成了所有后端（BEOL）工艺的芯片和覆盖芯片表面的溶剂可溶性聚合物层。由于芯片的表面通过溶剂可溶性聚合物层与外部环境隔离，因此可以避免芯片的腐蚀，变色或分层。

4. 发明申请

US20060285460A1 Method of managing optimum power control data in lead-in zone of high-density optical disc 审中-公开
标题翻译：管理高密度光盘导入区最佳功率控制数据的方法
公开(公告)号：US20060285460A1
公开(公告)日：2006-12-21
申请号：US11370881
申请日：2006-03-09
申请人： Jin Yu , Otsuka Tatsuhiro , Jong Ko , Ji Baek
发明人： Jin Yu , Otsuka Tatsuhiro , Jong Ko , Ji Baek
IPC分类号： G11B20/10 , G11B7/12
CPC分类号： G11B20/1217 , G11B7/00736 , G11B7/1267 , G11B2020/1275 , G11B2020/1297 , G11B2220/216
摘要： A method of managing optimum power control (OPC) data in a lead-in zone of a rewritable high-density optical disc, wherein an OPC back data zone is allocated in the lead-in zone of the rewritable high-density optical disc and OPC data is written in the OPC back data zone so that a subsequent OPC process can be immediately performed based on the written OPC data. The method includes allocating a specified zone used in performing an OPC process within the lead-in zone of the rewritable high-density optical disc, writing OPC data for the OPC process in the specified zone, reading the OPC data written in the specified zone, and performing the OPC process based on the read OPC data.
摘要翻译：一种在可重写高密度光盘的导入区域中管理最佳功率控制（OPC）数据的方法，其中OPC可重写数据区被分配在可重写高密度光盘和OPC的导入区中将数据写入OPC back数据区，以便可以基于写入的OPC数据立即执行后续OPC过程。该方法包括在可重写高密度光盘的导入区中分配用于执行OPC处理的指定区域，在指定区域中写入用于OPC处理的OPC数据，读取写入指定区域中的OPC数据，并根据读取的OPC数据执行OPC过程。

5. 发明授权

US09408556B2 Integrated analysis device for simultaneously detecting EBCs and VOCs in human exhaled breath 有权
标题翻译：用于同时检测人呼气中的EBC和VOC的综合分析装置
公开(公告)号：US09408556B2
公开(公告)日：2016-08-09
申请号：US13990007
申请日：2010-12-01
申请人： Ping Wang , Di Wang , Le Wang , Jin Yu , Kai Yu , Yishan Wang , Lin Wang , Cong Zhao
发明人： Ping Wang , Di Wang , Le Wang , Jin Yu , Kai Yu , Yishan Wang , Lin Wang , Cong Zhao
IPC分类号： A61B5/08 , G01N33/00 , G01N33/497 , A61B5/097
CPC分类号： A61B5/082 , A61B5/097 , G01N33/0047 , G01N33/497
摘要： The present embodiments disclose a device including a module for sampling, separating and enriching a detected object, an exhaled breath condensates (EBCs) detection module and a combined volatile organic compounds (VOCs) detection module. The sampling module is connected with the EBCs detection module via a syringe pump for sample injection and is connected with the combined VOCs detection module by a capillary separation column. EBCs and VOCs in human exhaled breath are simultaneously sampled, separated and condensed; the heavy metal ions, cell factors, etc. in the collected EBCs are detected with a light addressable potentiometric sensor (LAPS); the condensed VOCs can be quantitatively detected by the combined VOCs detection module with a high sensitivity; and a heating rod and a platinum resistor can be conveniently replaced because a separated outlet heating piece is designed in the combined VOCs detection module.
摘要翻译：本实施例公开了一种包括用于对检测到的物体进行取样，分离和富集的模块，呼出呼吸冷凝物（EBC）检测模块和组合的挥发性有机化合物（VOC））检测模块的装置。采样模块通过注射泵与EBC检测模块连接，用于注射样品，并通过毛细管分离柱与组合的VOC检测模块连接。人呼吸中的EBC和VOCs被同时取样，分离和浓缩; 用光寻址电位传感器（LAPS）检测收集的EBC中的重金属离子，细胞因子等; 可以通过组合的VOC检测模块以高灵敏度定量检测浓缩的VOC; 并且可以方便地更换加热棒和铂电阻器，因为在组合的VOC检测模块中设计了分离的出口加热片。

