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    • 1. 发明授权
    • Flash EEPROM array with floating substrate erase operation
    • 闪存EEPROM阵列具有浮动衬底擦除操作
    • US5598369A
    • 1997-01-28
    • US484252
    • 1995-06-07
    • Jian ChenNader Radjy
    • Jian ChenNader Radjy
    • G11C17/00G11C16/04G11C16/14H01L27/115
    • G11C16/14H01L27/115
    • A flash EEPROM cell array is erased by applying a relatively high positive voltage to the source region of the cell and a ground potential to the control gate of the cell while allowing the voltage of the drain region and the substrate region of the cell to float. By floating the substrate, the source current during erase is greatly reduced since the only DC current path is between the control gate and the source region. Since the source current is small, a double-diffused junction is not required so that the cell can occupy a minimum area for a given design rule and the cell fabrication process is simplified. In addition, the generation of high energy holes is suppressed and improved performance may be obtained. Because the source current is small during the erase operation, the high positive voltage at the source region can be generated by an on chip charge pump from a supply voltage as low as +3 V. This simplifies the design of memory boards on which many flash EEPROM chips are to be placed. Moreover, the after erase Vt distribution of the memory cell is tightened since a relatively high positive voltage is applied to the source region during erasure. Finally, there is no issue of yield sensitivity to defects in the channel, since during the erasure operation, electrons trapped in the floating gate pass through the overlap region between the source region and the control gate, instead of through the channel.
    • 通过向单元的源极区域施加相对高的正电压,并且使单元的漏极区域和衬底区域的电压浮动,从而将电池的接地电位施加到电池的控制栅极,擦除快闪EEPROM单元阵列。 通过浮置衬底,由于唯一的直流电流路径在控制栅极和源极区域之间,擦除期间的源电流大大降低。 由于源极电流很小,所以不需要双扩散结,使得电池可以占用给定设计规则的最小面积,并且简化了电池制造工艺。 此外,抑制了高能量孔的产生,并且可以获得改善的性能。 由于在擦除操作期间源极电流较小,源极区域的高正电压可以通过片上电荷泵从低至+3V的电源电压产生。这简化了许多闪存的存储器板的设计 EEPROM芯片将被放置。 此外,由于在擦除期间将相对较高的正电压施加到源极区域,所以存储单元的后擦除Vt分布被紧固。 最后,由于在擦除操作期间,捕获在浮置栅极中的电子通过源极区域和控制栅极之间的重叠区域而不是通过沟道,所以对通道中的缺陷的产量灵敏度没有任何问题。
    • 2. 发明授权
    • Flash EEPROM array with floating substrate erase operation
    • 闪存EEPROM阵列具有浮动衬底擦除操作
    • US5561620A
    • 1996-10-01
    • US508425
    • 1995-07-31
    • Jian ChenNader Radjy
    • Jian ChenNader Radjy
    • G11C17/00G11C16/04G11C16/14H01L27/115G11C7/00
    • G11C16/14H01L27/115
    • A flash EEPROM cell array is erased by applying a relatively high positive voltage to the source region of the cell and a ground potential to the control gate of the cell while allowing the voltage of the drain region and the substrate region of the cell to float. By floating the substrate, the source current during erase is greatly reduced since the only DC current path is between the control gate and the source region. Since the source current is small, a double-diffused junction is not required so that the cell can occupy a minimum area for a given design rule and the cell fabrication process is simplified. In addition, the generation of high energy holes is suppressed and improved performance may be obtained. Because the source current is small during the erase operation, the high positive voltage at the source region can be generated by an on chip charge pump from a supply voltage as low as +3 V. This simplifies the design of memory boards on which many flash EEPROM chips are to be placed. Moreover, the after erase Vt distribution of the memory cell is tightened since a relatively high positive voltage is applied to the source region during erasure. Finally, there is no issue of yield sensitivity to defects in the channel, since during the erasure operation, electrons trapped in the floating gate pass through the overlap region between the source region and the control gate, instead of through the channel.
    • 通过向单元的源极区域施加相对高的正电压,并且使单元的漏极区域和衬底区域的电压浮动,从而将电池的接地电位施加到电池的控制栅极,擦除快闪EEPROM单元阵列。 通过浮置衬底,由于唯一的直流电流路径在控制栅极和源极区域之间,擦除期间的源电流大大降低。 由于源极电流很小,所以不需要双扩散结,使得电池可以占用给定设计规则的最小面积,并且简化了电池制造工艺。 此外,抑制了高能量孔的产生,并且可以获得改善的性能。 由于在擦除操作期间源极电流较小,源极区域的高正电压可以通过片上电荷泵从低至+3V的电源电压产生。这简化了许多闪存的存储器板的设计 EEPROM芯片将被放置。 此外,由于在擦除期间将相对较高的正电压施加到源极区域,所以存储单元的后擦除Vt分布被紧固。 最后,由于在擦除操作期间,捕获在浮置栅极中的电子通过源极区域和控制栅极之间的重叠区域而不是通过沟道,所以对通道中的缺陷的产量灵敏度没有任何问题。