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1. 发明申请

US20120067636A1 INTERPOSER-EMBEDDED PRINTED CIRCUIT BOARD 有权
标题翻译：插入式嵌入式印刷电路板
公开(公告)号：US20120067636A1
公开(公告)日：2012-03-22
申请号：US13233851
申请日：2011-09-15
申请人： Jin Gu KIM , Mi Jin KIM , Young Ho KIM , Seung Wook PARK , Hee Kon LEE , Young Do KWEON
发明人： Jin Gu KIM , Mi Jin KIM , Young Ho KIM , Seung Wook PARK , Hee Kon LEE , Young Do KWEON
IPC分类号： H05K1/16 , H05K1/11
CPC分类号： H05K3/4694 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/15311 , H05K1/112 , H05K3/3436 , H05K2203/041 , H01L2224/0401
摘要： Disclosed herein is an interposer-embedded printed circuit board, including: a substrate including a cavity formed in one side thereof and having a predetermined height in a thickness direction of the substrate; an interposer disposed in the cavity and including a wiring region and an insulating region; and a circuit layer formed in the substrate and including a connection pattern connected with one side of the wiring region. The interposer-embedded printed circuit board is advantageous in that an interposer is embedded in a substrate, so that the thickness of a semiconductor package can be reduced, thereby keeping up with the trend of slimming the semiconductor package.
摘要翻译：本发明公开了一种嵌入式嵌入式印刷电路板，包括：基板，其具有在其一面形成并在基板的厚度方向上具有预定高度的空腔; 插入器，其设置在所述空腔中并且包括布线区域和绝缘区域; 以及形成在所述基板中并且包括与所述布线区域的一侧连接的连接图案的电路层。嵌入式嵌入式印刷电路板的优点在于，嵌入在衬底中，从而可以减小半导体封装的厚度，从而跟上半导体封装变窄的趋势。

2. 发明申请

US20120084977A1 METHOD OF MANUFACTURING BLOCK MODULE 审中-公开
标题翻译：制造块模块的方法
公开(公告)号：US20120084977A1
公开(公告)日：2012-04-12
申请号：US13268252
申请日：2011-10-07
申请人： Seung Wook PARK , Young Do KWEON , Ju Pyo HONG , Seung Wan SHIN , Kyung Seob OH
发明人： Seung Wook PARK , Young Do KWEON , Ju Pyo HONG , Seung Wan SHIN , Kyung Seob OH
IPC分类号： H05K3/30
CPC分类号： H05K3/284 , H01L23/49531 , H01L23/552 , H01L2224/16225 , H01L2924/09701 , H05K3/202 , H05K3/363 , H05K2201/0715 , H05K2201/10924 , H05K2203/1316 , Y10T29/4913
摘要： Disclosed herein is a method of manufacturing a block module including: mounting an electronic part on a base substrate on which a ground terminal is formed; forming a lead frame to extend to the outside of the base substrate from the ground terminal; connecting a flexible printed circuit to a circuit layer on the base substrate; forming a mold to surround the base substrate; cutting the lead frame and exposing the cut surface of the lead frame to the outside of the mold; and forming a metal coating layer connected to the lead frame on the mold, whereby the metal coating layer is formed to surround the mold to interrupt the electromagnetic waves and the metal coating layer is connected to the ground terminal by the lead frame to make the process simple.
摘要翻译：本文公开了一种制造块模块的方法，包括：将电子部件安装在其上形成有接地端子的基底基板上; 形成引线框架，从接地端子延伸到基底基板的外部; 将柔性印刷电路连接到基底基板上的电路层; 形成包围所述基底基板的模具; 切割引线框架并将引线框架的切割表面暴露于模具的外部; 并且形成与模具上的引线框架连接的金属涂层，由此形成金属涂层以围绕模具以中断电磁波，并且金属涂层通过引线框架连接到接地端子，以使该工艺简单。