6. 发明申请

US20070220458A1 METHOD FOR DETECTING SEMICONDUCTOR MANUFACTURING CONDITIONS 有权
标题翻译：用于检测半导体制造条件的方法
公开(公告)号：US20070220458A1
公开(公告)日：2007-09-20
申请号：US11308343
申请日：2006-03-17
申请人： Wen-Zhan Zhou , Jin Yu , Kai-Hung Alex See
发明人： Wen-Zhan Zhou , Jin Yu , Kai-Hung Alex See
IPC分类号： G06F17/50
CPC分类号： G03F7/70625 , G03F7/70508 , H01L22/26 , H01L22/34
摘要： A method for detecting semiconductor-manufacturing conditions includes providing a photomask with a plurality of pattern areas each having a plurality of test lines with different pitches, exposing a plurality of wafer with the photomask in different manufacturing conditions, measuring the critical dimensions of the plurality of pattern areas, generating a library of relationships between the pitches and the critical dimension of the pattern areas, exposing a test wafer in an unknown manufacturing condition, finding out a relationships between the pitches and the critical dimension of the pattern areas of the test wafer, searching for a most similar relationship in the library, and detecting a set of manufacturing parameters used to expose the test wafer.
摘要翻译：一种用于检测半导体制造条件的方法包括提供具有多个图案区域的光掩模，每个图案区域具有多个具有不同间距的测试线，在不同制造条件下用光掩模曝光多个晶片，测量多个产生间距和图案区域的关键尺寸之间的关系库，使未知制造条件下的测试晶片暴露出来，找出测试晶片的图案区域的间距与临界尺寸之间的关系，在库中搜索最相似的关系，并且检测用于暴露测试晶片的一组制造参数。

7. 发明申请

US20070167110A1 MULTI-ZONE CARRIER HEAD FOR CHEMICAL MECHANICAL POLISHING AND CMP METHOD THEREOF 审中-公开
标题翻译：用于化学机械抛光的多区域载体头及其CMP方法
公开(公告)号：US20070167110A1
公开(公告)日：2007-07-19
申请号：US11306913
申请日：2006-01-16
申请人： Yu-Hsiang Tseng , Kai-Hung Alex See , Mei-Sheng Zhou , Jin Yu , Zheng Zou , Wen-Zhan Zhou
发明人： Yu-Hsiang Tseng , Kai-Hung Alex See , Mei-Sheng Zhou , Jin Yu , Zheng Zou , Wen-Zhan Zhou
IPC分类号： B24B51/00
CPC分类号： B24B37/30
摘要： A multi-zone carrier head includes a housing; a retaining ring secured to a lower edge of the housing; a backing plate having a plurality of non-concentric pressure zones defined by a plurality of isolated apertures on the backing plate; wherein the backing plate has a wafer side and a non-wafer side, the wafer side facing a backside of a wafer during a CMP operation; and a plurality of pneumatic bladder for independently controlling pressure exerted in the respective non-concentric pressure zones on the backside of the wafer during the CMP operation.
摘要翻译：多区域承载头包括壳体; 保持环固定到壳体的下边缘; 背板，其具有由背板上的多个隔离孔限定的多个非同心压力区; 其中所述背板具有晶片侧和非晶片侧，所述晶片侧在CMP操作期间面向晶片的背面; 以及多个气囊，用于在CMP操作期间独立地控制施加在晶片背面上的各个非同心压力区中的压力。

