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1. 发明授权

US07390725B2 Strained silicon on insulator from film transfer and relaxation by hydrogen implantation 有权
标题翻译：绝缘体上的应变硅通过氢注入从膜转移和弛豫
公开(公告)号：US07390725B2
公开(公告)日：2008-06-24
申请号：US11284326
申请日：2005-11-21
申请人： Jer-shen Maa , Jong-Jan Lee , Douglas J. Tweet , David R. Evans , Allen W. Burmaster , Sheng Teng Hsu
发明人： Jer-shen Maa , Jong-Jan Lee , Douglas J. Tweet , David R. Evans , Allen W. Burmaster , Sheng Teng Hsu
IPC分类号： H01L21/46 , H01L21/30
CPC分类号： H01L21/76254
摘要： Transistors fabricated on SSOI (Strained Silicon On Insulator) substrate, which comprises a strained silicon layer disposed directly on an insulator layer, have enhanced device performance due to the strain-induced band modification of the strained silicon device channel and the limited silicon volume because of the insulator layer. The present invention discloses SSOI substrate fabrication processes comprising various novel approaches. One is the use of a thin relaxed SiGe layer as the strain-induced seed layer to facilitate integration and reduce processing cost. Another is the formation of split implant microcracks deep in the silicon substrate to reduce the number of threading dislocations reaching the strained silicon layer. And lastly is a two step annealing/thinning process for the strained silicon/SiGe multilayer film transfer without blister or flaking formation.
摘要翻译：包含直接设置在绝缘体层上的应变硅层的SSOI（应变绝缘体硅）基板上制造的晶体管由于应变诱导的应变硅器件通道的带隙修改而增加了器件性能，并且由于绝缘体层。本发明公开了包含各种新颖方法的SSOI衬底制造工艺。一个是使用薄的松弛SiGe层作为应变诱导的种子层，以促进整合并降低加工成本。另一个是在硅衬底深部形成分裂的植入物微裂纹，以减少到达应变硅层的穿透位错的数量。最后是对应变硅/ SiGe多层膜转移进行两步退火/变薄处理，无需起泡或剥落形成。

2. 发明授权

US06992025B2 Strained silicon on insulator from film transfer and relaxation by hydrogen implantation 有权
标题翻译：绝缘体上的应变硅通过氢注入从膜转移和弛豫
公开(公告)号：US06992025B2
公开(公告)日：2006-01-31
申请号：US10755615
申请日：2004-01-12
申请人： Jer-shen Maa , Jong-Jan Lee , Douglas J. Tweet , David R. Evans , Allen W. Burmaster , Sheng Teng Hsu
发明人： Jer-shen Maa , Jong-Jan Lee , Douglas J. Tweet , David R. Evans , Allen W. Burmaster , Sheng Teng Hsu
IPC分类号： H01L21/26 , H01L21/42 , H01L21/324
CPC分类号： H01L21/76254
摘要： Transistors fabricated on SSOI (Strained Silicon On Insulator) substrate, which comprises a strained silicon layer disposed directly on an insulator layer, have enhanced device performance due to the strain-induced band modification of the strained silicon device channel and the limited silicon volume because of the insulator layer. The present invention discloses a SSOI substrate fabrication process comprising various novel approaches. One is the use of a thin relaxed SiGe layer as the strain-induced seed layer to facilitate integration and reduce processing cost. Another is the formation of split implant microcracks deep in the silicon substrate to reduce the number of threading dislocations reaching the strained silicon layer. And lastly is the two step annealing/thinning process for the strained silicon/SiGe multilayer film transfer without blister or flaking formation.
摘要翻译：包含直接设置在绝缘体层上的应变硅层的SSOI（应变绝缘体硅）基板上制造的晶体管由于应变诱导的应变硅器件通道的带隙修改而增加了器件性能，并且由于绝缘体层。本发明公开了一种包含各种新颖方法的SSOI衬底制造工艺。一个是使用薄的松弛SiGe层作为应变诱导的种子层，以促进整合并降低加工成本。另一个是在硅衬底深部形成分裂的植入物微裂纹，以减少到达应变硅层的穿透位错的数量。最后是对应变硅/ SiGe多层膜转移的两步退火/变薄处理，没有起泡或剥落形成。

