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    • 3. 发明授权
    • Cleaning agent composition for a positive or a negative photoresist
    • 用于正性或负性光致抗蚀剂的清洁剂组合物
    • US07172996B2
    • 2007-02-06
    • US10500752
    • 2003-01-09
    • Sae-Tae OhDoek-Man KangKyung-Soo Choi
    • Sae-Tae OhDoek-Man KangKyung-Soo Choi
    • C11D7/50
    • C11D7/264C11D3/3707C11D7/263C11D7/3263C11D7/3281C11D11/0047G03F7/168
    • The present invention relates to a composition for cleaning a photoresist and is to provide a cleaning composition wherein the residue of the photoresist does not remain on the boundary surface between the cleaned area and the not-cleaned area after a negative photoresist containing pigment is cleaned, soft-baked, exposed and developed. The present invention provides a composition for cleaning a positive or negative photoresist which comprises (a) from 0.1 to 20 wt. % of and alkyl oxide polymer with a molecular weight of from 50 to 2000 and (b) from 80 to 99.9 wt. % of an organic solvent comprising: (b−1) from 1 to 20 parts by weight of dipropylene glycol methyl ether (DPGME), from 10 to 50 parts by weight of N-methyl pyrolidone (NMP) and from 50 to 90 parts by weight of methyl isobutyl ketone (MIBK), or (b−2) from 10 to 90 parts by weight of dimethyl formaldehyde (DMF) or dimethylacetamide (DMAc) and from 10 to 50 parts by weight of n-butyl acetate.
    • 本发明涉及一种用于清洁光致抗蚀剂的组合物,并且提供一种清洁组合物,其中在清洁含有负性光致抗蚀剂的颜料之后,光致抗蚀剂的残留物不残留在清洁区域和未清洁区域之间的边界表面上, 软烤,暴露和发达。 本发明提供一种用于清洗正性或负性光致抗蚀剂的组合物,其包含(a)0.1-20wt。 %和分子量为50至2000的烷基氧化物聚合物和(b)80至99.9重量% %的有机溶剂含有:(b-1)1〜20重量份二丙二醇甲基醚(DPGME),10〜50重量份N-甲基吡咯烷酮(NMP)和50〜90重量份 甲基异丁基酮(MIBK)的重量,或(b-2)10至90重量份的二甲基甲醛(DMF)或二甲基乙酰胺(DMAc)和10至50重量份的乙酸正丁酯。
    • 4. 发明申请
    • Cleaning agent composition for a positive or a negative photoresist
    • 用于正性或负性光致抗蚀剂的清洁剂组合物
    • US20050119142A1
    • 2005-06-02
    • US10500752
    • 2003-01-09
    • Sae-Tae OhDoek-Man KangKyung-Soo Choi
    • Sae-Tae OhDoek-Man KangKyung-Soo Choi
    • C11D3/37C11D7/26C11D7/32C11D11/00G03F7/16G03F7/42H01L21/027H01L21/304C11D1/00
    • C11D7/264C11D3/3707C11D7/263C11D7/3263C11D7/3281C11D11/0047G03F7/168
    • The present invention relates to a composition for cleaning a photoresist and is to provide a cleaning composition wherein the residue of the photoresist does not remain on the boundary surface between the cleaned area and the not-cleaned area after a negative photoresist containing pigment is cleaned, soft-baked, exposed and developed. The present invention provides a composition for cleaning a positive or negative photoresist which comprises (a) from 0.1 to 20 wt. % of and alkyl oxide polymer with a molecular weight of from 50 to 2000 and (b) from 80 to 99.9 wt. % of an organic solvent comprising: (b−1) from 1 to 20 parts by weight of dipropylene glycol methyl ether (DPGME), from 10 to 50 parts by weight of N-methyl pyrolidone (NMP) and from 50 to 90 parts by weight of methyl isobutyl ketone (MIBK), or (b−2) from 10 to 90 parts by weight of dimethyl formaldehyde (DMF) or dimethylacetamide (DMAc) and from 10 to 50 parts by weight of n-butyl acetate.
    • 本发明涉及一种用于清洁光致抗蚀剂的组合物,并且提供一种清洁组合物,其中在清洁含有负性光致抗蚀剂的颜料之后,光致抗蚀剂的残留物不残留在清洁区域和未清洁区域之间的边界表面上, 软烤,暴露和发达。 本发明提供一种用于清洗正性或负性光致抗蚀剂的组合物,其包含(a)0.1-20wt。 %和分子量为50至2000的烷基氧化物聚合物和(b)80至99.9重量% %的有机溶剂含有:(b-1)1〜20重量份二丙二醇甲基醚(DPGME),10〜50重量份N-甲基吡咯烷酮(NMP)和50〜90重量份 甲基异丁基酮(MIBK)的重量,或(b-2)10至90重量份的二甲基甲醛(DMF)或二甲基乙酰胺(DMAc)和10至50重量份的乙酸正丁酯。
    • 6. 发明申请
    • Resist composition and organic solvent for removing resist
    • 抗蚀剂组合物和去除抗蚀剂的有机溶剂
    • US20060263714A1
    • 2006-11-23
    • US10551215
    • 2004-04-23
    • Doek-Man Kang
    • Doek-Man Kang
    • G03C1/00
    • G03F7/0226G03F7/0048
    • The present invention provides a resist composition comprising benzyl alcohol or its derivatives as an organic solvent. The present invention also provides an organic solvent for removing a resist, wherein the organic solvent comprises benzyl alcohol or its derivatives. The resist composition of the present invention is used in a lithography process for forming a micro-pattern using a difference in the solubility between the irradiated part and the non-irradiated part by irradiation with UV rays to greatly improve the uniformity of the film thickness upon coating of the thin film. In addition, the organic solvent according to the present invention can be used to wash the device, which comes into contact with the photosensitive material in the course of the microcircuit forming process, by removing the photosensitive material from the device. It also can remove the photosensitive material remaining on the undesired parts of the substrate on which the photosensitive material is coated.
    • 本发明提供了含有苄醇或其衍生物作为有机溶剂的抗蚀剂组合物。 本发明还提供了用于除去抗蚀剂的有机溶剂,其中有机溶剂包括苄醇或其衍生物。 本发明的抗蚀剂组合物用于通过用紫外线照射照射部分和未照射部分之间的溶解度差异形成微图案的光刻工艺,以大大提高膜厚度的均匀性 薄膜的涂层。 此外,根据本发明的有机溶剂可以用于在微电路形成过程中与感光材料接触的装置,通过从装置中除去感光材料来洗涤该装置。 它还可以除去留在感光材料被涂覆的基材的不需要部分上的感光材料。