3. 发明申请

US20120073870A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20120073870A1
公开(公告)日：2012-03-29
申请号：US13213984
申请日：2011-08-19
申请人： Hyung Jin JEON , Young Do KWEON , Seung Wook PARK , Seon Hee MOON
发明人： Hyung Jin JEON , Young Do KWEON , Seung Wook PARK , Seon Hee MOON
IPC分类号： H05K1/11 , H01K3/10
CPC分类号： H05K1/115 , H01L21/486 , H01L23/49827 , H01L2924/0002 , H05K1/0298 , H05K1/036 , H05K3/42 , H05K3/4602 , H05K3/4605 , H05K2201/0166 , H05K2201/0175 , H05K2201/09563 , H05K2201/10378 , H05K2203/0594 , Y10T29/49117 , Y10T29/49155 , Y10T29/49163 , Y10T29/49165 , H01L2924/00
摘要： Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member. A method of manufacturing the printed circuit board is also provided.
摘要翻译：公开了一种印刷电路板，包括基底构件，形成在基底构件的两个表面中的每一个上的绝缘层，使得基底构件的表面变平，形成在绝缘层上的电路层和用于连接的通孔所述电路层形成在所述基底构件的一个表面上，所述电路层形成在所述基底构件的另一个表面上。还提供了制造印刷电路板的方法。

4. 发明申请

US20120295404A1 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE 审中-公开
标题翻译：制造半导体封装的方法
公开(公告)号：US20120295404A1
公开(公告)日：2012-11-22
申请号：US13557362
申请日：2012-07-25
申请人： Joon Seok KANG , Young Do KWEON , Seung Wook PARK , Jong Yun LEE , Kyung Seob OH
发明人： Joon Seok KANG , Young Do KWEON , Seung Wook PARK , Jong Yun LEE , Kyung Seob OH
IPC分类号： H01L21/58
CPC分类号： H01L23/5389 , H01L23/49827 , H01L24/24 , H01L24/82 , H01L2224/0231 , H01L2224/24226 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K1/185 , H05K2201/10674 , H05K2203/1469 , H01L2924/00
摘要： A method of manufacturing a semiconductor package, the method including: forming an insulating layer on a board; forming an electrode pattern portion by redistribution plating in order to make a circuit connection on the insulating layer; manufacturing a semiconductor chip by forming a protecting portion on the electrode pattern portion such that a portion of the electrode pattern portion is exposed; and mounting the semiconductor chip on a receiving space of a circuit board and electrically connecting the semiconductor chip to the circuit board.
摘要翻译：一种制造半导体封装的方法，所述方法包括：在板上形成绝缘层; 通过再分布电镀形成电极图案部分，以在绝缘层上形成电路连接; 通过在所述电极图案部分上形成保护部分使得所述电极图案部分的一部分露出而制造半导体芯片; 并将半导体芯片安装在电路板的接收空间上并将半导体芯片电连接到电路板。

5. 发明申请

US20100086035A1 METHOD AND AN APPARATUS FOR PROCESSING A VIDEO SIGNAL 有权
标题翻译：用于处理视频信号的方法和装置
公开(公告)号：US20100086035A1
公开(公告)日：2010-04-08
申请号：US12574313
申请日：2009-10-06
申请人： Seung Wook PARK , Jung Sun KIM , Young Hee CHOI , Byeong Moon JEON , Joon Young PARK
发明人： Seung Wook PARK , Jung Sun KIM , Young Hee CHOI , Byeong Moon JEON , Joon Young PARK
IPC分类号： H04N7/32
CPC分类号： H04N19/51 , H04N19/107 , H04N19/11 , H04N19/172 , H04N19/176 , H04N19/18 , H04N19/44 , H04N19/61 , H04N19/86
摘要： The present invention relates to a video signal decoding method for adding an intra prediction mode as a sub-macroblock type to prediction of a macroblock in coding a video signal. The present invention includes obtaining a macroblock type, checking whether a macroblock includes a intra prediction coded sub-macroblock and a inter prediction coded sub-macroblock when a macroblock includes a plurality of coded sub-macroblocks according the macroblock type, when the macroblock includes the ultra prediction coded sub-macroblock and the inter prediction coded sub-macroblock, obtaining prediction mode flag information indicating whether the sub-macroblock is the intra prediction coded or the inter prediction coded, when the sub-macroblock is the intra prediction coded based on the prediction mode flag information, obtaining prediction direction information from a block adjacent to the sub-macroblock and a prediction value of the sub-macroblock based on the prediction direction information, and when the sub-macroblock is inter prediction coded based on the prediction mode flag information, obtaining motion information from the block adjacent to the sub-macroblock and a prediction value of the sub-macroblock based on the motion information. Accordingly, the present invention is able to raise coding efficiency of video signal by adding an intra prediction mode as a sub-macroblock in predicting a macroblock.
摘要翻译：本发明涉及用于将帧内预测模式作为子宏块类型添加到对编码视频信号的宏块进行预测的视频信号解码方法。本发明包括：当宏块包括宏块类型时，当宏块包括多个编码子宏块时，获得宏块类型，检查宏块是否包括帧内预测编码子宏块和帧间预测编码子宏块超预测编码子宏块和帧间预测编码子宏块，当子宏块是基于该预测编码的子宏块的帧内预测编码时，获得表示子宏块是帧内预测编码还是帧间预测编码的预测模式标志信息预测模式标志信息，从与子宏块相邻的块获得预测方向信息和基于预测方向信息的子宏块的预测值，以及当子宏块基于预测模式标志进行帧间预测编码时信息，从与子宏块相邻的块获得运动信息，以及a 基于运动信息的子宏块的预测值。因此，本发明能够通过在预测宏块中添加帧内预测模式作为子宏块来提高视频信号的编码效率。