3. 发明授权

US07361574B1 Single-crystal silicon-on-glass from film transfer 有权
标题翻译：单晶硅玻璃从膜转移
公开(公告)号：US07361574B1
公开(公告)日：2008-04-22
申请号：US11601173
申请日：2006-11-17
申请人： Jer-Shen Maa , David R. Evans , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
发明人： Jer-Shen Maa , David R. Evans , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
IPC分类号： H01L21/30 , H01L21/461
CPC分类号： H01L21/76251 , H01L21/84 , Y10S438/926 , Y10S438/933
摘要： A method is provided for transferring a single-crystal silicon (Si) film to a glass substrate. The method deposits a germanium (Ge)-containing material overlying a Si wafer, forming a sacrificial Ge-containing film. A single-crystal Si film is formed overlying the sacrificial Ge-containing film. The Si film surface is bonded to a transparent substrate, forming a bonded substrate. The bonded substrate is immersed in a Ge etching solution to remove the sacrificial Ge-containing film, which separates the transparent substrate from the Si wafer. The result is a transparent substrate with an overlying single crystal Si film. Optionally, channels can be formed to distribute the Ge etching solution, and promote the removal of the Ge-containing film.
摘要翻译：提供了将单晶硅（Si）膜转印到玻璃基板上的方法。该方法沉积覆盖Si晶片的含锗（Ge）的材料，形成牺牲含Ge膜。形成覆盖牺牲的含Ge膜的单晶Si膜。将Si膜表面粘合到透明基板上，形成键合衬底。将键合衬底浸入Ge蚀刻溶液中以除去将透明衬底与Si晶片分离的牺牲Ge含量膜。结果是具有上覆单晶Si膜的透明衬底。可选地，可以形成通道以分布Ge蚀刻溶液，并促进除去含Ge膜。

4. 发明授权

US07675056B2 Germanium phototransistor with floating body 有权
标题翻译：具有浮体的锗光电晶体管
公开(公告)号：US07675056B2
公开(公告)日：2010-03-09
申请号：US11891574
申请日：2007-08-10
申请人： Jong-Jan Lee , Sheng Teng Hsu , Jer-Shen Maa , Douglas J. Tweet
发明人： Jong-Jan Lee , Sheng Teng Hsu , Jer-Shen Maa , Douglas J. Tweet
IPC分类号： H01L29/06 , H01L31/072 , H01L31/109 , H01L31/0328 , H01L31/062 , H01L31/113 , H01L31/0232
CPC分类号： H01L31/1136 , H01L31/028 , H01L31/1808 , Y02E10/547
摘要： A floating body germanium (Ge) phototransistor and associated fabrication process are presented. The method includes: providing a silicon (Si) substrate; selectively forming an insulator layer overlying the Si substrate; forming an epitaxial Ge layer overlying the insulator layer using a liquid phase epitaxy (LPE) process; forming a channel region in the Ge layer; forming a gate dielectric, gate electrode, and gate spacers overlying the channel region; and, forming source/drain regions in the Ge layer. The LPE process involves encapsulating the Ge with materials having a melting temperature greater than a first temperature, and melting the Ge using a temperature lower than the first temperature. The LPE process includes: forming a dielectric layer overlying deposited Ge; melting the Ge; and, in response to cooling the Ge, laterally propagating an epitaxial growth front into the Ge from an underlying Si substrate surface.
摘要翻译：提出了一种浮体锗（Ge）光电晶体管及其制造工艺。该方法包括：提供硅（Si）衬底; 选择性地形成覆盖Si衬底的绝缘体层; 使用液相外延（LPE）工艺形成覆盖绝缘体层的外延Ge层; 在Ge层中形成沟道区; 形成覆盖所述沟道区的栅极电介质，栅电极和栅极间隔; 并且在Ge层中形成源/漏区。 LPE工艺包括用具有大于第一温度的熔化温度的材料包封Ge，并且使用低于第一温度的温度来熔化Ge。 LPE工艺包括：形成覆盖沉积Ge的介电层; 融化Ge; 并且响应于冷却Ge，将外延生长前沿从下面的Si衬底表面横向传播到Ge中。