8. 发明申请

US20070158391A1 Method for joining electronic parts finished with nickel and electronic parts finished with electroless nickel 审中-公开
标题翻译：连接镍成品的电子零件和无电镀镍制成的电子零件的方法
公开(公告)号：US20070158391A1
公开(公告)日：2007-07-12
申请号：US11590249
申请日：2006-10-30
申请人： Yoon-Chul Son , Jong-Yeon Kim , Jin Yu
发明人： Yoon-Chul Son , Jong-Yeon Kim , Jin Yu
IPC分类号： A47J36/02
CPC分类号： H01L24/10 , B23K35/262 , H01L24/13 , H01L24/81 , H01L2224/13 , H01L2224/13139 , H01L2224/16 , H01L2224/81193 , H01L2224/8121 , H01L2224/81815 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01327 , H01L2924/014 , H05K3/244 , H05K3/3463 , H05K2203/072 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： The present invention relates, generally, to methods for joining an electronic part finished with nickel and an electronic part finished with electroless nickel, which can prevent a brittle fracture, more particularly, to a method for joining an electronic part finished with nickel and an electronic part finished with electroless nickel with a solder by controlling the composition of the solder to prevent a brittle fracture occurring at the solder joining portion.A method for joining an electronic part finished with nickel and an electronic part finished with electroless nickel, comprising: (1) reflowing solder to a nickel portion of an electronic part finished with nickel to obtain an electronic part where an intermetallic compound and a solder are formed; (2) obtaining an electronic part finished with an eletroless nickel, of which the nickel portion is connected with the solder; and (3) solder-joining an electronic part finished with nickel obtained in the step (1) and the electronic part finished with electroless nickel obtained in the step (2).
摘要翻译：本发明一般地涉及将镍完成的电子部件和能够防止脆性断裂的化学镀镍的电子部件接合的方法，更具体地说，涉及一种用镍和电子制成的电子部件的接合方法通过控制焊料的组成来防止在焊料接合部分发生脆性断裂，通过焊料完成无电镀镍。一种将镍完成的电子部件和用非电解镍完成的电子部件的接合方法，其特征在于，包括：（1）将焊料回流到镍完成的电子零件的镍部分，得到金属间化合物和焊料的电子部件形成（2）获得用无电镍完成的电子部件，其中镍部分与焊料连接; 和（3）将步骤（1）中得到的镍完成的电子部件与在步骤（2）中获得的化学镀镍的电子部件进行焊接接合。

9. 发明申请

US20070105023A1 RETICLE AND OPTICAL PROXIMITY CORRECTION METHOD 有权
标题翻译：反向和光学近似校正方法
公开(公告)号：US20070105023A1
公开(公告)日：2007-05-10
申请号：US11164127
申请日：2005-11-10
申请人： Wen-Zhan Zhou , Jin Yu , Kai-Hung Alex See
发明人： Wen-Zhan Zhou , Jin Yu , Kai-Hung Alex See
IPC分类号： G03F1/00
CPC分类号： G03F1/36 , G03F1/32 , G03F1/62
摘要： An OPC method includes providing a primary mask having a primary pattern, forming an assist mask having a correction pattern substantially complementary to the primary pattern, and forming a reticle by overlapping the primary mask and the assist mask. The light transmittance of the correction pattern is adjustable so as to equalize the light intensity distribution of the primary mask.
摘要翻译： OPC方法包括提供具有初级图案的初级掩模，形成具有与初级图案基本上互补的校正图案的辅助掩模，以及通过与初级掩模和辅助掩模重叠来形成掩模版。校正图案的透光率可调，以平衡初级掩模的光强分布。

10. 发明申请

US20060203647A1 Apparatus and method for improving deviation of optimum power calibration (OPC) 审中-公开
标题翻译：改善最佳功率校准（OPC）偏差的装置和方法
公开(公告)号：US20060203647A1
公开(公告)日：2006-09-14
申请号：US11358406
申请日：2006-02-22
申请人： Jin Yu , Tae-hoon Lee
发明人： Jin Yu , Tae-hoon Lee
IPC分类号： G11B7/12
CPC分类号： G11B7/1267 , G11B7/00736 , G11B20/182
摘要： A method of improving a problem of a deviation of an optimum recording optical power, which is capable of reducing deviation of OPC (Optical Power Calibration) power and shortening a Lead-in time by previously setting an area in which an OPC operation may be conducted and erasing the area with an erase power.
摘要翻译：一种改善最佳记录光功率偏差问题的方法，其能够通过预先设定可进行OPC操作的区域来减少OPC（光功率校准）功率的偏差和缩短导入时间并用擦除功能擦除该区域。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式