6. 发明申请

US20100061456A1 Inter-Layer Prediction Method for Video Signal 有权
标题翻译：视频信号的层间预测方法
公开(公告)号：US20100061456A1
公开(公告)日：2010-03-11
申请号：US12087466
申请日：2007-01-09
申请人： Seung Wook PARK
发明人： Seung Wook PARK
IPC分类号： H04N7/32
CPC分类号： H04N19/103 , H04N19/105 , H04N19/159 , H04N19/16 , H04N19/176 , H04N19/187 , H04N19/33 , H04N19/513 , H04N19/59 , H04N19/86
摘要： The present invention relates to a method for conducting interlayer motion prediction in encoding or decoding of video signal. The present method identifies types of pictures on a base layer and a current layer or types of macro blocks included in the pictures, forms a block on a virtual layer by copying motion information of a macro block on the base layer if type of a picture on the current layer or a macro block included therein is identified to field and type of a picture on the base layer or a macro block included therein is identified to progressive, and uses the copied motion information of the block on the virtual layer in interlayer motion prediction for a macro block of the picture on the current layer.
摘要翻译：本发明涉及在视频信号的编码或解码中进行层间运动预测的方法。本方法识别基本层上的图像类型以及包含在图像中的当前层或宏块的类型，通过在基本层上复制宏块的运动信息，在虚拟层上形成块，如果图像的类型在将包含在其中的当前层或宏块识别为基本层上的图像的场和类型，或者其中包含的宏块被识别为渐进的，并且在层间运动预测中使用虚拟层上的块的复制运动信息用于当前图层的宏块。

7. 发明申请

US20130075144A1 PACKAGE SUBSTRATE WITH MESH PATTERN AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：具有网格图案的包装衬底及其制造方法
公开(公告)号：US20130075144A1
公开(公告)日：2013-03-28
申请号：US13606309
申请日：2012-09-07
申请人： Mi Jin PARK , Seung Wook PARK , Romero CHRISTIAN
发明人： Mi Jin PARK , Seung Wook PARK , Romero CHRISTIAN
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H01L23/49811 , H01L21/4853 , H01L23/145 , H01L23/49838 , H01L23/642 , H01L2924/0002 , H05K1/0224 , H05K1/162 , H05K2201/09681 , Y10T29/49155 , H01L2924/00
摘要： Disclosed herein are a package substrate and a method for manufacturing the same. According to an exemplary embodiment, there is provided a package substrate with a mesh pattern, including: a plurality of bonding pads forming sections connected with the outside; an insulating layer formed below the plurality of bonding pads; and a metallic layer placed below the insulating layer and having the mesh pattern in at least a partial area thereof and capacitance is provided by a combination of the mesh pattern and the insulating layer that infiltrates into a space for the mesh pattern. Further, there is provided a method for manufacturing the package substrate with the mesh pattern.
摘要翻译：本文公开了一种封装基板及其制造方法。根据一个示例性实施例，提供一种具有网状图案的封装基板，包括：形成与外部连接的部分的多个焊盘; 形成在所述多个接合焊盘下方的绝缘层; 以及金属层，其设置在绝缘层的下方并且在其至少部分区域中具有网状图案，并且通过网状图案和绝缘层的组合提供电容，所述网格图案和绝缘层的渗透入网格图案的空间中。此外，提供了一种用于制造具有网状图案的封装衬底的方法。

8. 发明申请

US20100111171A1 Method and apparatus for decoding/encoding a video signal 有权
公开(公告)号：US20100111171A1
公开(公告)日：2010-05-06
申请号：US12588448
申请日：2009-10-15
申请人： Han Suh KOO , Yeon Kwan KOO , Byeong Moon JEON , Seung Wook PARK , Yong Joon JEON
发明人： Han Suh KOO , Yeon Kwan KOO , Byeong Moon JEON , Seung Wook PARK , Yong Joon JEON
IPC分类号： H04N7/32
CPC分类号： H04N19/58 , H04N19/105 , H04N19/174 , H04N19/44 , H04N19/573 , H04N19/597 , H04N19/70
摘要： A method of decoding a video signal is disclosed. The present invention includes obtaining identification information indicating whether a coded picture of a current NAL unit is an inter-view picture group, obtaining interview reference information of the inter-view picture group, and constructing a reference picture list for inter-view prediction using the inter-view reference information according to the identification information, wherein the inter-view reference information includes view identification information of an inter-view reference picture.