5. 发明授权

US07351995B2 Floating body germanium phototransistor having a photo absorption threshold bias region 有权
标题翻译：具有光吸收阈值偏置区域的浮体锗光电晶体管
公开(公告)号：US07351995B2
公开(公告)日：2008-04-01
申请号：US11894938
申请日：2007-08-22
申请人： Sheng Teng Hsu , Jong-Jan Lee , Jer-Shen Maa , Douglas J. Tweet
发明人： Sheng Teng Hsu , Jong-Jan Lee , Jer-Shen Maa , Douglas J. Tweet
IPC分类号： H01L29/06 , H01L31/072 , H01L31/109 , H01L31/0328 , H01L31/062 , H01L31/113 , H01L31/0232
CPC分类号： H01L31/1136
摘要： A floating body germanium (Ge) phototransistor with a photo absorption threshold bias region, and an associated fabrication process are presented. The method includes: providing a p-doped Silicon (Si) substrate; selectively forming an insulator layer overlying a first surface of the Si substrate; forming an epitaxial Ge layer overlying the insulator layer; forming a channel region in the Ge layer; forming a gate dielectric, gate electrode, and gate spacers; forming source/drain (S/D) regions in the Ge layer; and, forming a photo absorption threshold bias region in the Ge layer, adjacent the channel region. In one aspect, the second S/D region has a length, longer than the first S/D length. The photo absorption threshold bias region underlies the second S/D region. Alternately, the second S/D region is separated from the channel by an offset, and the photo absorption threshold bias region is the offset in the Ge layer, after a light p-doping.
摘要翻译：提出了具有光吸收阈值偏置区域的浮体锗（Ge）光电晶体管，以及相关的制造工艺。该方法包括：提供p掺杂硅（Si）衬底; 选择性地形成覆盖在所述Si衬底的第一表面上的绝缘体层; 形成覆盖绝缘体层的外延Ge层; 在Ge层中形成沟道区; 形成栅极电介质，栅电极和栅极间隔物; 在Ge层中形成源极/漏极（S / D）区域; 并且在Ge层中形成邻近沟道区的光吸收阈值偏置区域。在一个方面，第二S / D区域具有比第一S / D长度更长的长度。光吸收阈值偏置区域位于第二S / D区域的下方。或者，第二S / D区域与沟道分离偏移，光吸收阈值偏置区域是在光p掺杂之后的Ge层中的偏移。

6. 发明授权

US06562703B1 Molecular hydrogen implantation method for forming a relaxed silicon germanium layer with high germanium content 失效
标题翻译：用于形成具有高锗含量的松弛硅锗层的分子氢注入方法
公开(公告)号：US06562703B1
公开(公告)日：2003-05-13
申请号：US10099374
申请日：2002-03-13
申请人： Jer-Shen Maa , Douglas J. Tweet , Sheng Teng Hsu , Jong-Jan Lee
发明人： Jer-Shen Maa , Douglas J. Tweet , Sheng Teng Hsu , Jong-Jan Lee
IPC分类号： H01L21265
CPC分类号： H01L21/263 , H01L21/02381 , H01L21/0245 , H01L21/02502 , H01L21/0251 , H01L21/02532 , H01L21/02694 , H01L29/1054 , Y10S438/933
摘要： A method is provided for forming a relaxed silicon germanium layer with a high germanium content on a silicon substrate. The method comprises: depositing a single-crystal silicon (Si) buffer layer overlying the silicon substrate; depositing a layer of single-crystal silicon germanium (Si1−xGex) overlying the Si buffer layer having a thickness of 1000 to 5000 Å; implanting the Si1−xGex layer with ionized molecular hydrogen (H2+) a projected range of approximately 100 to 300 Å into the underlying Si buffer layer; optionally, implanting the Si1−xGex layer with a species selected such as boron, He, or Si; annealing; and, in response to the annealing, converting the Si1−xGex layer to a relaxed Si1−xGex layer. Optionally, after annealing, an additional layer of single-crystal Si1−xGex having a thickness of greater than 1000 Å can be deposited overlying the relaxed layer of Si1−xGex.
摘要翻译：提供了一种在硅衬底上形成具有高锗含量的松弛硅锗层的方法。该方法包括：沉积覆盖硅衬底的单晶硅（Si）缓冲层; 沉积覆盖厚度为1000至5000的Si缓冲层的单晶硅锗层（Si1-xGex）; 将具有离子化分子氢（H 2 +）的Si 1-x Ge x层投射到下面的Si缓冲层中约100至300埃的投影范围; 任选地，将Si1-xGex层用诸如硼，氦或硅的物质进行注入; 退火; 并且响应于退火，将Si1-xGex层转化为弛豫的Si1-xGex层。任选地，在退火之后，可以沉积厚度大于的附加层的单晶Si1-xGex覆盖在Si1-xGex的松弛层上。

7. 发明授权

US07811913B2 Method of fabricating a low, dark-current germanium-on-silicon pin photo detector 有权
标题翻译：制造低，暗电流硅 - 硅引脚光电探测器的方法
公开(公告)号：US07811913B2
公开(公告)日：2010-10-12
申请号：US11312967
申请日：2005-12-19
申请人： Jong-Jan Lee , Douglas J. Tweet , Jer-Shen Maa , Sheng Teng Hsu
发明人： Jong-Jan Lee , Douglas J. Tweet , Jer-Shen Maa , Sheng Teng Hsu
IPC分类号： H01L21/265
CPC分类号： H01L31/105 , H01L31/1808 , H01L31/1864 , Y02E10/50 , Y02P70/521 , Y10S438/933
摘要： A method of fabricating a low, dark-current germanium-on-silicon PIN photo detector includes preparing a P-type silicon wafer; implanting the P-type silicon wafer with boron ions; activating the boron ions to form a P+ region on the silicon wafer; forming a boron-doped germanium layer on the P+ silicon surface; depositing an intrinsic germanium layer on the boron-doped germanium layer; cyclic annealing, including a relatively high temperature first anneal step and a relatively low temperature second anneal step; repeating the first and second anneal steps for about twenty cycles, thereby forcing crystal defects to the P+ germanium layer; implanting ions in the surface of germanium layer to form an N+ germanium surface layer and a PIN diode; activating the N+ germanium surface layer by thermal anneal; and completing device according to known techniques to form a low dark-current germanium-on-silicon PIN photodetector.
摘要翻译：制造低，暗电流锗硅PIN光检测器的方法包括制备P型硅晶片; 用硼离子注入P型硅晶片; 激活硼离子以在硅晶片上形成P +区; 在P +硅表面上形成硼掺杂锗层; 在硼掺杂的锗层上沉积本征锗层; 循环退火，包括相对高温的第一退火步骤和相对低温的第二退火步骤; 重复第一和第二退火步骤约20个循环，由此迫使晶体缺陷到P +锗层; 在锗层表面注入离子以形成N +锗表面层和PIN二极管; 通过热退火来活化N +锗表面层; 并根据已知技术完成器件以形成低暗电流锗硅PIN光电探测器。

8. 发明授权

US07651880B2 Ge short wavelength infrared imager 有权
标题翻译： Ge短波长红外成像仪
公开(公告)号：US07651880B2
公开(公告)日：2010-01-26
申请号：US11592465
申请日：2006-11-04
申请人： Douglas J. Tweet , Jer-Shen Maa , Jong-Jan Lee , Sheng Teng Hsu
发明人： Douglas J. Tweet , Jer-Shen Maa , Jong-Jan Lee , Sheng Teng Hsu
IPC分类号： H01L25/00
CPC分类号： H01L31/1055 , H01L27/14643 , H01L27/14689
摘要： A germanium (Ge) short wavelength infrared (SWIR) imager and associated fabrication process are provided. The imager comprises a silicon (Si) substrate with doped wells. An array of pin diodes is formed in a relaxed Ge-containing film overlying the Si substrate, each pin diode having a flip-chip interface. There is a Ge/Si interface, and a doped Ge-containing buffer interposed between the Ge-containing film and the Ge/Si interface. An array of Si CMOS readout circuits is bonded to the flip-chip interfaces. Each readout circuit has a zero volt diode bias interface.
摘要翻译：提供锗（Ge）短波长红外（SWIR）成像器和相关制造工艺。该成像器包括具有掺杂阱的硅（Si）衬底。在位于Si衬底上的松弛的含Ge膜中形成一个pin二极管阵列，每个pin二极管具有倒装芯片接口。存在Ge / Si界面和插入含Ge膜和Ge / Si界面之间的含掺杂Ge的缓冲层。 Si CMOS读出电路阵列结合到倒装芯片接口。每个读出电路都具有零伏二极管偏置接口。