9. 发明申请

US20100086052A1 METHOD AND AN APPARATUS FOR PROCESSING A VIDEO SIGNAL 有权
标题翻译：用于处理视频信号的方法和装置
公开(公告)号：US20100086052A1
公开(公告)日：2010-04-08
申请号：US12574415
申请日：2009-10-06
申请人： Seung Wook PARK , Jung Sun KIM , Young Hee CHOI , Byeong Moon JEON , Joon Young PARK
发明人： Seung Wook PARK , Jung Sun KIM , Young Hee CHOI , Byeong Moon JEON , Joon Young PARK
IPC分类号： H04N7/26
CPC分类号： H04N19/513 , H04N19/132 , H04N19/176 , H04N19/44 , H04N19/46 , H04N19/573 , H04N19/61 , H04N19/70
摘要： A method of processing a video signal is disclosed. The present invention includes obtaining a current macroblock type, obtaining skip or direct mode indication information on a partition of the current macroblock according to the current macroblock type, deriving a motion vector of the partition according to the skip or direct mode indication information, and predicting a pixel value of the partition using the motion vector. Accordingly, the present invention obtains a pixel value of a reference block close to an original video using a motion vector, thereby enhancing a reconstruction ratio of the macroblock. As a macroblock uses skip or direct prediction indication information, it is unnecessary to separately code skip mode indication information and direct mode indication information on the macroblock, whereby an information size to be coded can be reduced.
摘要翻译：公开了一种处理视频信号的方法。本发明包括获取当前宏块类型，根据当前宏块类型获得关于当前宏块的分区的跳过或直接模式指示信息，根据跳过或直接模式指示信息导出分区的运动矢量，并且预测使用运动矢量的分区的像素值。因此，本发明使用运动矢量来获得接近原始视频的参考块的像素值，从而提高宏块的重构率。由于宏块使用跳过或直接预测指示信息，因此不需要对宏块分别编码跳过模式指示信息和直接模式指示信息，从而可以减少要编码的信息大小。

10. 发明申请

US20100061454A1 METHOD OF PROCESSING A VIDEO SIGNAL 有权
标题翻译：处理视频信号的方法
公开(公告)号：US20100061454A1
公开(公告)日：2010-03-11
申请号：US12540208
申请日：2009-08-12
申请人： Seung Wook PARK , Jung Sun KIM , Young Hee CHOI , Byeong Moon JEON , Joon Young PARK
发明人： Seung Wook PARK , Jung Sun KIM , Young Hee CHOI , Byeong Moon JEON , Joon Young PARK
IPC分类号： H04N7/50
CPC分类号： H04N19/122 , H04N19/159 , H04N19/176 , H04N19/18 , H04N19/46 , H04N19/61
摘要： A method of processing a video signal is disclosed. The present invention includes obtaining a DC (discrete cosine) transform coefficient for a current macroblock and partition information of a DC (direct current) component block from a bitstream, obtaining transform size information of each partition of the DC component block based on the partition information of the DC component block, performing an inverse DC transform or a Hadamard transform based on the transform size information of the partition of the DC component block, performing inverse quantization on a result value from the transform and an AC (alternating current) component, and reconstructing a residual block by performing an inverse DC transform on a result value from the inverse quantization, wherein the residual block includes a block indicating a pixel value difference between an original picture and a predicted picture.
摘要翻译：公开了一种处理视频信号的方法。本发明包括从比特流获取当前宏块的DC（离散余弦）变换系数和DC（直流）分量块的分区信息，基于分区信息获得DC分量块的每个分区的变换大小信息根据直流分量块的分割的变换大小信息进行逆DC变换或Hadamard变换，对来自变换的结果值和AC（交流）分量进行逆量化，以及通过对来自反量化的结果值执行逆DC变换来重构残差块，其中残差块包括表示原始图像与预测图像之间的像素值差的块。

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