9. 发明申请

US20090173933A1 Thermal Sensor with a Silicon/Germanium Superlattice Structure 有权
标题翻译：具有硅/锗超晶格结构的热传感器
公开(公告)号：US20090173933A1
公开(公告)日：2009-07-09
申请号：US12236480
申请日：2008-09-23
申请人： Jer-Shen Maa , Jinke Tang , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
发明人： Jer-Shen Maa , Jinke Tang , Jong-Jan Lee , Douglas J. Tweet , Sheng Teng Hsu
IPC分类号： H01L29/15
CPC分类号： H01L31/035254 , B82Y20/00 , H01L27/14649 , H01L31/028 , H01L31/101 , H01L31/1804 , Y02P70/521
摘要： A silicon/germanium (SiGe) superlattice thermal sensor is provided with a corresponding fabrication method. The method forms an active CMOS device in a first Si substrate, and a SiGe superlattice structure on a second Si-on-insulator (SOI) substrate. The first substrate is bonded to the second substrate, forming a bonded substrate. An electrical connection is formed between the SiGe superlattice structure and the CMOS device, and a cavity is formed between the SiGe superlattice structure and the bonded substrate.
摘要翻译：硅/锗（SiGe）超晶格热传感器具有相应的制造方法。该方法在第一Si衬底中形成有源CMOS器件，并在第二绝缘体上（SOI）衬底上形成SiGe超晶格结构。第一基板与第二基板接合，形成接合基板。在SiGe超晶格结构和CMOS器件之间形成电连接，并且在SiGe超晶格结构和键合衬底之间形成空穴。

10. 发明授权

US07470573B2 Method of making CMOS devices on strained silicon on glass 失效
标题翻译：在玻璃上的应变硅上制造CMOS器件的方法
公开(公告)号：US07470573B2
公开(公告)日：2008-12-30
申请号：US11060878
申请日：2005-02-18
申请人： Jong-Jan Lee , Jer-Shen Maa , Douglas J. Tweet , Yoshi Ono , Sheng Teng Hsu
发明人： Jong-Jan Lee , Jer-Shen Maa , Douglas J. Tweet , Yoshi Ono , Sheng Teng Hsu
IPC分类号： H01L21/30 , H01L21/84
CPC分类号： H01L27/127 , H01L27/1214 , H01L27/1266 , H01L29/7842 , H01L29/78621
摘要： A method of making CMOS devices on strained silicon on glass includes preparing a glass substrate, including forming a strained silicon layer on the glass substrate; forming a silicon oxide layer by plasma oxidation of the strained silicon layer; depositing a layer of doped polysilicon on the silicon oxide layer; forming a polysilicon gate; implanting ions to form a LDD structure; depositing and forming a spacer dielectric on the gate structure; implanting and activation ions to form source and drain structures; depositing a layer of metal film; annealing the layer of metal film to form salicide on the source, drain and gate structures; removing any unreacted metal film; depositing a layer of interlayer dielectric; and forming contact holes and metallizing.
摘要翻译：在玻璃上的应变硅上制造CMOS器件的方法包括制备玻璃衬底，包括在玻璃衬底上形成应变硅层; 通过应变硅层的等离子体氧化形成氧化硅层; 在氧化硅层上沉积掺杂多晶硅层; 形成多晶硅栅极; 注入离子以形成LDD结构; 在栅极结构上沉积和形成间隔电介质; 植入和激活离子以形成源和漏结构; 沉积一层金属膜; 退火金属膜层，在源极，漏极和栅极结构上形成硅化物; 去除任何未反应的金属膜; 沉积层间电介质层; 并形成接触孔和金属化。

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